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A SUN PHOTONICS CO., LTD.

台北市,  Taiwan
https://asun-photonics.com/
  • Booth: Q5737

ASP provides high-precision cutting tools and laser systems.

Overview

Introducing Global Top Brands
Established in 2002, Asp Group initially represented the Universal Laser System from the USA, providing laser engraving and cutting machines to the model-making industry that previously relied on manual cutting. We also represented Japan's AXISMATERIA, supplying ultra-hard alloy materials for PCB micro drill bits. As we progressed, we identified market needs and expanded our representation to include Sumitomo Electric's cutting tools, Sinfonia servo motors, ATOM's ultra-hard cutting drills, and YUKIWA fixtures. Our reach now extends across various fields, including aerospace, semiconductors, electronics, machinery manufacturing, automotive, medical, education, and creative industries.

Professional Technical Team
 Asp Group boasts a professional team specializing in laser technology applications and after-sales services, earning high praise from numerous clients over the past two decades. In the cutting tools sector, we have a team of processing technology consultants from Japan, and in the ultra-hard alloy field, we offer material analysis through our laboratory. Our accumulated technology, strength, and reputation form the foundation of our ability to continuously provide excellent services to our customers.

Exceeding Your Expectations
"Becoming an indispensable friend to our customers and cultivating more outstanding talents" is our business philosophy.

Since 2002, we have been dedicated to helping customers solve production problems, providing professional assessments for various industries, and offering comprehensive after-sales services. We continue to deliver solutions to over 1,000 users, successfully addressing various production technology challenges.


  Press Releases

  • With the new round of AI craze set off by big models such as NVIDIA, ChatGPT, and DeepSeek, chips are becoming more and more the focus of public attention. The rapid development of artificial intelligence, 5G communications, high-performance computing and other fields cannot be separated from the support of high-end chip manufacturing.

    ATOM-Semiconductor

    As chip packaging types become more and more complex, chip testing has become an important part of chip production to ensure the yield rate of chips. As a key fixture in the chip testing process, the chip test socket has been increasingly valued by the industry, especially in this era of shrinking chip size and increasing signal transmission speed, pushing products towards a more stable and reliable direction. Therefore, the successful launch of each chip is inseparable from the chip test socket (IC Socket)!

    Socket material micro-hole processing, a new blue ocean for the semiconductor industry

    According to the analysis of the research organization Yole Group, the global semiconductor test socket market covers categories such as package test, system level test, and engineering test. The market size is estimated to grow from US$1.193 billion in 2024 to US$1.55 billion in 2029, with a compound annual growth rate of 5.4% during the period.

    ATOM-Semiconductor

    The principle of the chip test socket is to use micro-holes to physically limit the needle body, ensuring that each pin maintains a consistent contact angle and position within a very small tolerance range, thereby avoiding signal interference, poor contact and other problems. For this reason, the micro-holes on the test socket not only directly determine the electrical performance and service life of the test socket, but also are the basic process core for achieving high-speed, high-density stable chip testing.

    At present, the commonly used materials for chip test sockets (Sockets) are engineering plastics and machinable ceramics, which have high strength and high hardness characteristics and are difficult to process. In addition, the diameter of the micro-holes is usually between tens and hundreds of microns, and μ-level precision control is required, taking into account verticality and finish to ensure that the spring pins are accurately guided and the contact is stable.

    To cope with the extreme micro-hole processing of socket materials, two series of ATOM are launched

    How to achieve the ultimate micro-hole processing requirements of socket materials? Japan's ATOM , an expert in micro-diameter drills , has launched two high-performance series of products specifically for the challenges of micro-hole processing in chip packaging testing , helping semiconductor-related fields to efficiently break through the challenges of micro-hole processing!

    1. ADR standard series drill bits

    ATOM Drill Bit-ADR

    The minimum diameter of the ADR series can reach Ø0.02mm , and the diameter tolerance is less than −0.005mm . It is suitable for processing tiny holes in materials such as steel, non-ferrous metals and resins.

    2. ADR-SV standard coating series drill bits

    ATOM Drill Bit-ADR-SV

    ADR-SV series drills use wear-resistant FCS coating and are suitable for micro-hole processing in soft steel and high-hardness steel (HRC50). This series is designed with a wider chip groove and polished cutting edge, which greatly improves chip removal and processing quality , effectively extending the service life of the drill.

    After repeated tests and extensive market verification, the two series of drill types have excellent performance in the actual processing of micro-holes in socket materials , and are therefore widely praised by the market:

    1. Engineering- plastics

    ATOM drill bit-micro hole processing of engineering plastic substrate

    ATOM micro-drilling test: Micro-hole processing effect of 0.09mm thick engineering plastic substrate

    2. Machinable Glass Ceramic

    ATOM drill bit - can process micro-holes on ceramic substrates

    ATOM micro-drilling test: Micro-hole processing effect of machinable ceramic substrate

    In addition to being widely used on chip test sockets made of different materials, the two drill types are also suitable for a variety of high-performance materials such as ceramic plastics, single crystal silicon, and aluminum , and have important application value in high-precision structure manufacturing and electronic component processing.

