Overview
Founded in 1980, HANMI Semiconductor is a global semiconductor equipment company serving approximately 340 customers worldwide.
We currently hold the No.1 global market share in the TC BONDER market for HBM, a core component of AI semiconductors, and have also maintained the No.1 global position in micro SAW & VISION PLACEMENT(mSVP), which are essential back-end semiconductor equipment.
[Product Line-up]
1. HBM TC BONDER
: TC BONDER 4.5 GRIFFIN / TC BONDER 4.0 TIGER / TC BONDER 1.0 GRIFFIN SB / TC BONDER 1.0 TIGER / HBM 6-SIDE INSPECTION 1.0
2. 2.5D TC BONDER
: 2.5D TC BONDER 120 / 2.5D TC BONDER 40 C2S / 2.5D TC BONDER 40 C2W / BOC COB BONDER
3. FC BONDER
: FC BONDER 3.5 / FC BONDER 3.0 / FC BONDER 5.0 / FC BONDER 75
4. micro SAW
: micro SAW W1121a / micro SAW T2101 / micro SAW T1121 / micro SAW P2101 / micro SAW PL1121 / micro SAW PL1201 / micro SAW PL1241 / micro SAW GL2101
5. VISION PLACEMENT
: VISION PLACEMENT 6.0 GRIFFIN / VISION PLACEMENT 6.0D / VISION PLACEMENT 6.0L / VISION PLACEMENT 6.0T FAST / VISION PLACEMENT 8.0PS / VISION PLACEMENT 8.0UD / VISION PLACEMENT 8.0UL
6. EMI SHIELD
: EMI Shield 2.0 X series for aerospace and Low Earth Orbit (LEO) satellite communications
7. META GRIDNER
8. LASER