Test Research, Inc. (TRI)

Taipei City,  Taiwan
http://www.tri.com.tw

• Booth: K3070

Your Test and Inspection Partner. Visit us at booth #K3070.

Overview

Test Research, Inc. (TRI) offers a One Stop Test and Inspection Solution. TRI provides high-precision and high-resolution inspection solutions for the electronics manufacturing industry, including 3D Solder Paste Inspection (3D SPI), 3D Automated Optical Inspection (3D AOI), 3D Automated X-ray Inspection (3D AXI, upgradable to Computed Tomography), Manufacturing Defect Analyzers (MDAs), and In-Circuit Test equipment (ICT).

Patterned Wafer	TSV Metrology	Wafer Frame	Wafer Bumping	Wire/Die
SWIR+AI	Chiplet Metrology	Wafer AVI	Cu Pillar	TGV X-ray Inspection

  Press Releases

• Advanced WLP and Back-End Solutions at SEMICON Taiwan 2025 (Sep 01, 2025)
  Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON Taiwan held at Taipei Nangang Exhibition Center, Hall 1 – 1F from September 10 - 12, 2025. Visit TRI's Booth No. K3070 to learn more about the latest Advanced WLP/PLP and SEMI Back-End Package Inspection and metrology solutions.
  
  TRI's Inspection and Metrology Applications include: Chiplet & Chip-on-Wafer (CoW), System-in-Package (SiP), Advanced WLP, TSV Metrology, μBump, Cu Pillar, Surface Topology, Profiling, Thin Film Thickness, Patterned Wafer, Inner Crack / Chipping, After Sawing Defects, Die Underfill, Glue, Epoxy & Flux, Wafer Bumping and Die / Wire Bonding.
   

  Patterned Wafer	TSV Metrology	Wafer Frame	Wafer Bumping	Wire/Die
  SWIR+AI	Chiplet Metrology	Wafer AVI	Cu Pillar	TGV X-ray Inspection

  TRI will showcase the Wafer Inspection and metrology Platform, TR7950Q SII, capable of wafer macroscopic 3D inspection and micro measurement metrology. The TR7950Q SII has applications in Advanced WLP, Wafer Frame, Patterned Wafer, Wafer Bumping, WLCSP, Through Silicon Via (TSV), thin film, and more.
  
  TRI will also exhibit the back-end inspection solutions, the TR7007Q SII-S for C4 bumps (~100 μm Ø), Mini-LED, and 008004 paste inspection applications, and the TR7900Q SII-R TRI's Reject Station with A-Powered 3D Inspection that can inspect die, wire diameters of up to 15 μm (0.6 mil), SiP, underfill, bumps, and more. The lineup will also include an X-ray Inspection Demo Station. TRI's SEMI AXI solutions can inspect C4 bumps and Cu pillars.
  
  Visit TRI's Booth No. K3070 at SEMICON Taiwan 2025 to explore TRI's SEMI solutions.

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  About TRI
  
   

  Test Research, Inc. (TRI) offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at http://www.tri.com.tw. For sales and service information, please write to us at [email protected] or call +886-2-2832 8918.

  Products