The technological evolution of EV, 5G has resulted in an increasing number of electronic circuit boards becoming smaller and denser (double-sided) and BGA, LGA mounting, and the required level of inspection difficulties is rapidly increasing.
In addition, the quality requirements of the market continue to grow, as process assurance and check of sampling by X-ray analyzers require exhaustive X-ray inspection.
VT-X750 supports its long-term response to market demands through high-quality CT inline testing.