    3. Ceramic plastic

    ATOM Drill Bits-Ceramic Plastic Processing

    ATOM micro-drilling test: 1.71mm thick ceramic plastic processing effect

    4. Single crystal silicon

     ATOM drill bit-single crystal silicon material processing

    ATOM micro-drilling test: Drilling effect of 1.68mm thick single crystal silicon material

    5. Aluminum

     ATOM drill bit-aluminum micro hole processing

    ATOM micro-drilling test: Aluminum micro-hole processing effect

    Advanced coating, chip removal design, and strong carbide substrate make the ADR and ADR-SV series have unparalleled processing quality and efficiency when processing micro-holes in metals, non-metals, ceramic materials, engineering plastics, etc. After repeated testing, under the same working conditions, its cutting life is more than 80% higher than similar products on the market , making it an ideal choice for micro-hole processing such as chip test sockets!

    See more drill bits: https://asun-photonics.com/product-category/atom/

    ASP Group: Using world-leading technology to help upgrade precision hole processing

    Yuewei Technology-ATOM Drill Bit

    ASP Group is the general agent of the Japanese ATOM brand in Taiwan, focusing on the promotion and service of high-quality micro-diameter tools. Relying on the strong manufacturing and quality control capabilities of the original ATOM factory, as well as ASP Group's advantages in logistics supply and technical support, it can now provide a rich product line including standard drills ADR, standard coated drills ADR-SV, fixed-point drills NC, chip removal drills ASWR/ASW D, diamond-like coated drills ADR-DLC, same-shank diameter drills ADS and cross-groove series drills SXG, etc., to fully meet various high-precision micro-hole processing needs and help customers achieve dual improvements in processing quality and efficiency.

    1. Available from stock:

    ASP Group has a rich stock of spot stocks, which can support the spot supply of ADR standard drill series and ADR-SV standard coated drill series Ø0.02mm~ Ø1.0mm ( one standard every Ø0.01mm ).

    2. High-efficiency delivery:

    ASP Group has more than 20 years of experience in micro-hole processing technical services. It not only provides customers with professional demand analysis and application suggestions, but also relies on its strong supply chain advantages to help customers achieve spot delivery of standard drill bits within one week.

      Contact Us  

    According to data from the Semiconductor Industry Association (SIA), global sales reached US$630.5 billion in 2024, a year-on-year increase of 19.1%, exceeding US$600 billion for the first time. The explosion in demand for AI chips and memory chips has become a key engine.

    ATOM-Semiconductor

    Nowadays, the demand for high-tech fields such as AI and robots has increased greatly. As the key to chip packaging and testing, the technical level of chip test socket micro-hole processing is directly related to the overall test accuracy and reliability. ASP Group looks forward to providing solid support for semiconductor high-end chip testing through continuous technological innovation and process breakthroughs, so that more precise and efficient micro-hole processing technology can accelerate the independent control of core technologies in the semiconductor field.


    【International Semiconductor Exhibition|SEMICON Taiwan 2025 Exhibition Information】

    Exhibition time: September 10, 2025 ~ September 12, 2025

    Exhibition location: 1F, Hall 2, Taipei Nangang Exhibition Center (No. 2, Jingmao 2nd Road, Nangang District, Taipei City)

    ASP Group Booth: Q5737

    Yuewei Technology-SEMICON TAIWAN 2025

    ASP Group sincerely invites you to visit SEMICON Taiwan 2025 !

    We sincerely invite you to visit booth Q5737 to experience the technological breakthrough of ATOM ultra-micro drill in precision machining and gain a deeper understanding of its application potential in semiconductor manufacturing.
    Let us explore the future of manufacturing technology and open a new chapter of high efficiency and high precision!

  • With rapid advancements in AI, 5G, and High-Performance Computing (HPC), the printed circuit board (PCB) industry is undergoing an unprecedented phase of expansion. The increasing demand for high-speed data transmission and high-density packaging in advanced servers and AI chips is driving widespread adoption of HDI and high-frequency/high-speed substrates. As drilling density and precision requirements intensify, the market demand for high-performance micro drill materials is surging.

    Among the available options, AXISMATERIA tungsten carbide rods—developed by Sumitomo Electric Industries—stand out for their exceptional hardness, toughness, and structural consistency. These rods are widely used in high-end PCB micro drill manufacturing for applications such as AI servers, high-frequency boards, and composite material drilling.

    PCB板-AXISMATERIA 超硬質合金鑽針


    Entering the Era of “Zero Drill Breakage” – Raising the Bar for Material Quality

    The explosive growth of AI applications has led to more complex substrate structures. Today, multilayer boards can contain over 40 layers, combining materials with widely varying hardness levels. Micro drills must now penetrate these stacked structures in a single drilling process, placing significant demands on tool material and design.

    At the same time, skyrocketing demand and raw material price increases are putting pressure on manufacturers to improve yield rates. Where a drill breakage rate of a few parts per thousand was once acceptable, today’s standards are rising to below 0.0003—pushing the industry into a “zero-breakage era.”

    PCB鑽針材料首選-硬質合金 AXISMATERIA 住友電工


    AXISMATERIA – Engineered for Reliability and Precision

    AXISMATERIA continuously enhances its tungsten carbide rod technology. Key technical features include:

    • Optimized Grain Structure: Refined distribution of tungsten carbide (WC) grains results in a more uniform and fine microstructure.

    • Stable Cobalt Content: Maintains excellent fracture resistance and toughness under high-strength and high-precision conditions.

    • HIP (Hot Isostatic Pressing): All raw rods undergo HIP treatment, enhancing material density and mechanical strength while minimizing internal defects and cracks.

