ASMADE is a high-tech enterprise founded by international leading motion control expert team, focusing on the research and development of high-precision semiconductor equipment, manufacturing and sales.
We provide semiconductor packaging equipment, power device packaging equipment, MINI LED die bond equipment, intelligent control equipment and semiconductor packaging process management system. The machines have independent intellectual property rights.
The High Precision Semiconductor Die Bonder, the Epoxy Die Bonder, and the Bulk Component Mounter will be shown at the spot.
We are glad to introduce some specific machines' details for you.
In the semiconductor packaging field, we provide the High Precision Semiconductor Die Bonder and the Epoxy Die Bonder. And in the Mini LED packaging field, we provide the Bulk Component Mounter with its high speed UPH 90K/H.
Highlights of the High Precision Semiconductor Die Bonder:
- Features both high precision and high efficiency
- Turret transport structure, first developed by ASAMDE in the industry
- Supports both single material packaging and multi-material integrated packaging
- Positional Accuracy: ±3μm
- Application: Optical Module, LIDAR, Sensor, SIP, Chiplet
Highlights of the Epoxy Die Bonder:
- Possesses both dispensing and die bond mechanism
- Angular accuracy: <1°
- Positional accuracy: <±15μm
- Application: Sensor, SIP, Chiplet, IC, Epoxy Process Power Device, MOS
Highlights of the Bulk Component Mounter:
- Arbitrary Switching of Multiple Products
- Arbitrary Mounting Spacing
- Products Quick Changeover
- Self-Programming for Mixed Mount
- Real-Time Process Correction
- Automatic Supplementary Mounting
We dedicated to providing one-stop semiconductor packaging process die bond solutions.
Hope to see you at Booth #L0010!