Orbray Co., Ltd.

Adachi-ku,,  Tokyo 
Japan
https://orbray.com

• Booth: N0190

The new company name is Orbray since 2023.

Overview

Since 2023, our company has changed its name from “ADAMANT Namiki Precision Jewel Co., Ltd.” to Orbray.

Since we began manufacturing sapphire bearings, we have continuously applied our three core technologies—cutting, grinding, and polishing—to expand our precision processing expertise into various fields. The components produced by Orbray are extremely small and may not be directly visible in everyday life, yet these precision parts quietly play crucial roles around us.

Among them, the Bonding Capillary (wire bonding tool) is one of our flagship products. We use a high-quality zirconia-reinforced alumina ceramic that is different from what other companies use. This material was developed based on years of accumulated technical expertise, breaking through the limitations of conventional processing methods. Through Orbray's proprietary ultra-high-precision machining technology, we have achieved exceptional surface smoothness and uniformity in shape. At the same time, by adding zirconia, we have significantly improved the ceramic's wear resistance, not only extending the product’s lifespan but also enhancing the efficiency and yield of the wire bonding packaging process.

In addition, our company is dedicated to the development of large-diameter diamond substrates. Leveraging the outstanding physical properties of diamond, we aim to meet the core demands of high-performance semiconductor devices in terms of thermal management, radiation resistance, high frequency, and high power. This effort actively contributes to the advancement of the semiconductor industry.

  Press Releases

• 從精密加工 邁向未來創新 (Aug 18, 2025)

  2023年起，「ADAMANT並木精密寶石」正式更名為Orbray，開啟全新品牌篇章。自創立以來，我們始終秉持「切割、研磨、拋光」三大核心精密技術，從藍寶石軸承製造起步，逐步將技術拓展至多元高端產業。

  在眾多產品之中，Bonding Capillary（打線劈刀）為Orbray的代表性產品之一。該產品採用本公司研發的高品質氧化鋯增強氧化鋁陶瓷材料，這一創新源自多年累積的加工經驗與研發成果，突破傳統陶瓷加工的限制。透過自有的超高精度加工技術，我們實現了前所未有的表面光滑度與形狀均一性。氧化鋯的添加進一步強化了陶瓷的耐磨性，不僅顯著延長產品壽命，也有效提升了打線封裝製程的效率與良率，深受半導體封裝產業客戶的肯定。

  除了深耕精密加工技術，Orbray亦積極投入於各種材料開發。其中最受矚目的創新成果之一，就是大口徑鑽石基板的研發。鑽石材料憑藉其優異的熱傳導性、耐輻射性等性能，被視為高性能半導體的終極材料。Orbray將持續深化研發，推動鑽石基板在熱管理和耐輻射裝置等方面的應用，助力全球半導體產業升級。

  Orbray雖以微小零件為主力產品，但這些看不見的「關鍵技術」，正默默支撐著人們的現代生活。我們將持續精進，致力於以日本精密製造為基礎，開創更具前瞻性的未來。

  
  歡迎光臨 Orbray 攤位：N0190，了解更多創新產品與技術應用。

• From Precision Machining to Future Innovation (Aug 18, 2025)

  In 2023, Adamant Namiki Precision Jewel Co., Ltd., officially rebranded as Orbray, marking the beginning of a new chapter in our brand’s journey. Since our founding, we have upheld our three core precision technologies—cutting, grinding, and polishing, starting with sapphire bearing production and gradually expanding our expertise into a wide range of high-end industries.

  Among our many products, the Bonding Capillary (wire bonding tool) stands out as one of Orbray’s flagship offerings. It is made from a proprietary high-quality zirconia-reinforced alumina ceramic material developed in-house. This innovation, born from years of accumulated machining expertise and R&D, overcomes the traditional limitations of ceramic processing. Leveraging our ultra-high-precision machining technology, we have achieved unprecedented surface smoothness and shape uniformity. The addition of zirconia further enhances the wear resistance of the ceramic, significantly extending the product’s lifespan while improving the efficiency and yield of the wire bonding process—earning strong praise from customers in the semiconductor packaging industry.

  Beyond our expertise in precision machining, Orbray is also actively engaged in the development of advanced materials. One of our most notable innovations is the development of large-diameter diamond substrates. Diamond, with its exceptional thermal conductivity and radiation resistance, is regarded as the ultimate material for high-performance semiconductors. Orbray continues to deepen its R&D efforts to promote the application of diamond substrates in areas such as thermal management and radiation-resistant devices, contributing to the advancement of the global semiconductor industry.

  While Orbray primarily produces micro-scale components, these often-invisible "critical technologies" quietly support modern life. We are committed to continuous advancement, striving to pioneer a more forward-looking future built upon the foundation of Japanese precision manufacturing.