    AXISMATERIA Hot Isostatic Pressing(HIP)

    △ Before HIP Uneven WC and cobalt distribution

    AXISMATERIA Hot Isostatic Pressing(HIP)

    △ After HIP Highly uniform cobalt dispersion and fine, consistent WC grain size


    Technical Specifications | AXISMATERIA Carbide Rods for Micro Drills

    Material

    Avg. Grain Size (μm)

    Co Content(%)

    Hardness(HRA)

    TRS(GPa)

    Fracture Toughness(MPa·m½)

    AF209

    0.2

    9

    93.5

    4.0

    5.5

    AF308

    0.3

    8

    93.6

    3.8

    6.0

    AF308H

    0.3

    8

    93.7

    4.6

    6.1

    *All models are suitable for 0.1–0.8 mm micro-drilling and compatible with high-speed spindle applications.


    Three Key Material Requirements for High-Performance PCB Micro Drills

    To ensure reliable performance, PCB drill blanks must meet the following criteria:

    1. High Hardness – For wear resistance and maintaining precision over high-volume drilling.

    2. High Toughness – To prevent chipping and reduce drill breakage risk.

    3. Superior Wear Resistance – To ensure consistent quality and long service life.

    AXISMATERIA’s tungsten carbide rods are engineered specifically to meet these demands, helping tool manufacturers increase yield, extend tool life, and minimize downtime.

    Explore AXISMATERIA Tungsten Carbide Rods: click


    Material Innovation Driving the Next Generation of Micro Drilling Solutions

    As PCBs evolve toward higher layer counts and tighter tolerances, cutting tool materials have become a critical part of semiconductor back-end processes. Far from being simple consumables, they now directly impact packaging yield and overall manufacturing efficiency.

    Leveraging Sumitomo Electric’s powder metallurgy expertise and global support network, AXISMATERIA offers a wide range of premium tungsten carbide rods, delivering advanced material solutions for next-generation PCB drilling applications.

      Processing consultation 


    Visit ASP at SEMICON Taiwan 2025 – Booth Q5737

    Looking to learn more about AXISMATERIA carbide rod solutions? Meet the ASP team at Booth Q5737 during SEMICON Taiwan 2025!

    [Event Details]
    Event: SEMICON Taiwan 2025
    Date: September 10 (Wed) – September 12 (Fri), 2025
    Venue: 1F, Taipei Nangang Exhibition Center, Hall 2
    Booth No.: Q5737

    Product Info :https://asun-photonics.com/product-category/axismateria/


    【Contact Information】
    📞 Tel: +886-2-26327601
    📠 Fax: +886-2-26327604
    📱 LINE Official: https://line.me/R/ti/p/%40332yetoa
    🌐 Website: https://asun-photonics.com/

  • As semiconductor manufacturing continues to push toward finer geometries and increased material hardness, Sumitomo Electric introduces its Diamond-Grade Machining Solutions for hard and brittle materials.
    At SEMICON Taiwan 2025, visitors to the Yueh Wei Technology booth (Q5737) will experience Sumitomo’s advanced diamond cutting tools—designed to overcome the limits of ultra-hard material and difficult-to-machine component processing.

    住友鑽石切削工具


    NPD10 – The Ultimate Solution for Ultra-Precision Machining
    Engineered specifically for ultra-hard material precision processing, NPD10 utilizes binderless nano-polycrystalline diamond (NPD) technology, combining extreme hardness with exceptional wear resistance.
    Capable of handling micro-cutting applications for tungsten carbide, ceramics, and other brittle materials, NPD10 delivers longer tool life and higher machining accuracy compared with conventional diamond tools—boosting productivity and reducing overall costs.


    DA90 – High-Efficiency, High-Accuracy Rough Machining
    Incorporating a coarse-grain polycrystalline diamond structure with reinforced particle bonding, DA90 offers outstanding wear resistance and chipping resistance—making it the go-to choice for rough machining of tungsten carbide and other brittle materials.
    Even under heavy cutting loads, DA90 maintains sharp edges and stable performance. When paired with SUMIDIA NF inserts, DA90 delivers not only consistent performance but also excellent cost efficiency.

    住友鑽石刀具DA90


    NPDB – Achieving Mirror Finishes on Ultra-Hard Materials
    The NPDB end mill series features 100% binderless nano-polycrystalline diamond, with hardness exceeding that of single-crystal diamond. It offers superior wear and chipping resistance, enabling direct mirror finishing of tungsten carbide and other ultra-hard brittle materials.
    This significantly reduces post-polishing time, enhances machining efficiency, and is ideal for high-precision and mirror-surface applications.

    NPDB 住友鑽石銑刀


    NCB100 – Next-Generation Binderless CBN for Difficult-to-Machine Metals
    With higher hardness and thermal conductivity than conventional CBN, NCB100 enables efficient, high-accuracy machining of difficult-to-machine materials such as titanium alloys and Co-Cr alloys.
    NCB100 is particularly suited for machining high-strength metallic components in semiconductor equipment, aerospace-grade materials, and advanced biomedical parts—offering extended tool life and exceptional dimensional stability.

    Processing consultation


    SEMICON Taiwan 2025 – Exhibition Information

    • Date: September 10 – 12, 2025

    • Venue: Taipei Nangang Exhibition Center, Hall 2, 1F
      (No. 2, Jingmao 2nd Rd., Nangang District, Taipei, Taiwan)

    • Yueh Wei Technology Booth: Q5737

    Yueh Wei Technology sincerely invites you to visit SEMICON Taiwan 2025 and experience the next revolution in diamond-grade machining. In the battle for precision hard-material processing, Sumitomo Electric continues to lead as a key enabler of ultra-high-accuracy manufacturing.

