Loading...

Scientech Corporation

Hsinchu City,  Taiwan
http://www.scientech.com.tw
  • Booth: M0338

Overview

Scientech is a leading supplier for Equipment and Wafer Reclaim Service for Semiconductor and FPD industries.

Scientech’s market coverage includes SEMI Front-End, Advanced Packaging, Compound SEMI, MEMS, LED, FPD, Mini-LED, Micro-LED, and Analytical Instruments.

Established in 1979 as a representative for semiconductor industry, Scientech expanded its business into manufacturing Wet Process Equipment, Temporary Wafer Bonding/De-Bonding Equipment and 300mm Wafer Reclaim Services for Silicon and SiC customers.

To provide the high quality of services to customers, Scientech sets up 16 offices across the globe. Scientech is ISO certificated across all product lines, and a listed company in Taiwan stock exchange market.

Wherever the customers are, we will be there.

  Press Releases

  • Scientech’s market coverage includes SEMI Front-End, Advanced Packaging, Compound SEMI, MEMS, LED, FPD, Mini-LED, Micro-LED, and Analytical Instruments.

        12吋半導體先進封裝濕製程設備（包括單晶圓與批次晶圓）及暫時性貼合製程設備已正式出貨全球半導體代工龍頭及先進封裝一線大廠。
        辛耘提供客戶最優質的產品與服務，以滿足顧客需求，成為世界級的先進科技供應商，公司現有自製機台製造、晶圓再生服務與代理產品三大事業群，都已獲得ISO9001認證。並於2013年三月掛牌上市.
         辛耘致力於發展自有產品政策，2004年起即開始投入研發經費及設立生產工廠，至今已陸續發展出許多應用於半導體、LED、太陽能及砷化鉀前段、後段濕製程設備，包括清洗、蝕刻、黃光顯影、光阻去除、去蠟、電鍍化鍍、乾燥機台； 並已開發出高階封裝及 IGBT用暫時性貼合製程設備；且以自有品牌「SCIENTECH」製程設備產品成功打入海內、外市場。
        2006年，辛耘企業再投入12吋矽晶圓再生服務，公司位於新竹湖口工廠的再生晶圓廠，月產能達十六萬片。
        除致力於研發製造自有品牌產品，辛耘企業同時非常重視對客戶的服務，公司強調團隊合作、專業技術、客戶滿意、永續經營的經營理念，並秉持「客戶在哪，辛耘隨即在側 」的精神。目前辛耘在台灣設有六個營運據點，在中國大陸，則於北京、天津、上海、無錫、重慶、武漢、深圳、昆明等地設立辦服務據點，並在美國加州矽谷，歐洲及新加坡也設有辦事處，公司未來並將持續擴張版圖，以強化服務客戶的品質與速度。

  Products

  • Wet Process Equipment
    Scientech is a leading supplier for Wet Process Equipment which include Wet Bench and Single Wafer Wet Process Tools.
    Please refer to http://www.scientech.com.tw for the products we represent and we design/manufacture.
    ...

    • 辛耘企業於2002年開始投入批次式及單晶片式濕式製程設備研發製造，已經獲得國內外客戶採用與肯定。目前辛耘擁有 5,000 m2生產製造廠房，同時擁有 Class 10 等級無塵室服務客戶製程需求驗證平台。產品包含手動 / 半自動 / 全自動的批次式及單晶片製程設備提供客戶2”~12”製程應用需求。特有的 cassette type / boat type / cassette-less type 技術提供半導體晶圓、藍寶石、玻璃、LED、太陽能晶圓、薄化晶圓等應用。另外，辛耘企業擁有的專利產品”Advantech Dry”提供客戶各種關鍵旋乾的製程應用，應用領域包括:

    Single Wafer單晶片式濕製程設備 ( Polar Series ):

    • Applications :
    • Semiconductor FEOL & BEOL
    • 2.5D/3D IC, Advanced packaging, Bumping, Si Photonics, CoWoS, SoIC, Heterogeneous Integration
    • Compound SEMI : SiC / GaN / GaAs / InP / ...
    • MEMS
    • LED / mini LED / micro LED
    • Process:
    • Etch : UBM, Solder, Metal, Oxide, Nitride Removal, Polymer Removal, Immersion & Spin Etch
    • Clean : Pre-Clean, Post-Clean, Final-Clean, Scrubber, Flux Clean, Frame Clean, Mask Clean, Ozone Clean..
    • