Teltec Semiconductor Pacific Limited

FF35 CT

FF35 CT highlights

• Single or dual tube configuration for highest versatility in laboratory micro-CT applications
• Switch between 225 kV micro-focus and 190 kV nano-focus tubes in seconds with the touch of a single button
• Accurate results due to granite-based manipulation and air conditioning
• Application flexibility due to various CT trajectories and FoV extensions via software platform Geminy
• Optional metrology version with an MPESD = 5.9 µm + L/75 [L in mm]
• Available as FF35 CT SEMI version in compliance with semiconductor market standards
• NEW! Maximum sample weight now up to 50kg - Also available as an upgrade

Flexible inspection of very small to medium-sized parts

The Comet Yxlon FF35 CT, FF35 CT Metrology, and FF35 CT SEMI cover an extraordinary range of applications. Capabilities include improved material testing in the R&D department, optimization of process control and small series inspection as well as various scientific applications. The dual X-ray tube set-up enables the high-resolution CT system to significantly expand quality assurance and research possibilities in the automotive, electronics, aviation, and material science industries.

CA20

CA20 highlights

• Designed for the semiconductor industry
• Non-destructive technology for three-dimensional insights into solder bumps within minutes
• Repeatable results through reliable and accurate technology, designed to support a stable inspection routine
• Efficient software-assisted review including automated void analysis with Void Insights
• Dose Manager for the protection of X-ray sensitive components

CA20 – The fastest way from R&D to ROI

The semiconductor sector is a speed-driven industry. In the race for innovation every day counts. As an inspection system specifically developed for the challenges of complex 3D ICs in Advanced Packaging, the CA20 helps you keep the pace – and to stay ahead of the game. The CA20 enables an accelerated verification of new packaging process node prototypes: The faster you find the root cause of ramp-up issues and fix them, the faster you’ll reach the desired yield – and, thus, the Return-on-Invest (ROI).

Cheetah EVO

Cheetah EVO highlights

• Reliable, fast, and repeatable inspections – manually and automatically
• Automatic void calculation with VoidInspect
• Easy-to-use, dynamic enhancing filters, e.g., eHDR
• Best available laminography with micro3Dslice and FF CT software
• Dose reduction kit, dose monitoring, and low dose detector mode for sensitive components
• Optional new water-cooled X-ray tube for a stable focal spot
• Optional high load capacity (< 20 kg)

The optional water-cooled FXT 160.51 X-ray tube

Inspectors know the problem: long scan times often lead to image distortions and question test repeatability due to labile results. It's an effect caused by the rising temperature of the tube housing and the target, which can lead to focal spot drift. The new water-cooled X-ray tube counteracts this phenomenon. It provides reliable heat dissipation and ensures a stable focal spot and crystal-clear X-ray images even after long beam times. You achieve reliable inspection results for the first scan just as for the umpteenth and can rely on the repeatability of the X-ray inspection at any time.

Savannah®’s efficient use of precursors and power-saving features substantially reduces the cost of operating a thin film deposition system.

Key features include:

• In-Situ Ellipsometry
• In-Situ QCM
• Self Assembling Monolayers
• 2-Second Cycle Times
• Integrated Ozone
• Low Vapor Pressure Deposition
• Batch Processing
• Glove Box Integration

Fiji®

Fiji® series is a modular, high-vacuum thermal ALD system that accommodates a wide range of deposition modes using a flexible architecture and multiple configurations of precursors and plasma gases. The Fiji G2 is a next-generation ALD system capable of performing thermal and plasma-enhanced deposition.

Key features include:

• Proprietary Chamber Turbo Pumping System
• Improved Plasma Design
• Ergonomic Operator Interface
• In-Situ Ellipsometry
• In-Situ Quartz Crystal Microbalance
• Integrated Ozone
• Glove Box Interface

The Fiji® is available with up to six precursor lines that can accommodate solid, liquid or gas precursors, and six plasma gas lines, offering significant experimental flexibility in a compact and affordable footprint.