    Learn more about Sumitomo Cutting Tools:
    https://asun-photonics.com/product-category/sumitomo/


    Contact Information:
    Tel: +886-2-26327601
    Fax: +886-2-26327604
    LINE@ Customer Service: https://line.me/R/ti/p/%40332yetoa
    Website: https://asun-photonics.com/

  • In the semiconductor manufacturing process, Shower Head is one of the common and important components in a plasma etcher (Plasma Etcher) or a chemical vapor deposition machine (CVD). Its name comes from its appearance and function similar to a shower head in a bathroom.

    ATOM微鑽在Shower Head(鋁合金材質)加工效果

    ATOM micro-drilling on Shower Head (aluminum alloy) processing effect

    Although it looks like a shower head, the price of a Shower Head is as high as over 400,000 yuan. The fundamental reason for its high cost is the extremely stringent processing requirements - there are thousands of micro-holes on the surface, which not only imposes extremely high standards on the accuracy and consistency of the hole diameter, but also places almost stringent requirements on the smoothness and flawlessness of the inner wall of the hole.

    Shower Head, a business opportunity but with strict process requirements

    According to Techcet's forecast, the global semiconductor Shower Head market size will be approximately US$2.5 billion in 2023, and is expected to grow to US$3.5 billion by 2028, with a compound annual growth rate (CAGR) of 6.9%. This is mainly due to the improvement of film deposition process requirements for advanced process chips (such as 3nm and below), and the demand for high-quality films due to the increase in the number of 3D NAND memory layers.

    The most widely used metal material in Shower Head is aluminum alloy, because it has good thermal conductivity and strong corrosion resistance. Non-metallic Shower Head materials include silicon carbide (CVD-SIC), single crystal silicon, quartz glass and high-purity ceramics.

    ATOM微鑽在Shower Head(鋁合金材質)加工效果

    Aluminum alloy Shower Head

    During the wafer reaction process, the surface of the gas diffusion plate is densely covered with micropores (pore diameter 0.2-6 mm). Special process gases need to pass through precisely designed pore structures and gas paths, and then be evenly deposited on the wafer surface after passing through thousands of small holes on the gas diffusion plate. The film layers in different areas of the wafer must ensure high uniformity and consistency.

    ATOM微鑽Shower Head加工效果(正、反面)

    ATOM micro-drilling Shower Head processing effect (front and back)

    Therefore, in addition to extremely high requirements for cleanliness and corrosion resistance, the gas diffusion plate also has strict requirements on the consistency of the aperture of the small holes and the burrs on the inner wall of the small holes. If the aperture size tolerance and consistency standard deviation are too large or there are burrs on any inner wall, it will cause the thickness of the deposited film layer to be inconsistent, which will directly affect the manufacturing yield of the equipment.

    ATOM, the expert in micro-diameter drills, challenges the micro-hole processing problem with extreme precision

    How to achieve the extreme micro-hole processing needs of Shower Head, a key component in the high-end semiconductor segment?

    ATOM, the expert in micro-diameter drills in Japan, has launched two high-performance series of products specifically for the extreme micro-hole processing challenges such as Shower Head (aluminum alloy), helping semiconductor-related fields to efficiently break through the micro-hole processing challenges!

    1. Fixed-point guided drilling NC: precise positioning, starting from the "hole"

    定點引導鑽NC

    Designed for high-precision, small-diameter guide holes (positioning), suitable for applications with extremely high hole position accuracy requirements.

    (1) Processing range Ø0.02mm~Ø3.0mm, meeting various micro-hole positioning needs.

    (2) Two drill point angles of 120° and 90° are available, taking into account both precise positioning and chamfering.

    (3) With 3.0mm and 3.175mm tool holders.

    (4) Suitable for materials such as steel, PEEK engineering plastics, non-ferrous metals and resins.

    (5) Fully one-piece molding of all-tungsten steel material, with TiAlN coating, HRA hardness of about 90, wear-resistant and stable.

    未使用ATOM定點鑽

           Without ATOM fixed-point drilling           

    使用ATOM定點鑽加工效果

    Processing effect with ATOM fixed-point drilling

    It can be clearly seen from the above figure that without using the ATOM-NC fixed-point drill, obvious surface vibration and concentricity deviation occurred in the processing of the 1.6mm diameter; while with the ATOM fixed-point drill, the situation was significantly improved. Although it is just a small pre-positioning step, it is directly related to the stability and accuracy of subsequent micro-hole processing. Ignoring it may even cause the entire workpiece to be scrapped, resulting in unnecessary losses.


    2. Diamond-like coating drill bit DLC: wear-resistant blade protection, improved efficiency

    類鑽塗層鑽頭DLC:耐磨護刃,效率提升

    (1) The DLC Shine Coating technology is used, which has ultra-high hardness (sp³ value up to 60GPa), significantly extending the tool life.

    (2) The ultra-thin coating with low friction coefficient effectively prevents chip adhesion, reduces cutting resistance, and improves chip removal.

    (3) The minimum diameter is Ø0.1 to Ø1.0, with a standard specification every Ø0.01mm.

