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For composition and thickness (EDXRF), thickness, density, and roughness (XRR) for unpatterned and patterned films for up to 300 mm wafers

For thin-film applications, precise measurements of small areas are obtained, and high brightness is achieved in localized spots.

The Rigaku XTRAIA MF-3000 (formerly MFM310) performs high-precision measurements not possible by optical or ultrasonic techniques. This sophisticated X-ray metrology tool makes it practical to perform high-throughput measurements on product and blanket wafers ranging from ultrathin single-layer films to multilayer stacks.

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Ultrahigh-speed metal contamination mapping

Total Reflection X-ray Fluorescence (TXRF) is widely used for measuring metal contamination in semiconductor manufacturing processes such as cleaning, lithography, etching, and thin film deposition.

XHEMIS TX-3000 is a state-of-the-art TXRF system equipped with a multi-element detector that enables simultaneous measurement at three locations, in addition to the conventional 1-target, 3-beam configuration. This allows for high-throughput analysis with high sensitivity and efficiency, covering elements from Na to U.

XHEMIS TX-2000, the successor to the TXRF 3760, was unveiled for the first time at SEMICON Japan. It comes standard with a Fan Filter Unit (FFU) and supports transparent substrates such as glass and sapphire. Combined with AI-powered software, it achieves double the throughput compared to previous models.
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Micro-spot EDXRF and Optical Inspection (2D-3D)

The ONYX series systems are designed to provide a holistic metrology approach in all steps of the manufacturing process from FEOL through WLP, including optimal configuration for advanced packaging and single bump applications to monitor Ag/Sn ratio proven results in measuring and identifying single solder μ-bumps less than 5 μm diameter.

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Measurements results include film thickness, density, and roughness (by X-ray reflectometry, XRR) and epitaxial film thickness, composition, strain, lattice relaxation, and crystal structure quality (by high-resolution XRD, HRXRD).

XTRAIA XD-3300’s original X-ray optical system is the key performance enabler. Combining ultra-high-performance mirrors with bent crystals, this system enables measurements to be completed at up to 100 times the speed of previous products. The diffraction measurement tasks that once took several hours can now be completed in just a few minutes.

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High-resolution, non-destructive wafer defect imaging for every stage of semiconductor manufacturing

• Three configurations: Lab, Near-Fab, and Fab systems for seamless R&D to production scaling
• Up to 300 mm wafers with full-wafer, non-destructive defect detection
• Multi-material support: Si, SiC, GaN, InP, GaAs, AlN, Ga₂O₃, Sapphire, and more
• SEMI-compliant QC tools for TSD, BPD and MP quantification in SiC

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