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ANI Co., Ltd

  • 부스번호:W402

WELCOME TO ANI CO,. LTD.

Overview

ANI Co., Ltd. develops the necessary equipments for production process of three growth industries (Mobile, Semiconductor, and FPD) based on long-time accumulated technology, thereby providing equipment to domestic conglomerates. Especially, we have participated in clients' inspection process and provided the optimal inspection solution and we are making the best efforts for customized development equipment suitable for customers' needs. We promise that we can grow to be a company which is trustful to customers by focusing on 'Creation of Customer Value' based on “the best technological prowess, customer oriented mind, basic and principle".


  보도자료

  • 제25회 계량측정의 날 정부유공 포상(산업통상자원부 장관상)

    제25회 계량측정의 날 정부유공 포상(산업통상자원부 장관상)
    한국계략측정협외에서 주관하는「제55회 계량측정의 날 포상 행사」에서 광계측기 LUKAS 브랜드 기술개발 성과를 인정받아  산업통상자원부 장관상(계량측정부문)을 수상하였습니다.
    2025.10.31


  제품정보

  • HAWKEYE-HMI【 Wafer Warpage Inspection Equipment 】
    Inspects and measures wafer warpage, the height of gap-fill material, chip BLT and warpage in the COW process...

  • ■ Equipment specifications

         1. Wafer Size : 12 Inch (300mm)

         2. 2D Optics : Review Camera, Line Scan Camera

         3. 3D Optics : Chromatic Confocal

    ■ Equipment performance

         1. 2D Vision Inspection

              1) Stage Defect Inspection

              2) Wafer Buffer Crack

              3) Wafer Review Image

         2. 3D Measurment

              1) CoW Wafer Warpage

              2) NCF Fillet Height

              3) Chip BLT, Chip Warpage

  • HAWKEYE-RS【 Wafer Reivew Station 】
    Equipment that utillzes defect inspection map data to automatically navigate to defect loactions for microscope review....

  • ■ Equipment specifications

         1. Wafer Size : 12 Inch (300mm)

         2. Configuration : Microscope, 3CCD Color Camera

         3. Review Levels : 2.5x, 10x, 20x, 50x, 100x

                                       Wafer Edge Chipping Inspection (Option)

    ■ Equipment performance

         1. Wafer Align Through Chromatic Aberration

         2. ASP Auto review

         3. Wafer Size Measure Auto Review

  • HAWKEYE-PMI【 Mount AOI 】
    Equipment for inspection and measurement of appearance after chip mount in PCB during TSV process...

  • ■ Equipment specifications

         1. PCB Size : 240 (mm) x 77.5 (mm)

    ■ Equipment performance

         1. 2D Vision Inspection

              1) Pollution, Crack, Accuracy, Pad Pollution, PCB Damage Inspection

         2. 3D Measurment

              1) Chip Height, Chip/PCB Warpage Measurment