KYZEN

MICRONOX MX2708 is formulated for the demanding cleaning challenges presented within leadless devices such as low standoff gaps and fine pitches of Cu Pillar flip chips, 2.5D/3D ICs, SiP and AiP. MX2708 completely removes organic acid residue of all kinds at low, safe operating concentrations all while having no effect on exposed metal and intermetallic alloys including Cu, Al, Sn, Pb, Ni, Ag, and Au finishes. MICRONOX MX2708 most effectively cleans organic acid flux residues at lower concentrations in spray-in-air cleaning systems.

• Effectively Cleans Under Highly Dense Die Without Reacting with Exposed Metals
• SAC, Aluminum and Copper Safe
• Low Surface Tension
• Superior Rinsing Ability

MICRONOX MX2322 is a semiconductor grade engineered semi aqueous solvent and designed to clean all types of paste fluxes common in wafer bumping, wafer level packaging, PMICs and Power LEDs. MX2322 has a wide process window, as well as a long bath life, to remove tough flux residue at a fast rate and is compatible with all sensitive metals. MICRONOX MX2322 demonstrates its excellent cleaning performance and benefits in single-wafer spray-in-air tools as well as all immersion cleaning systems.

• Effective in Single Wafer SIA, Ultrasonic and All Immersion Cleaning Systems
• Compatible with Sensitive Metals and Passivation Materials
• Effective on All Types of Residues on Lead Free & High Pb Process
• Wide Process Window
• Low Cost Ownership