    (4) Suitable for non-ferrous metal materials such as aluminum alloy and copper.

    ATOM can also customize center-drill heads. You only need to tell us the hole diameter, depth, and workpiece material, and we will provide you with the most suitable solution! When used in Shower Head processing, ATOM micro-drilling can greatly improve chip removal efficiency and significantly improve the roughness of the hole wall to achieve a smoother processing surface.


    Shower Head 階段孔剖面照

    Shower Head 階段孔剖面照

    ATOM Micro-Drilling Shower Head Stage Hole Cross-Section

    After repeated verification, the two series of ATOM can maintain extremely low tool wear even in large-scale micro-hole processing with their excellent wear resistance and ultra-long tool life, ensuring high consistency of micro-hole diameter and excellent surface finish, fully meeting the stringent requirements of aluminum alloy Shower Head for ultimate processing quality.

    Learn more about drills :https://asun-photonics.com/product-category/atom/

    ASP Group: Using world-class technology to help upgrade precision hole processing

    ASP Group is the general agent of the Japanese ATOM brand in Taiwan, focusing on the promotion and service of high-quality micro-diameter tools. Relying on the strong manufacturing and quality control capabilities of the ATOM original factory, as well as ASP Group's advantages in logistics supply and technical support, it can now provide a rich product line including standard drills ADR, standard coated drills ADR-SV, fixed-point drills NC, chip removal drills ASWR/ASWD, diamond-like coated drills ADR-DLC, same-shank diameter drills ADS and cross-groove series drills SXG, etc., to fully meet various high-precision micro-hole processing needs and help customers achieve dual improvements in processing quality and efficiency.

    1. Spot supply:

    ASP Group has a rich stock of spot stocks, which can support the spot supply of ADR standard drill series and ADR-SV standard coated drill series Ø0.02mm~ Ø1.0mm (one standard specification for each Ø0.01mm).

    2. High-efficiency delivery:

    ASP Group has more than 20 years of experience in micro-hole processing technology services. It not only provides customers with professional demand analysis and application suggestions, but also relies on its strong supply chain advantages to help customers achieve spot delivery of standard drills within one week.

      Contact Us  


    As semiconductor high-end manufacturing moves towards higher quality, the micro-hole processing quality of the Shower Head, as a key component, has become a key factor affecting the overall process yield.

    ATOM微鑽-突破Shower Head微孔加工難題

    ASP Group has teamed up with Japan's ATOM to use the ultimate micro-drilling technology to jointly provide the semiconductor industry with more stable and efficient micro-hole processing solutions. By continuously deepening the development of micro-diameter tool technology, it helps more advanced manufacturing scenarios achieve the leap from "machinability" to "excellent processing."

  • Universal Laser Systems Showcases at SEMICON Taiwan 2025

    As a global leader in laser processing systems, Universal Laser Systems (ULS) will present its cutting-edge laser solutions at SEMICON Taiwan 2025, held from September 10–12 at Taipei Nangang Exhibition Center, Hall 2, 1F. Visitors can meet ULS at the Yueh Wei Technology booth (Q5737) to explore innovative laser applications in precision thin-film processing and laser marking.

    At this year’s exhibition, ULS will demonstrate its professional, innovative laser technologies designed for thin-film processing, laser marking, precision manufacturing, and advanced electronic packaging. Engineered for high-quality, high-efficiency production, ULS systems combine proprietary technologies to meet the most demanding industrial requirements.

    採用10.6微米CO2雷射的壓克力塑膠雷射切割蜂巢圖案


    As the semiconductor industry moves toward higher-density, multi-layer advanced packaging, material processing demands greater precision and efficiency. The ULTRA Series from ULS features MultiWave Hybrid™ technology, enabling flexible processing of heterogeneous materials and ultra-thin film structures with unmatched accuracy and stability.

    With a built-in Intelligent Materials Database, the ULTRA system offers one-click parameter settings for materials such as polyimide (PI), polyethylene terephthalate (PET), and polyamide (PA), as well as multi-layer structures with optical or insulating functions. This enables low heat-affected zones and superior edge quality in laser cutting and micromachining.

    For essential product identification and traceability in manufacturing, the ULTRA system integrates SuperSpeed™ high-speed marking mode and the HPDFO™ (High Power Density Focusing Optics) module. These features deliver crisp, high-contrast marking of text, QR codes, and serial numbers—without damaging the substrate.
    Applications include semiconductor device packaging, printed circuit boards (PCBs), conductive films, and sensor labeling, proving the indispensable value of laser marking in production management.

    使用9.3 µm CO2雷射器進行雷射切割、鑽孔和打標的Kapton™

    使用1.06 µm光纖雷射器進行打標的不銹鋼。


    Seamless Integration & Low-Maintenance Operation

    ULS systems support a wide range of design software, including CAD, Adobe Illustrator, and CorelDRAW, with full cross-platform compatibility for streamlined workflows. The air-cooled metal laser design ensures high stability, no consumables, and no water cooling—delivering low-maintenance, production-ready performance ideal for automation and digital manufacturing environments.


    Industry professionals from semiconductor, electronics manufacturing, and materials technology sectors are warmly invited to visit and experience how ULS laser solutions can empower the future of high-precision manufacturing.