  Visit us at Orbray Booth: N0190 to discover more innovative products and technical solutions.

• 鑽石半導體基板生產技術及其應用 (Aug 19, 2025)
  鑽石半導體的優良物性
  鑽石被譽為「終極功率半導體材料」，擁有多項卓越的物理特性，例如：
  •           帶隙寬，具有極高的擊穿電場強度
  •           載流子遷移率高，電力損耗低
  •           即使在高溫或輻射等極端環境中，也能穩定運行
  憑藉這些特性，鑽石半導體在功率器件以及極端條件下運行的控制裝置中展現出廣闊的應用潛力。
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  應用領域
  通信衛星
  鑽石半導體的代表性應用之一便是通信衛星。為了實現與地面之間的無線通信，通信衛星需要高頻、高功率設備。以往多採用真空管，但真空管體積龐大、能量損失嚴重，效率低下。
  相比之下，鑽石半導體體積小巧，卻能耐受通信衛星所需的頻率和功率，實現高效信號放大；同時具有良好的耐熱和抗宇宙射線能力，能夠保證穩定運行。
  本公司已在空間站進行了長期暴露實驗，正穩步邁向實用化。
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  輻射傳感器
  2011年3月的東日本大地震引發福島第一核電站放射性物質洩漏事故，事故後，核電站周邊的傳感器因輻射而受損，電子設備難以正常運行，至今廢爐尚未完成，核電站仍處封鎖狀態。
  針對這一現狀，日本國內積極推動將鑽石半導體應用於廢爐技術的研發。鑽石半導體器件可在高溫（約 300 °C）及強輻射（約 300 MGy）環境下穩定運行，適用於極端條件。
  ________________________________________
  量子電腦
  量子電腦可在特定計算任務上實現遠超傳統計算機的運算速度。儘管日本已有政府研究機構取得一定成果，但現有設備規模小、穩定性不足，實用化仍存在諸多挑戰，其中之一便是「高精度可控量子比特的缺乏」。
  以往的量子比特難以長期維持量子態，亦難以穩定訪問。為此，日本的大學研究組致力於利用鑽石實現更易於控制的量子比特。
  所謂鑽石 NV 中心（Nitrogen Vacancy Center）是一種晶格缺陷，由於將碳原子替換為氮原子而形成，因其所捕獲的自旋能夠長時間保持量子態。
  研究組提出了新方法（光尋址量子門）：通過光選定目標 NV 中心，並利用高可靠性的微波與射頻波進行量子控制。實驗已證明該方法能實現高空間解析度與高保真度的自旋操作。
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  大口徑鑽石基板製備面臨的挑戰
  至今，研究用途常採用高溫高壓條件下合成的人工鑽石，通常經歷一周以上的長時間生長，才能獲得適用於半導體的高質量鑽石。
  然而，若要實現鑽石半導體的產業化，需要大量器件，這就要求具備更大尺寸的鑽石基板作為基礎支持。
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  Orbray 的晶體生長技術
  本公司長期致力於高純度、大面積鑽石基板的研發。
  Micro Needle 法— 2014 年提出
  2014 年申請了「Micro Needle 法」相關專利。在銥／藍寶石基板上形成類似針狀的眾多細長鑽石柱，以此為基礎成長為大的單一基板。通過該方法，我們成功製備出直徑 1 英寸的鑽石基板。
  但該方法工藝複雜、成本較高。
  Step Flow 法— 2021 年開發
  因此，2021 年我們開發了「Step Flow 法」。通過使藍寶石基板略微傾斜進行結晶生長，大幅降低薄膜應力，製備出缺陷少的高質量鑽石基板。
  採用該方法，我們製得了直徑 2 英寸的鑽石基板，且顯著降低了生產成本。
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  表面研磨技術
  要在半導體基板上製造器件，需將基板表面平滑化並通過膠體矽石實現化學機械拋光（CMP）。然而，鑽石作為自然界最硬物質，傳統研磨方法難以應對。
  憑藉多年積累的加工技術，我們實現了鑽石原子級平滑表面；針對 CMP，我們開發了獨有工藝，成功完成傳統方法無法實現的高精度加工。
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  總結
  通信衛星、廢爐設備、量子計算機等多個領域中，鑽石半導體顯示出廣泛應用前景，但要實現實用化，高質量、大面積鑽石基板的量產仍具挑戰。
  Orbray 致力於鑽石基板的晶體生長與表面處理研發多年，成果已使鑽石半導體的市場化指日可待。未來，我們將持續推進鑽石半導體基板生產，為下一代技術發展貢獻力量。

• Diamond Semiconductor Substrate Production Technology and Its Applications (Aug 19, 2025)
  Excellent Properties of Diamond Semiconductors
  Diamond is known as the "ultimate power semiconductor material" due to its multiple outstanding physical properties, such as:
  • Wide bandgap, providing extremely high breakdown electric field strength
  • High carrier mobility with low power loss
  • Stable operation even under extreme conditions such as high temperature or radiation
  Thanks to these characteristics, diamond semiconductors show great potential for applications in power devices as well as control equipment operating under extreme environments.
   