Phoenix®

The Phoenix® system is engineered for high throughput and maximum uptime in any fabrication environment, from pilot production to industrial-grade manufacturing. Technologists and researchers rely on the Phoenix® for repeatable, highly accurate film deposition on flat and 3D substrates alike. And with support for up to six individual precursor lines, the Phoenix® delivers solid, liquid, or gaseous process chemistries depending on your thin film needs. A compact footprint and innovative design makes the Phoenix® the practical choice for those with batch production ALD requirements.

Key features include:

• Precise software control of process parameters, including temperature, flow and pressure, for defect-free coatings on even the most sensitive substrates
• Patented ALD Shield™ vapor trap to prevent build-up of deposits and minimizes excess process gases from being exhausted into the environment
• Large process chamber accepts GEN 2.5 substrates, multiple wafer cassettes and larger 3D objects
• Low cost of ownership with minimal startup and operational costs
• Compact footprint that conserves valuable clean room space
• Standard recipes and ALD materials readily available
• Comprehensive support and services worldwide from technical team and PhD scientists

CE, FCC, and CSA compliant with many built-in safety features

Dimension FastScan Pro

The Dimension FastScan Pro delivers the highest metrology-level speed and performance of any industrial AFM available today. The system enables automated or semi-automated measurements while ensuring the utmost ease of use and the lowest cost per measurement for quality control, quality assurance, and failure analysis.

Features:
FastScan Pro utilizes an open-access platform, large- or multiple-sample holders, and numerous ease-of-use features to provide flexible high-performance nanoscale metrology for industrial QA, QC, and FA applications. The system delivers automated 2-inch to 12-inch wafer measurements for semi, data storage and HB-LED. It features increased XY sample travel for full access to 200mm wafers or multiple samples in 200-mm diameter area, with optional chucks for 300-mm wafers. The system also provides the choice between a high-throughput 5-10x FastScan scanner for topography, roughness and other metrology analyses, or an Icon scanner with 90µm scan range for larger scans and high-accuracy topography performance.

ContourX Series - 3D Optical Profilometer

The ContourX Optical Profilometer sets a new benchmark for accurate and repeatable non-contact surface metrology at a best-in-class price point. The small footprint system offers uncompromised 2D/3D high-resolution measurement capabilities in a streamlined package that incorporates decades of proprietary Bruker white light interferometry (WLI) innovation. Next-generation enhancements include a new 5 MP camera and updated stage for larger stitching capabilities, and a new measurement mode, USI, for even greater convenience and flexibility for precision machined surfaces, thick films, and tribology applications. You will not find a benchtop system with better value than the ContourX.

Fast and repeatable 3D Metrology

• Industry-best Z resolution offers constant, precision measurements, independent of magnification
• Largest standard field of view
• Compact, vibration-tolerant design for highest stability and repeatability

Superior Measurement and Analysis

• Easy-to-use interface for quick and accurate results
• Extensive library of filters and analysis options for roughness, surface texture, and critical dimension
• Customized analysis reporting to industry standards, such as ISO 25178, ASME B46.1, ISO 4287

Applications:

• Roughness (Polished Glass, Oily Material, Photoresist, Silicon etc)
• Warpage
• Curvature
• Topography

Hysitron TI 990 TriboIndenter

Bruker's next-generation Hysitron TI 990 TriboIndenter® sets new standards for performance, flexibility, and usability in nanomechanical and nanotribological characterization. A comprehensive advancement of Bruker’s industry-leading TriboIndenter platform, every aspect of TI 990's measurement and analysis process features updated technologies designed to remove the normal limitations of nanoindenter systems. As such, this system features the most measurement modes available and delivers high-precision measurements in the broadest range of laboratory environments.

The TI 990 powerful base configuration provides a comprehensive understanding of material behavior at the nanoscale

• Quantitative nanoscale-to-microscale indentation
• Nanoscratch
• Nanowear
• High-resolution in-situ scanning probe microscopy (SPM) imaging
• Dynamic nanoindentation and high-speed mechanical property mapping

Stylus Profiler

Dektak Pro® Stylus Profiler features a revolutionary design that enables even measure single-nanometer step heights and achieve better than 4 angstrom repeatability. This major milestone in stylus profiler performance is the culmination of fifty years of Dektak® innovation and industry leadership. Through its combination of industry firsts, Dektak Pro delivers the ultimate in performance, ease of use and value to enable better process monitoring from R&D to QC. The technological breakthroughs incorporated in Dektak enable critical nanometer-level surface measurements including the microelectronics, Film Coatings, Life Sciences.