    Exhibition Information

    • Event: SEMICON Taiwan 2025

    • Date: September 10–12, 2025

    • Venue: Taipei Nangang Exhibition Center, Hall 2, 1F
      (No. 2, Jingmao 2nd Rd., Nangang District, Taipei, Taiwan)

    • Booth: Q5737


    Contact Information
    Tel: +886-2-26327601
    Fax: +886-2-26327604
    LINE@ Customer Service: https://line.me/R/ti/p/%40332yetoa
    Website: https://asun-photonics.com/


  Products

  • ATOM Micro Drill
    Saito Seisakusho Co., Ltd since 1934,with the mainstream products, "Drill" "End mill" and "Special cutter",.Our products are currently used in the semiconductor, auto, electronics, medical equipment, and mold manufacturing to name a few....

  • "ATOM Micro-Diameter Drill" Challenges Semiconductor Ultra-Micro Hole Processing Technology

    In response to the problem of micro-hole processing in chip packaging testing, ATOM has launched multiple solutions. The following two series are highly respected in the industry:

    ADR Standard Series Drill

    The minimum diameter of the ADR series can reach Ø 0.02mm, and the diameter tolerance is less than −0.005mm. It is suitable for micro-hole processing of materials such as steel, non-ferrous metals and resins. Yuewei Technology is the general agent of ATOM in Taiwan and China, with sufficient inventory and efficient delivery services.

    ADR-SV Standard Coated Series Drill

    The ADR-SV series drill has a wear-resistant FCS coating and is suitable for micro-hole processing of soft steel and high-hardness steel (HRC50). This series is designed with a wider chip groove and polished on the edge of the cutting edge, which significantly improves the chip removal smoothness and processing quality, and effectively extends the life of the drill.


    Advantages and features of "ATOM micro-diameter drill" in semiconductor manufacturing


    1. Extremely high precision
    ATOM micro-diameter drill can achieve extremely high drilling accuracy on materials such as aluminum alloy and engineering plastic (PEEK). This is crucial for socket test sockets, because ICs are getting smaller and smaller in the process of rapid technological development. How to achieve the hole position accuracy required by customers in the manufacture of socket test sockets requires not only the stability of machine tools, but also the support of tools.

    2. Excellent hole wall roughness and hole burr suppression
    The hole wall roughness and hole burr suppression of micro-diameter drilling are directly related to the quality of the hole. Whether it is a blind hole (Blind Hole) or a through hole (Through Hole), ATOM micro-diameter drill can achieve smooth, burr-free, flawless hole wall roughness and hole, which helps product yield and remove burrs after processing.

    3. Low loss and high production efficiency
    When drilling, high-speed machining machines cause the temperature of the drill tip to rise due to the high speed, which leads to drill wear. ATOM micro-diameter drills use high-quality all-tungsten steel raw materials as the base material to achieve ultra-long tool life, thereby saving the problem of equipment stagnation due to tool change.

    4. Full size and complete inventory
    As the exclusive agent of ATOM micro-diameter drills, Yuewei Technology imports a full range of Japanese size series inventory, from Φ0.03~Φ1.00, with a standard inventory of Φ0.01, and a diameter ratio of 5D/10D/15D/20D, uncoated ADR or coated ADR-SV are all in stock in Taiwan, meeting the needs of today's increasingly shorter delivery time, and achieving the convenience of 2-day delivery.

    5. Customizability
    ATOM micro-diameter drills can be customized according to the needs of specific applications. Whether you need a stage forming drill, a high-diameter drill, or a water-out drill, you can customize it according to the drawing.

  • ASP-LASER Marking
    ASP-LASER Marking using top laser light sources, cutting-edge galvanometer and field lens technology, and undergoing rigorous dimming testing processes to ensure that each machine can reach its best state....

  • Ultra-high speed, high precision

    ● Galvanometer system

    Consists of two precise reflectors, it can quickly and accurately control the light path, which is the key to achieve high-speed and precise laser engraving on metal materials. The maximum speed can reach 10,000 mm/s.

    雷射打標機-振鏡系統

    ● F-Theta scanning lens (field lens)

    It can significantly expand the operating range of laser marking and provide a variety of working areas, including 110*110mm, 150*150mm, 200*200mm and other specifications. You can choose the lens that meets your processing needs.

    ASP雷射打標機-可選鏡片

    ● Two main laser light sources - fiber optic and ultraviolet

    Fiber optic laser is applicable to materials: including most metal materials.
    Ultraviolet laser is applicable to materials: including engineering plastics, metals, organic materials, etc.

    Choose the appropriate laser light source according to the material being processed to ensure that every marking and engraving is clear and sharp, with impeccable precision, reaching the highest standards in the industry; and has a long service life, simple daily maintenance, and is not easy to damage.

    High-quality mechanism design

    ✅ Laser head autofocus: laser red light positioning, fast and accurate.

    ✅ Safety protection window: equipped with linkage switch, once the protection window is opened, the machine will automatically stop working, effectively preventing laser leakage and protecting the safety of eyes.

    ✅ Air filtration: The dust collection design in the protection window prevents dust from scattering in the air.

    ✅ Double switch control: double confirmation start button, no need to worry about misoperation.

    ✅ Safety warning light: do not touch the marked work area before the warning light turns green.

    ✅ Emergency switch: in the event of an accident, operate the emergency button, the laser will stop working immediately to ensure your safety.

    360° rotation marking

    When performing laser marking and engraving of circular products, you can use a rotating fixture to allow you to handle complex or irregular shaped objects with ease.

