■ Equipment specifications
1. Wafer Size : 12 Inch (300mm)
2. Configuration : Microscope, 3CCD Color Camera
3. Review Levels : 2.5x, 10x, 20x, 50x, 100x
Wafer Edge Chipping Inspection (Option)
■ Equipment performance
1. Wafer Align Through Chromatic Aberration
2. ASP Auto review
3. Wafer Size Measure Auto Review