  Application Fields
  Communication Satellites
  One representative application of diamond semiconductors is in communication satellites. To enable wireless communication with the ground, communication satellites require high-frequency and high-power devices. Traditionally, vacuum tubes were used, but they are bulky, have significant energy loss, and are inefficient.
  In contrast, diamond semiconductors are compact yet capable of withstanding the frequencies and power levels needed by communication satellites, enabling efficient signal amplification. They also have excellent heat resistance and radiation tolerance, ensuring stable operation.
  Our company has conducted long-term exposure experiments on space stations and is steadily moving towards practical application.
   
  Radiation Sensors
  The Great East Japan Earthquake in March 2011 triggered a radioactive leak accident at the Fukushima Daiichi Nuclear Power Plant. Following the accident, sensors around the plant were damaged by radiation, causing electronic equipment malfunction. As a result, decommissioning has not been completed, and the plant remains sealed.
  In response, domestic efforts in Japan are actively developing technologies to apply diamond semiconductors for decommissioning. Diamond semiconductor devices can operate stably under high temperatures (around 300°C) and strong radiation (around 300 MGy), making them suitable for harsh environments.
   
  Quantum Computers
  Quantum computers can perform specific computations much faster than classical computers. Although Japanese government research institutions have achieved certain successes, existing devices remain small-scale and unstable, with many challenges towards practical application. One of these challenges is the lack of highly controllable qubits.
  Conventional qubits have difficulty maintaining quantum states for long and are hard to access reliably. To address this, research groups at several Japanese universities are working to realize easily controllable qubits using diamond.
  The so-called diamond NV center (Nitrogen Vacancy Center) is a lattice defect formed when carbon atoms are replaced by nitrogen atoms, and the spin trapped in this defect can maintain quantum states for a long time.
  The research groups have proposed a novel method called “optical-addressed quantum gates”: using light to select the target NV center, and performing quantum control with reliable microwaves and radio waves. Experiments have demonstrated that this method enables high spatial resolution and high-fidelity spin manipulation.
   
  Challenges in Fabricating Large-Diameter Diamond Substrates
  So far, synthetic diamonds produced under high-temperature, high-pressure conditions have been used for research purposes. These diamonds are slowly grown over more than a week to achieve high quality suitable for semiconductor applications.
  However, industrializing diamond semiconductors requires a large number of devices, which in turn demands larger diamond substrates as a base.
   
  Orbray’s Crystal Growth Technology
  Our company has long been committed to developing high-purity, large-area diamond substrates.
   
  Micro Needle Method — Proposed in 2014
  In 2014, we filed patents for the “Micro Needle method.” This technique forms many needle-like diamond pillars on iridium/sapphire substrates, which then grow into a single large substrate. Using this method, we successfully fabricated 1-inch diameter diamond substrates.
  However, this method is complex and costly.
   
  Step Flow Method — Developed in 2021
  Therefore, in 2021, we developed the “Step Flow method.” By slightly tilting the sapphire substrate during crystal growth, this method significantly reduces film stress, enabling the production of high-quality diamond substrates with fewer defects.
  Using this method, we succeeded in producing 2-inch diameter diamond substrates while notably reducing production costs.
   
  Surface Polishing Technology
  To manufacture devices on semiconductor substrates, the substrate surface must be smoothed and finished by chemical mechanical polishing (CMP) using colloidal silica. However, since diamond is the hardest natural material, traditional polishing methods are ineffective.
  Leveraging years of accumulated processing expertise, we have achieved atomic-level smooth diamond surfaces. Regarding CMP, we developed a proprietary process that enables high-precision polishing unattainable by conventional methods.
   
  Summary
  Diamond semiconductors show broad application prospects in fields such as communication satellites, decommissioning equipment, and quantum computers. However, mass production of high-quality, large-area diamond substrates remains a significant challenge for practical use.
  Orbray has dedicated many years to developing crystal growth and surface processing technologies for diamond substrates. As a result, the commercialization of diamond semiconductors is now within reach. Moving forward, we will continue advancing diamond semiconductor substrate production to contribute to next-generation technological development.

  Products