    雷射打標機用旋轉夾具

  • SUMITOMO SUMIDIA Cutting Tools
    Sumitomo Electric's SUMIDIA Cutting Tools: PCD turning tools NPD10, DA1090 and small diameter boring tools DABX fully demonstrate its R&D strength and market value in the field of diamond-grade processing....

  • Binderless Diamond – NPD10

    住友鑽石刀具NPD10

    For Ultra-High Precision Machining
    Utilizing binderless nano-polycrystalline diamond (NPD) technology, the NPD10 offers exceptional hardness and outstanding wear resistance. It is specifically engineered for ultra-precision machining of cemented carbide and other hard, brittle materials.

    Superior Tool Life and Machining Efficiency
    Compared with conventional diamond tools, the NPD10 delivers stable dimensional accuracy and extended tool life, enabling users to significantly reduce tool change frequency, enhance machining productivity, and lower overall manufacturing costs.

    Diamond – DA90

    住友鑽石刀具DA90

    The Secret Weapon for Rough Machining of Cemented Carbide and Hard, Brittle Materials
    Featuring a coarse-grained polycrystalline diamond structure with enhanced inter-particle bonding strength, the DA90 offers remarkable wear resistance and chipping resistance. Even under heavy-duty rough machining conditions, it maintains sharp cutting edges and machining stability over long periods.

    Equipped with SUMIDIA NF Inserts
    Through optimized design and mass-production techniques, the DA90 achieves the same high performance as conventional grades while delivering excellent cost efficiency.

    Application Range (Cemented Carbide)

    • Finishing: NPD10

    • Roughing: DA90

    Binderless Diamond End Mill – NPDB

    NPDB 住友鑽石銑刀

    For Finishing of Hard, Brittle Materials such as Cemented Carbide
    Manufactured with 100% binderless nano-polycrystalline diamond technology, NPDB exceeds the hardness of single-crystal diamond, offering superior wear resistance and fracture toughness.

    Achieves Mirror Finishing of Ultra-Hard Materials
    Specialized binderless nano-polycrystalline diamond ball end mills for mold mirror finishing enable direct mirror machining of ultra-hard materials such as tungsten carbide, reducing the need for subsequent polishing processes and improving overall efficiency.

    Binderless CBN Tool – NCB100

    For High-Efficiency Finishing
    Nano-polycrystalline CBN (Cubic Boron Nitride) provides exceptional hardness and thermal conductivity, enabling high-efficiency, high-precision machining of difficult-to-cut materials such as titanium alloys and Co-Cr alloys.

    Long-Lasting Dimensional Accuracy and Surface Finish
    Compared to conventional grades, NCB100 significantly reduces tool change frequency, enhancing productivity and reducing total manufacturing cost.

    Nano-Polycrystalline CBN SUMIBORON – Binderless Type
    With higher hardness and superior thermal conductivity than conventional CBN grades, binderless SUMIBORON ensures greater efficiency and extended tool life when machining titanium alloys, cobalt-chrome alloys, and other specialty alloys.

    Processing consultation

    see more https://asun-photonics.com/product-category/sumitomo/

    Contact Information
    Tel: +886-2-26327601
    Fax: +886-2-26327604
    Official Line Customer Service: https://line.me/R/ti/p/%40332yetoa
    Website: https://asun-photonics.com/

  • AXISMATERIA – Sumitomo Electric Carbide Materials
    AXISMATERIA, a premium tungsten carbide brand under Sumitomo Electric, specializes in supplying high-performance cemented carbide materials for PCB drills, precision cutting tools, and custom-shaped applications....

  • AXISMATERIA Cemented Carbide – A Key Material for Semiconductor Precision Machining

    As semiconductor manufacturing advances toward miniaturization, higher density, and extreme precision, the demands on cutting tool performance continue to rise. AXISMATERIA cemented carbide, with hardness second only to diamond, has become an essential engineered material used extensively across high-performance industries, including automotive, electronics, aerospace, and advanced manufacturing.

    With exceptional hardness, toughness, and microstructural stability, AXISMATERIA cemented carbide is the preferred choice for semiconductor precision machining and high-end PCB drill manufacturers. Its reliable performance supports high-precision applications such as AI server substrates, high-frequency/high-speed boards, and composite material drilling.


    Cemented Carbide Properties – High Hardness, High Toughness, Wear Resistance

    AXISMATERIA cemented carbide is produced by sintering tungsten carbide (WC) powder with cobalt (Co) as a binder, and, when necessary, adding titanium carbide (TiC) or tantalum carbide (TaC) to enhance performance. It offers:

    • High Hardness – Second only to diamond, retaining hardness even at elevated temperatures.

    • High Toughness – Capable of withstanding high cutting forces and impact loads.

    • Wear Resistance – High stability for consistent drilling performance over long production runs.

    In manufacturing environments that demand extreme precision and consistency, AXISMATERIA cemented carbide improves machining efficiency, ensures product quality, and provides reliable support for advanced technology sectors.

    Learn more about AXISMATERIA products:
    https://asun-photonics.com/product-category/axismateria/


    Core Technical Advantages of AXISMATERIA Cemented Carbide

    • Microstructure Uniformity Optimization: Refined WC grain distribution for finer, more consistent microstructure.

    • Stable Cobalt Content Control: Ensures fracture resistance and toughness under high-stress, high-precision conditions.

    • Hot Isostatic Pressing (HIP): All raw materials undergo HIP processing to enhance density and strength, reducing crack formation and defects.


