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"ATOM Micro-Diameter Drill" Challenges Semiconductor Ultra-Micro Hole Processing Technology

In response to the problem of micro-hole processing in chip packaging testing, ATOM has launched multiple solutions. The following two series are highly respected in the industry:

ADR Standard Series Drill

The minimum diameter of the ADR series can reach Ø 0.02mm, and the diameter tolerance is less than −0.005mm. It is suitable for micro-hole processing of materials such as steel, non-ferrous metals and resins. Yuewei Technology is the general agent of ATOM in Taiwan and China, with sufficient inventory and efficient delivery services.

2. Excellent hole wall roughness and hole burr suppression
The hole wall roughness and hole burr suppression of micro-diameter drilling are directly related to the quality of the hole. Whether it is a blind hole (Blind Hole) or a through hole (Through Hole), ATOM micro-diameter drill can achieve smooth, burr-free, flawless hole wall roughness and hole, which helps product yield and remove burrs after processing.

3. Low loss and high production efficiency
When drilling, high-speed machining machines cause the temperature of the drill tip to rise due to the high speed, which leads to drill wear. ATOM micro-diameter drills use high-quality all-tungsten steel raw materials as the base material to achieve ultra-long tool life, thereby saving the problem of equipment stagnation due to tool change.

4. Full size and complete inventory
As the exclusive agent of ATOM micro-diameter drills, Yuewei Technology imports a full range of Japanese size series inventory, from Φ0.03~Φ1.00, with a standard inventory of Φ0.01, and a diameter ratio of 5D/10D/15D/20D, uncoated ADR or coated ADR-SV are all in stock in Taiwan, meeting the needs of today's increasingly shorter delivery time, and achieving the convenience of 2-day delivery.

5. Customizability
ATOM micro-diameter drills can be customized according to the needs of specific applications. Whether you need a stage forming drill, a high-diameter drill, or a water-out drill, you can customize it according to the drawing.

AXISMATERIA cemented carbide material - key material for semiconductor high-precision processing

As semiconductor manufacturing processes move towards smaller, higher density and higher precision, the performance requirements for processing tools continue to increase. In this context, AXISMATERIA cemented carbide from the Japanese Sumitomo brand has become an indispensable high-performance material in key processes.

Cemented carbide material: high hardness, wear resistance, heat resistance

AXISMATERIA cemented carbide is made of tungsten carbide (WC) powder and cobalt (Co) as a binding metal, and is sintered at high temperature. Titanium carbide (TiC) or tantalum carbide (TaC) is added when necessary. It has an ultra-high hardness second only to diamond, and has both:

🔹 Excellent wear resistance: suitable for high-frequency and high-speed processing environments

🔹 High toughness: Reduce the risk of scrapping due to micro-vibration or fracture

🔹 Heat resistance and corrosion resistance: Competent for high temperature and chemical environments commonly seen in semiconductor processes

Application of cemented carbide

Due to the above characteristics, it is used in cutting tool heads and molds on CNC lathes and machining centers. Compared with previous heat-treated steel tools, it has achieved a leap in speed and life, and its usage is increasing year by year.

Products processed by cemented carbide tools are widely used in:

Indispensable cutting tool materials for precision machining, automobiles, computers, smartphones and other industries.

💡 Ideal materials for the semiconductor industry

Facing the challenges of the precision machining industry, the high-performance tungsten steel materials provided by AXISMATERIA have significantly improved processing efficiency and stability compared to traditional high-carbon steel or high-speed steel, significantly improved tool life, and reduced the cost of frequent tool replacement. It is the industry's first choice for micro-machining tools.

NIVERSAL ULTRA Multi-wave Hybrid Technology Laser Machine × Semiconductor Industry Application

As semiconductor manufacturing processes increasingly pursue high precision and low loss, the UNIVERSAL ULTRA laser cutting and engraving machine has become an indispensable tool in fine processing with its world's only technology for simultaneously irradiating three laser beams for processing.

Technical Features: The world's first MultiWave Hybrid™ multi-wave hybrid technology

The ULTRA series is equipped with patented MultiWave Hybrid™ technology. The system provides three laser wavelengths (10.6 μm, 9.3 μm, 1.06 μm), which allows any combination of laser wavelengths to be focused to the same focal point in the same focal plane and used simultaneously or sequentially.

