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Taiwan Fairfield Electronic Technology CO., LTD.

Ahubei City,  HsinChu 
Taiwan
https://taiwanfairfield.wixsite.com/fairfield
  • Booth: L0004

Welcome to Fairfield : a high-tech material trading company

Overview

台灣銘奮電子科技有限公司是一家以銷售進口半導體封裝及電子材料為主 (導電膠/絕緣膠/散熱導熱材料/灌封膠/填縫膠/切割膜/研磨膜/DAF ...)，以提供工藝設計及解決方案、強大的技術支援為輔的高科技材料公司。公司的產品覆蓋了：氣密性封裝、光通訊、LED封裝和照明、半導體封裝、電子組裝、工業工程共六大行業。 典型產品有矽鋁、金剛石銅、導電銀漿和納米銀漿、絕緣膠、導熱灌封膠、結構膠等。

Taiwan Fairfield Electronic Technology Co.,Ltd. is a high-tech material trading company engaged in sales of  imported semiconductor packaging and electronic materials, providing process design and solutions, and strong technical support.

Fairfield covers six major industries: hermetic packaging, optical communication, LED packaging and lighting, semiconductor packaging, electronic and assembly, industrial and engineering. Typical products include silicon aluminum, graphite copper, conductive silver paste and nanoscale silver paste, insulating paste, thermally conductive potting & encapsulation, structural adhesive, etc.

  Press Releases

  • (Jul 02, 2025)
  • (Jul 02, 2025)
  • (Jul 03, 2025)
  • (Jul 03, 2025)
  • (Jul 03, 2025)

  Products

  • AKI-ACE IC Tray 簡介
    Advantage 優勢
    1.Carbon-free (零碳 )
    2.Carbon-dust-free (零碳塵)
    3.Lighter than other tray, saving shipping cost (輕, 省運費)...

    • A)Material characteristics
    1.Carbon-free IC Tray material
    •polymer-based dissipative resin
    •use at 150°C
    •industry’s first mass produced material
    2.Cleanest and safest IC Tray material
    •no staining, no peeling, and no risk of electrical failure
    3.Colorable material
    •standard type: dark brown
    •colored type: orange, blue and gray (customized colors are also possible upon request)
    4.Visually identifiable
    •when it is time to replace the tray
    5.Dissipative property
    •“low 10^9Ω range" is realized
    6.Applicable to pure water washing (for process tray)
    •also durable against high temperature drying
  • AMC 晶片貼片薄膜（DAF）
    適用於疊層晶片製程的快閃記憶體3D封裝可實現超大容量，而晶片貼片薄膜（DAF）在疊層晶片製程中已越來越普及甚至成為必需。DAF 和 DDAF 具有優異的導熱性和較低的熱阻，使其比其他晶片黏接材料具有更好的散熱性能。對於需要高效率散熱的電子設備而言，此特性至關重要。...

    • The flash memory 3D packaging suitable for laminated chip process can realize an ultra large capacity, and die attach film (DAF) has become increasingly popular even necessary in laminated chip process.  DAF and DDAF have superior thermal conductivity and low thermal resistance, allowing them to dissipate heat better than other die attach materials. This property is essential in electronic devices where heat needs to be dissipated efficiently.
  • AIM 各列 錫膏
    我們供應的焊膏經過精心開發，具有強大的性能、易用性和成本效益。 AIM 焊膏解決了消費性、LED、汽車、航空航天和軍事應用所需的難題，包括 QFN 空洞、低面積比印刷以及高可靠性要求。...

    • Solder paste that we supply has been developed to deliver robust performance, ease of use and cost effectiveness. AIM solder pastes resolve difficult issues including QFN voiding, low area ratio printing, and high reliability requirements for consumer, LED, automotive, aerospace and military applications.
  • AIT 高可靠性封裝的高級晶片黏接膏黏合劑 (Die Attach Paste)

    用於高可靠性封裝的高級晶片黏接膏黏合劑 ME8412：一種超導膏，在 150°C 下 15 分鐘內固化，並支援高達 250°C 的引線鍵合。它具有無空隙低 BLT、高導電性，並符合 MSL 1 級標準。也提供用於引腳轉移或沖壓的低黏度版本（ME8412-SLV）。 ME7410-SSC：一種快速固化介電黏合劑，針對商業高速晶片黏接製程進行了最佳化。 ME7415：快速固化、導熱介電接著劑，是可靠的高通量鍵結的理想選擇。
    ...

    • Advanced Die Attach Paste Adhesives for High-Reliability Packaging ME8412: A hyper-conductive paste that cures in 15 minutes at 150°C and supports wire bonding up to 250°C. It features void-free low BLT, high conductivity, and is MSL Level 1 compliant. Also available in low-viscosity version (ME8412-SLV) for pin-transfer or stamping. ME7410-SSC: A snap-curing dielectric adhesive, optimized for commercial high-speed die attach processes. ME7415: A rapid-curing, thermally conductive dielectric adhesive, ideal for reliable high-throughput bonding. ME8630-SSC: A snap-curing conductive paste that cures in less than 5 minutes at 150°C, or at 60°C for temperature-sensitive applications.
  • LORD 磁鐵薄膜塗層設計的熱固化環氧樹脂
    專為散熱器和磁鐵薄膜塗層設計的熱固化環氧樹脂。 LORD JMC-700K 塗料單塗即可提供電氣絕緣、耐熱和耐油性能。該塗料可用於各種汽車應用，包括電動車使用的冷卻板、散熱器和馬達磁體，以及汽車零件和工業機械應用。...

    • Thermal-cure epoxy resin specially designed for thin film coating of heat sinks and magnets. LORD JMC-700K coating provides electrical insulation, heat resistance, and oil resistance with a singlecoat application. This coating can be used in a variety of automotive applications including cooling plates, heat sinks and motor magnets used in electric vehicles, as well as automotive parts and industrial machine applications.
  • LORD 灌封膠, 填充膠, 散熱膠, 結構膠
    我們的產品提供多種封裝應用選項，包括點火線圈、引擎控制模組、變速箱控制模組、感知器、電源、變壓器和其他關鍵電子設備。...

    • Our products offer diverse encapsulant application options including use in ignition coils, engine controlmodules, transmission control modules, sensors, power supplies, transformers and other critical electronic equipment.

Categories

300 Materials, Assembly
  • Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive
  • Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools
  • Molding; Encapsulation; Potting; Resin Materials
  • Packages; Ceramic and Other High Temp Compounds
  • Packages; Plastic
  • Preforms; Lids
  • Scribe Tools; Saw or Dicing Blades and Accessories
  • Solder; Solder Balls and other Soldering Materials
  • Tape Automated Bonding (TAB) Accessories
  • Thermal Interface Materials; Heat Sinks
  • Thick Film Pastes; Materials
  • Thin Film; Dielectric Film Materials
    • 301 Materials, Chemicals & Solids
  • Cleaning Chemicals; Solvents; Strippers
  • Other Specialty Chemicals
  • Spin on glass material
  • Surface protection material; coatings
    • 302 Materials, FPD
  • Alignment Film Materials
  • End-Sealing Material
  • Spacer Materials
    • 303 Materials, Gases
  • Gases Materials
    • 400 Components, Parts & Accessories
  • Sealants; Adhesives; Finishes
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