    Before & After Microstructure Refinement (HIP Processing)

    AXISMATERIA Hot Isostatic Pressing(HIP)

    Before: Non-uniform tungsten carbide grain and cobalt distribution.

    AXISMATERIA Hot Isostatic Pressing(HIP)

    After: Uniform, fine cobalt distribution and consistent WC grain size.


    The Ideal Material for Semiconductor Applications

    Cemented carbide tools made from AXISMATERIA materials are used in critical semiconductor manufacturing components, electronic devices, precision molds, and high-performance automotive and aerospace engine parts. Compared with conventional high-carbon steel or high-speed steel, AXISMATERIA tungsten carbide significantly improves processing efficiency, dimensional stability, and tool life—reducing tool replacement costs. It is the industry’s first choice for PCB drill blanks and ultra-fine cutting tool substrates.


    Contact Information:
    Tel: +886-2-26327601
    Fax: +886-2-26327604
    LINE@ Customer Service: https://line.me/R/ti/p/%40332yetoa
    Website: https://asun-photonics.com/

  • Universal Laser Systems
    The ULTRA Series is the world’s only laser platform capable of processing with three laser wavelengths simultaneously, making it exceptionally suited for semiconductor critical material processing....

  • UNIVERSAL ULTRA MultiWave Hybrid™ Laser Technology × Semiconductor Applications

    As semiconductor manufacturing increasingly demands higher precision and lower material loss, the UNIVERSAL ULTRA laser systems—with the world’s only capability to process using three laser wavelengths simultaneously—have become indispensable tools in advanced micromachining.


    Key Technology: Industry-First MultiWave Hybrid™

    The ULTRA Series features patented MultiWave Hybrid™ technology, offering three distinct laser wavelengths (10.6 μm, 9.3 μm, 1.06 μm). These wavelengths can be focused to the same focal plane and spot, used either simultaneously or sequentially.

    Expanded Laser Processing Capabilities

    The dual-laser configuration offers more than 17× the laser combinations compared to single-laser systems. Each unique pairing of wavelength and power allows users to configure the optimal laser solution for their specific application.

    • Cutting Carbon Fiber-Reinforced Plastics (CFRP): 1 × 75 W 10.6 µm CO₂ + 1 × 50 W 1.06 µm fiber laser

    • Cutting Multi-Material Laminates: 1 × 50 W 10.6 µm CO₂ + 1 × 50 W 1.06 µm fiber laser

    • Rapid Prototyping of Flexible Circuits: 1 × 75 W 10.6 µm CO₂ + 1 × 30 W 9.3 µm CO₂ + 1 × 50 W 1.06 µm fiber laser

    • Selective Laser Ablation of Thin Films: 1 × 50 W 10.6 µm CO₂ + 1 × 50 W 1.06 µm fiber laser

    • Silicon Wafer Cutting: 1 × 75 W 10.6 µm CO₂ + 1 × 50 W 1.06 µm fiber laser


    Broad Material Compatibility

    使用10.6 µm CO2雷射器進行雷射切割的Delrin™

    10.6 µm CO₂ Laser: Cutting Delrin™ and other engineering plastics

    使用9.3 µm CO2雷射器進行雷射切割、鑽孔和打標的Kapton™

    9.3 µm CO₂ Laser: Cutting, drilling, and marking Kapton™ polyimide films

    使用1.06 µm光纖雷射器進行打標的不銹鋼。

    1.06 µm Fiber Laser: Direct marking on stainless steel and other metals


    Maximum Productivity & Cost Reduction

    MultiWave Hybrid™ technology allows users to select the optimal wavelength and power for each material. Lasers can be installed in seconds without specialized training or tools, eliminating the need to purchase a new system for each application, thus reducing overall investment costs.


    Higher Precision with HPDFO™

    When paired with High Power Density Focusing Optics (HPDFO™), ULTRA systems achieve cutting precision of ±0.1 mm and engraving resolution up to 2000 DPI. This enables the production of extremely small and complex geometries, meeting the miniaturization demands of semiconductor components.


    Why ULTRA is Ideal for Semiconductor Processing

    • Short Pulses, Minimal Heat Impact: In wafer dicing, drilling, and microstructuring, short-pulse lasers significantly reduce the heat-affected zone (HAZ), preventing deformation and microcracks, ensuring consistent product quality.

    • High Precision & Non-Contact Machining: Unlike mechanical processing, laser micromachining is stress-free, minimizing particulate contamination—ideal for thin-film ablation, wafer marking, and high-precision packaging hole drilling.

    • Versatile Material Processing: From thin films, silicon wafers, engineering plastics to composite materials, ULTRA systems switch wavelengths to optimize results for each substrate.


    Explore More Laser Processing Applications:
    https://asun-photonics.com/technology/technical-support/


    Cross-Industry Applications:
    ✅ Electronics Manufacturing
    ✅ Aerospace Production
    ✅ Automotive Industry
    ✅ Medical Device Fabrication
    ✅ Battery Manufacturing
    ✅ Architectural Modeling
    ✅ Artistic Creation

    From high-end industrial manufacturing to innovative design, the ULTRA Series is the key to efficient, precise, and automated laser processing.


    Contact Information:
    Tel: +886-2-26327601
    Fax: +886-2-26327604
    LINE@ Customer Service: https://line.me/R/ti/p/%40332yetoa
    Website: https://asun-photonics.com/