Hprobe’s solutions enable high-throughput electrical testing of wafers under magnetic fields, powered by proprietary fast 3D magnetic-field generation technology. Our patented generators support high-volume wafer-level probing with standard power supplies and air cooling, and are integrated into test heads for 200–300 mm automated wafer probers compatible with TEL and Accretech stations.
Combining precise 3D magnetic field control with ultra-wideband RF instrumentation, Hprobe systems can generate perpendicular, planar, or rotating fields at up to 10,000 step samples per second. This allows accurate simulation of real operating conditions for MRAM and magnetic sensors, supporting wafer acceptance testing, chip probing, functional verification, and parallelized production. The modular platforms provide a single interface for test sequencing, automation, and fab integration. Hprobe’s portfolio includes IBEX for MRAM, LINX for magnetic sensors, and the H3DM/H3DM-XL platforms for wafer testing and SoC/ASIC verification, offering large field uniformity and support for more than 64 channels in parallel, enabling flexible deployment from R&D to high-volume production.
The IBEX platform extends these capabilities to MRAM devices with dedicated parametric and functional test solutions. IBEX-WAT, available in single- and multi-channel configurations, enables Statistical Process Control at Wafer Acceptance Test through PCM structure monitoring. It integrates Hprobe’s magnetic field generator directly into the prober-mounted test head and uses Hmap® software to operate in manual R&D mode or fully automated fabs, delivering fast, precise characterization of magnetic tunnel junctions and bit-cells. Complementing this, IBEX-WS targets MRAM array testing and Wafer Sort of SoCs with embedded MRAM, supporting single- and multi-site configurations from early development to high-volume manufacturing. High-end instrumentation ensures the ultra-fast test times required for next-generation eMRAM production.
For magnetic sensors, the LINX-WS system provides wafer-level sorting with the same advanced magnetic capabilities. It features Hprobe’s proprietary magnetic generator integrated into a robotized 3-axis test head and supports manual or automated probe-card loading. High-performance instrumentation enables both stable static fields and fast dynamic sweeps, while the control software allows intuitive configuration of field patterns, calibration, and multi-channel operation, with optimized static and dynamic profiles. Programmable interfaces ensure seamless integration with the user’s test platform.
Expanding the portfolio further, Hprobe’s latest product, the H3DM-XLL, sets a new benchmark in magnetic field strength and vector control for advanced TMR sensor development and production. Responding to growing demand from automotive electrification, industrial automation, mobile devices, and robotics, it generates fields above 200 mT in any direction, exceeding 500 mT in-plane and 250 mT out-of-plane across a large uniform area—the only commercial solution offering such performance at wafer level. The system supports sweep rates up to 2 T/s, delivers precise calibration and repeatability, and integrates smoothly with standard probers and ATEs. Compatible with 200 mm and 300 mm wafers, it docks directly onto probing equipment and synchronizes with external ATEs via dedicated control and trigger interfaces for efficient deployment in semiconductor production environments.