Loading...

Smiths Interconnect

上海,  上海市 
China
http://www.smithsinterconnect.com
  • Booth: S7558

Welcome to Smiths Interconnect booth K3190

Overview

Smiths Interconnect is a leading provider of innovative solutions for critical semiconductor test applications. Smiths Interconnect’s test sockets
and probe card solutions offer superior quality and reliability, providing customers with a competitive advantage.


Our best-in-class engineering and technical expertise ensure the development of cutting-edge test platforms for area array, peripheral, wafer level
and Package on Package (PoP) devices. Our extensive product portfolio accommodates both devices with finest micro pitches and those with
very high bandwidth requirements. Off-the-shelf and custom products are proven to deliver the best solution for the customer’s specific needs.


  Press Releases

  • Smiths Interconnect is excited to announce its top-performing distributors for the year 2024. The Distribution Awards initiative recognizes business partners who have significantly contributed to the growth of Smiths Interconnect across its three operating regions: the Americas, EMEA, and Asia. Winners in each region were selected based on their exceptional performance compared to the previous fiscal year.

    "With the Smiths Interconnect Distribution Awards, we recognize the vital role our distributors play in our success, and we look forward to continued growth for our businesses."” said Vera Parker, President of Smiths Interconnect.

    Thanks to the enthusiastic efforts of our distributors across all three regions, a greater number of business partners have been awarded this year. A total of seven distributors have been honoured for their outstanding contributions. In the Americas, FDH Electronics has been awarded the distributor of the year. FDH is a long-lasting partner of Smiths Interconnect (beginning the business relationship with Electro Enterprises) and during the years, they have proved to be a trusted and collaborative partner. A couple of recent initiatives that have contributed to their growth: the Hyper series stocking package made FDH Electronics become an international partner for the selected hyperboloid contacts, and the stocking package for cPCI connectors definitely boosted their growth.

    In the EMEA region, Smiths Interconnect has recognized two distinct distributors for their outstanding growth throughout 2024. The Spanish distributor SCP SINTERSA (Sistemas de Interconexión SA) has achieved the best growth during 2024 for the Connectors product line. Thanks to its well-established sales network and strong business relationships with key customers, the Spanish company has achieved outstanding results across the Iberian Peninsula. These successes are also driven by a solid inventory of connectors and the added value provided by its cabling services.

    The Turkish company Matec Elektronik received the second EMEA award for their outstanding contribution for the Fiber Optic and Components product lines in 2024, including the key support in maintaining a positive relationship with local customers.

    Last but not least as it presents the higher number of awards, Asia was one of the most active areas from a distribution standpoint. For this reason, Smiths Interconnect has decided to award the following 4 business partners:

    • Sangdo Electronics: Highly Commended Distributor for Business Growth 2024 for Connectors product line. Throughout the year Sangdo was particularly active in the design-in activity for Space and Industrial applications and won same important new projects
    • HS4B: Highly Commended Distributor for Business Growth 2024 for Fiber Optic and Components product line. They have done an exceptional job to promote this product line and grow its business in South Korea.
    • Shanghai Huili Technology Development: Distributor of the Year 2024 for Semiconductor products. This is the second consecutive year they have received the award. In 2024, they continued the exceptional performance demonstrated in 2023, contributing to a 33% increase in sales. They have also consistently shown strong motivation to expand our activity in China, where they have nearly doubled Smiths Interconnect’s business over the past two years.
    • Conn-tek ElectronicsHighly Commended Distributor for Business Growth 2024 for Semiconductor products. This special award is the recognition for their support and collaboration both in the consolidated Chinese market and in the growing Taiwanese one where they were able to provide logistics support and helped push our potential business growth.

  Products

  • DaVinci Gen V
    Enabling Reliable Testing at 224 Gbps with Unmatched Signal Integrity Performance....

  • Features & Benefits

    Engineered to overcome these challenges, the DaVinci Gen V coaxial test socket provides an out-of-box solution for full functional testing of cutting-edge ASICs. Its precision design guarantees unmatched signal integrity, eliminating measurement errors while delivering lab-grade accuracy and repeatability in production environments.