Working Principal: Stylus Profiler measured film thickness by contact stylus scanning

• Stylus force 1-15 mg, with 0.03 mg low force option
• The Dektak Pro’s self-aligning styli enables effortless tip exchange
• Low Inertia sensor (LIS 3)
• Smart electronics reducing errors and uncertainty in high-precision measurements.
• Single arch design provides breakthrough scan stability
• Vision 64 operation and analysis software

Large-Sample analysis tool - Application for high throughput, accurate QA/QC!

The Dektak XTL builds upon over 50 years of stylus expertise and application customization for production facilities
to meet the stringent industry roadmaps of both today and tomorrow. The 300-millimeter, high-accuracy
encoded XY staging gives manufacturers a reliable tool to meet stringent gage R&R requirements.

Other hardware features include:

• Single-arch architecture and integrated vibration isolation for industry-leading performance
• Quick-change self-aligning stylus
• High-accuracy encoded XY stage for faster automated data collection
• N-Lite low force with Soft Touch technology and 1mm measurement range can be used simultaneously to measure delicate and high-vertical range samples
• Dektak’s Dual Camera Control with high-magnification dual view cameras offers enhanced spatial awareness. Point-and-click positioning in the live video allows operators to quickly place samples at the right location for quick and easy measurement setup and automation programming

Akrometrix AXP3
Shadow Moiré Technology
Shadow Moiré is a non contact, full field optical technique that uses geometric interference between a reference grating and its shadow on a sample to measure relative vertical displacement at each pixel position in the resulting image. It requires a Ronchi-ruled grating, a white line light source at approximately 45℃ to the grating and a camera perpendicular to the grating. Its optical configuration integrated with the heating chamber is shown in the figure to the right.

The new generation of surface measurement and analysis techniques
Development/Diagnostics /Production Monitoring. Whether your customer is the individual consumer or an OEM, the TherMoiré excels at helping you achieve exceptional customer satisfaction.Better than ever, TherMoiré technology can simulate your thermal processing and operating environment conditions, while capturing a complete history of out-of-plane displacement behavior. Applying this critical information to form - or achieve compliance for - component/substrate behavior allowances (i.e. warpage specifications) can directly impact level I & level II assembly yields and enhance product reliability. Below data could be measured: Coplanarity, Sign warpage, Fulfill warpage, Twist, Bow, CTE, etc.

TherMoiré AXP3 Feartures:
• Capable of up to 400mm x 400mm samples
• Minimum Feature Size: 2mm x 2mm
• Up to 1.7 million data points per Acquisition in 2 seconds
• Warpage resolution down to 0.5µm（300 LPI Grating）
• 2 zone temperature control on bottom, plus top heater on separate control loop
• Temperature range of -55°C to 350°C
• Maximum Heating Rate, 50°C to 250°C, 3.5ºC/s
• Maximum Cooling Rate, 250°C to 125°C, 2.25ºC/s
• Can integrate DFP and DIC technology
Automation
• Exhaust Speed is Software Controlled
• Larger Touch Screen HMI for Machine Control
• Shadow Moire Lens Automation
• Front Door Locking System
• New PLC Control System with Improved Thermocouple Control and Response
• The AXP3 camera field of view can be freely set in the software, increasing the flexibility of use

Top/Bottom Heating Chamber
In addition to the above features for AXP3 adds up and down two heating zones, with the following features:

• Top and Bottom Heating Capacity with Top/Bottom/Lateral Uniformity <±5ºC
• Capable to measure unpainted surface
• Dual CoolBoost from Front and Back and Triple Exhaust Channel from Left, Right and Bottom creating faster and uniform cooling effect.

