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AGC Inc.

Chiyoda-Ku, Tokyo,  Japan
https://www.agc-electronics.com.tw/
  • Booth: Q5752

Your Dreams, Our Challenge

Overview

AGC plays a vital role in the semiconductor industry by providing high-performance materials that support advanced chip manufacturing processes. Its product portfolio includes ultra-pure chemicals, high-grade glass and ceramics, and advanced fluoropolymer materials like ETFE and PFA, which are used in fluid handling and equipment linings. AGC also supplies photolithography-related materials, CMP slurries, and components used in extreme environments. These innovations help enhance productivity, purity, and precision in semiconductor fabrication, enabling the ongoing miniaturization and performance advancement of semiconductor devices.


  Products

  • TGV Glass Substate
    TGV Glass Substate for Advanced Packaging...

  • Features

    • Precise fine pitch small TGV and Cavity formation
    • Available in wide variety of glass composition and thickness (0.2 ~ 1.0mm)
    • High aspect ratio (up to 20:1) at 1.0mmt
    • High modulus and CTE adjustability for Warpage Control
    • Panel format production (e.g. 510x515mm)

    Applications

    • Glass core for Advanced Packaging (e.g. Chiplet packaging substrate)
    • RF device (e.g. Integrated Passive Device, Antenna in Packaging)