    Features:

    • Solution for BGA, LGA and other variants
    • Spring probe technology using homogeneous alloy with gold plated for better grounding
    • RF bandwidth > 84 GHz @ -1dB IL  
    • Short signal path  4.90 mm test height 
    • Impedance tuned to match system 
    • Consistent stable contact resistance 55 mΩ (Avg.)
    • Hi-coplanarity accommodation 
    • Tri-temp socket design to support -55 °C to +150 °C
    • Designed for manual test, bench test, and HVM production test using the same socket
    • New manufacturing process to top and bottom cartridge

    Benefits:

    • Design adaptation to meet requirement
    • Long contact life, tested to 500K insertions  
    • Impedance can match system or defined as needed 
    • Excellent DC performance
    • Patented insulated metal socket housing for optimal signal integrity performance and strength
    • Precision-machined socket housing ensures robust mechanical performance 
    • Field repairable, replace a single probe or full array
    • Cleaning can be done while the system is running, using a cleaning surrogate 
  • DaVinci Micro Test Socket
    Fully shielded signal path negates the effects of cross-talk during test, allowing an immediate yield enhancement....

  • Features

    • Spring probe technology using homogenous alloy ​
    • Short signal path 2.85 mm Test Height ​
    • Impedance tuning, can match system or defined as needed, 40, 45, 50 Ohm impedance (single ended)  ​
    • Cross-talk suppression IM housing  ​
    • Tri-temp socket design to support -40 °C to +125 °C​
    • Consistent stable contact resistance 120 mΩ (Ave)​
    • Designed for manual test, bench test, and HVM Production Test using the same socket ​
    • Solution for BGA, LGA, QFN, DFN, and other variants, ideal for minimum pitch 0.35 mm​
    • Floating base or Hi Low configuration to protect spring probes during use

    Benefits

    • Tested to 500K
    • Short contact path for excellent DC performance​
    • RF Bandwidth up to 30 GHz @ -1dB IL ​
    • Reduction in pin-to-pin noise (cross-talk)  ​
    • Precision-machined socket housing ensures robust mechanical performance  ​
    • Field repairable, replace a single probe or full array without the need for additional training ​
    • Patented Insulated Metal socket housing for optimal signal integrity performance and strength ​
    • Match existing PCB socket footprint and test hardware led to cost-saving for customers
  • ES Series H-Pin® Socket
    The modular lid construction can handle up to 1 kW of power and is optimized with thermal simulation to ensure out-of-the-box performance whether liquid or air cooled....

  • Features & Benefits

    • Configurable design, large tooling catalog, molding, machining, 3D printing, and assembly automation deliver best-in-class quality, price, and lead times.
    • An extensive catalog of standard components provides field-tested designs.
    • Double-latching clamshell provides ease of use during operation for high pin count applications.
    • Thermal and electrical simulation, Monte Carlo and FEA all ensure the delivery of out-of-the-box solution.
  • Levan Elastomeric Contact Test Socket
    The Levan Elastomeric socket family is engineered specifically with precision. The elastomeric grid of Levan features conductive columns that guarantee accurate and consistent test results across a spectrum of devices....

  • Features

    • Solution for BGA, LGA, QFN and other variants​
    • RF Bandwidth 23-108 GHz
    • Short signal path  ≤ 0.9 mm ​
    • Ability to do Impedance match signals  ​
    • Consistent stable contact resistance​
    • Low Inductance​
    • Optimized design based on test application  ​
    • Tri-Temp socket design to support -55 °C to +160 °C​
    • Designed for manual test, bench test, and HVM production test using the same socket 

     Benefits 

    • Design adaptation to meet requirement ​
    • Electrically transparent signal ​
    • Matched Impedance​
    • Excellent DC performance ​
    • Application matching allows for increased yield and product life  ​
    • Cleaning is user-friendly and simple​
    • Precision-machined socket housing ensures robust mechanical performance  ​
    • Field repairable, easy replacement of Levan elastomer​
    • Match existing PCB socket footprint and test hardware lead to cost saving for customers​
    • Reduced delivery times over probe sockets
  • Volta Series Probe Head
    High performance, cost-effective, easily maintainable alternative to cantilever and vertical probe card technologies....

  • Features & Benefits

    The unique precision afforded by Smiths Interconnect's floating spring probe designs allows for seamless deployment in testing Wafer Level Chip Scale Packages. We work closely with our customers to develop contactors which are used as probe heads in place of cantilever and traditional vertical probe card technologies. Smiths Interconnect has created thousands of probe heads for every type of device and prober. In that process, we have created a WLCSP-optimized family of spring contact probes, the Volta Series.

    • Reliable RF signal integrity
    • Excellent compliance and contact force
    • Easy maintenance