Digital Fringe Projection - DFP Module
New Standalone Product that provides pure convection heating for assembly reflow simulation
Application - Solder ball coplanarity measurement, discontinuous surface & socket measurement

• Enables step height and discontinuous surface measurement
• FOV can be moved to anywhere on the sample (gantry fixture)
• Improved top/bottom temperature uniformity – no grating
• High X/Y resolution for solder ball coplanarity measurement

Digital Image Correlation - DIC CTE Module
• Add-on module : AXP3 & PS600S & PS200S
• Strain and CTE measurement module
• Data acquisition time < 1 second
• In-Plane Resolution: <1 μm
• Strain Resolution: <100 microstrain (Δ L/L x 10-6)
• Temperature Range: -55°C to 350°C
• Field of View: 115mm x 150mm

Convective Module – CM
• Optional Sub Room Temperature Module fits inside the AXP
• Accommodates samples up to 200mmx200mm
• Heats and cools from -55 C to 300C
• Automatically controlled by StudioSurface Measurement
• Adjustable heating, cooling and airflow rates

Convective Reflow Emulation Module - CRE
Combines maximum resolution capabilities of the AXP with improved temperature uniformity
• Most accurately emulate production reflow conditions for semiconductor packages
• + 3.0 °C/sec heating rate
• Sample temperature uniformity +/- 2 °C
•  70 mm diameter circular field of view

Akrometrix Studio 9.0
Akrometrix Studio is an advanced set of integrated software modules that work together to provide the most comprehensive set of surface characterization and analysis capabilities available. When used with the TherMoiré AXP surface measurement system, Studio powers a set of modular metrology solutions that generate fast, comprehensive surface information characterizing a wide range of microelectronic components and assemblies. Studio enables the user to draw conclusions and make decisions using a variety of powerful graphical and analytical analyses.

Studio 9.0 Key Features：
• RTA Included
• New Product Support
• New Gauges
• New Surface Measurement & Thermal Profiler
• New Surface Analysis Features
• + more minor feature additions and bug fixes

New Gauges :
Max Warpage Gradient (MWG): Quantifies the highest slope area of the data set by looking at height change in a small area around each data point. Primarily useful for comparison of data sets. Only a single highest value is reported.

Average Phase Amplitude (APA): Measurement quality metric showing the average amplitude of the phase curve calculated for each point in the data set. Higher values indicate better overall measurement resolution. This same math is used in phase amplitude thresholding where lower values are masked from the data set.

Average Phase Modulation (APM): Similar measurement quality metric as APA normalized across the dynamic light range of the image. Higher is still better, with values approach 1 in best case.

Real Time Analysis (RTA) ifor Studio Software

• Enables user-defined ‘Pass/Fail’ limits applied to measurement results
• Visual Pass/Fail indicators immediately after measurement
• Works with Part Tracking for Multiple Part Testing
• Works at Room Temperature and During Thermal Profile
Combines High Volume Testing with Go/No Go Criteria

Permanent Photo-Patternable Epoxies

SU-8 3000 Series - Permanent Epoxy Negative Resists
• Wide range of film thicknesses in a single coat: 0.5-200μm
• Aspect ratio: >5:1
• Reduced coating stress
• Improved substrate adhesion
• High thermal stability(<250°C)
• High chemical stability(After hard bake)
• Broad Application: MEMS,Opto-electronics,
  DRIE etch mask, Microfluidics, Displays etc.

SU-8 TF 6000 Series - High Resolution Thin Resists
• Photo imageable thin film (0.5 to 10μm) with high resolution patterning capability
• Broadband sensitive (i, g and h-line)
• Low temperature cure (<150°C), photo thermal or thermal only cure
• Highly uniform thin coatings
• Good adhesion to rigid and flexible substrates

KMPR 1000 Series - Temporary/Permanent High Aspect Ratio Negative Resists
KMPR is used as the DRIE etching mask with high aspect ratio pattern. It has also been widely used as a plating mold for MEMS and biological devices. Compared with SU-8, because KPMR reduces cross-link density, make it easier to strip before hard baked. KMPR can be developed in any PMGEA or TMAH developer.

• High aspect ratio imaging(>5:1) with vertical sidewalls
• 5-100μm in a single spin coat
• Excellent metal adhesion
• Excellent plating bath stability

PermiNex - Permanent Wafer Bonding Adhesives
Permanent Wafer Bonding Adhesives for Non-Hermetic Applications
PermiNex 1000 - Solvent Base Develop
PermiNex 2000 - Aqueous Base Develop
PermiNex 1000 and 2000 series are Photo Imageable Wafer Bonding Adhesive, can be used to make the cavity structures. For example, the BAW / SAW / CIS packaging and microfluidic applications requiring precision alignment and low-temperature processes
Material Attributes:
• Permanent Wafer Bonding Adhesives for Non-Hermetic Applications
• Negative Resists
• Low-metal corrosion
• Aspect ratio up to 3:1
• Low process temperature(<200C)
• High-quality, void free bonding
• Superb adhesion to Silicon and Glass
• Work well with subsequent processes (cutting, welding, etc.) and high reliability (HAST, TST)

Permanent Photo-Patternable Epoxies

KMSF 1000 Low Stress Photo-dielectric
Material Attributes:
• Negative-tone, photoimageable dielectric
• Low temperature cure (≤175°C )
• Low residual stress and ultra - low warpage
• High elongation to failure and moderate tensile strength
• Excellent resistance to standard chemicals
• Low shrinkage on cure and good thermal stability
• Good adhesion to Si, SiO2, SiN, Cu and Pl
• Applications : Stress buffer, passivation, RDL

KMSF 2000 Low Dk/Df Photo-dielectric
Material Attributes:
• Negative - tone, photoimageable dielectric
• Low temperature cure (≤200°C)
• 5-10 μm film thickness after cure
• Good thermal and chemical stability
• Can replace polymide film
• Application : Wafer Level Package

Temporary Lift-Off Resists

PMGI & LOR Bi-Layer Lift-Off Resists
Material Attributes:
• Enables high resolution (<0.25μm) metallization lift-off
• Enables thick metal deposition (>3μm)
• Excellent adhesion to Si , GaAs , GaN substrates
• Clean lift-off , even after very high temperature processing
• Often used in the metal deposition process in III-V, microLED and other applications

LOR C
• Complete filling of hole / trenches of aspect ratio (> 1:5) without voids/ bubbles
• The surface flattening effect can be achieved by high heat reflow
• Excellent adhesion to Si, GaAs, GaN substrates
• High thermal stability(<300°C)
• Clean lift-off, even after very high temperature processing

Single Layer Lift-Off Processes

UniLOR N
• Negative Photoresists for Single Layer Liff-off Processes
• 1 to 5 μm film thickness in a single coat
• Adjustable sidewall profile angle
• Aqueous alkaline development (standard 0.26N TMAH developers)
• Pattem thermal stability up to 200°C
• Clean removal with standard photoresist removal chemistries
• Suitable for metal evaporation physical vapor deposition
• Good adhesion to various substrates

Positive Resist for E-Beam Process

PMMA & Copolymer (MMA (8.5) MAA)
PMMA (Polymethacrylate) is a polymeric material well-suited for many imaging and non-imaging micro-electronic applications. PMMA is commonly used for direct write e-beam processes such as T-gate fabrication. PMMA is also used for temporary wafer bonding processes such as wafer thinning, where it's used as a protective layer and the temporary adhesive. PMMA resists are PMMA polymers of specific molecular weights that are dissolved in a solvent, such as anisole (a safer solvent) and then filtered. Exposure, direct write e-beam or X-ray typically, causes a chain scission of the polymer, resulting in a solubility differential between the exposed and unexposed regions of the resist film, leading to very high resolution patterning.
• Well suited for direct write e-beam & X-ray
• High resolution: <0.1μm
• Wide range of molecular weights and viscosities available
• Applications include e-beam writing, multi-layer T-gate lift-off, wafer thinning, etc.
Copolymer resists are based on a mixture of MMA and 8.5% methacrylic acid. Copolymer (8.5) MAA is commonly used in combination with PMMA in bi-layer lift-off processes where independent CD control of the bi-layer resist stack is required. Standard copolymer resists are formulated in ethyl lactate and are available in a broad range of viscosities (film thicknesses).

Temporary Plating Resists

TempKoat™ N 15 - Thick, Negative-tone Temporary Resist
• Thick Photoresist for electroplating
• 7 to 20 μm film thickness in a single coat
• Compatible with typical microbump and RDL plating chemistries

TempKoat™ P 20 - Thick, Positive-tone Temporary Resist
• Thick Photoresist for electroplating
• 10 to 40 μm film thickness in a single coat
• Compatible with typical microbump and RDL plating chemistries

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