🔷 Wider laser material processing capabilities

The dual laser function provides more than seventeen times the number of laser configurations as a single laser system. Each unique combination of laser power and wavelength provides users with additional options to configure the best laser processing solution for their application.

● Laser cutting of carbon fiber reinforced plastics: 1 x 75W 10.6µm laser and 1 x 50W 1.06µm laser

● Laser cutting of multi-material laminates: 1 x 50W 10.6µm laser and 1 x 50W 1.06µm laser

● Rapid prototyping for flexible circuit manufacturing: 1 x 75W 10.6µm laser and 1 x 30W 9.3µm laser and 1 x 50W 1.06µm laser

● Selective laser etching of thin film materials: 1 x 50W 10.6µm laser and 1 x 50W 1.06µm laser

● Laser cutting of silicon wafers: 1 x 75W 10.6µm laser and 1 x 50W 1.06µm laser

🔷 Wide range of material adaptability

Stainless steel marked with a 1.06 µm fiber laser

🔷 Highest productivity and reduced costs

MultiWave Hybrid™ technology allows users to select the ideal laser wavelength and power for the material they are processing. The laser can be installed in seconds without special training and tools. The ideal laser wavelength and power can be selected for each application, and there is no need to purchase a new laser system for each new application, thus reducing costs.

🔷 Achieve higher precision

Combined with High Power Density Focusing Optics (HPDFO)™, the laser precision is taken to a higher level - cutting accuracy of ±0.1 mm, engraving accuracy of up to 2000 DPI, and can process extremely small sizes and complex geometric structures to meet the needs of increasingly miniaturized semiconductor components.

Why choose ULTRA for semiconductor processing?

Short pulse, small heat impact:

In wafer cutting, drilling and microstructure processing, short pulse lasers can significantly reduce the heat affected zone, avoid material deformation and micro cracks, and ensure stable quality of finished products.

High-precision and non-contact processing:

Compared with traditional mechanical processing, laser processing has no stress contact and is not prone to particle contamination. It is particularly suitable for processing thin film material laser etching, wafer marking, packaging drilling and other high-demand processes.

Strong material compatibility:

From thin film materials, silicon wafers, engineering plastics, engineering composite materials, etc., ULTRA can switch the corresponding wavelength according to the material to optimize the processing effect.

🌍 UNIVERSAL's cross-industry application advantages are widely used in:

✅Electronic technology

✅Aerospace manufacturing

✅Automotive industry

✅Medical equipment

✅Battery manufacturing

✅Architectural models

✅Art creation

From high-end industry to innovative design, ULTRA lasers are key tools for achieving efficient, precise and automated processing.

Laser Marking Machine – Specifications of the Marking Series

ASP-LASER Marking laser marking machines achieve their outstanding performance through a combination of high-quality components, using top-notch laser light sources, cutting-edge galvanometer and field lens technology, and undergoing a rigorous dimming test process to ensure that each machine is in optimal condition.

Wide range of applications:

Time, date, text, serial and part numbers, company logos, icons, symbols, barcodes, QR codes, matrix and vector fonts can be marked on all flat, painted, powder-coated, anodized, and electroplated metal surfaces, whether flat or curved.

Two main laser light sources – fiber and UV

Demonstrate extraordinary strength. The adjustable pulse span from 2 to 500ns ensures that every mark is clear and sharp, with impeccable accuracy, meeting the highest standards in the industry.

Marking’s galvanometer system

Consists of two precision mirrors that can quickly and accurately adjust the light path, which is the key to achieving high-speed, fine laser marking on metal materials.

Each device undergoes up to 5 rigorous dimming and testing procedures before leaving the factory to ensure that the final error is controlled within 0.5 mm.

Strong Points of the Marking Series

The portable laser marking machine comes with a fully enclosed cover, which keeps the odor in a closed protective box without emitting outside. The 2021 best portable laser engraving machine has the advantages of health, environmental protection and user-friendly, suitable for small businesses and home shops.

Wide Application.

   ○The machine has a fast marking speed.

   ○The machine has high precision.

   ○The machine has a long service life.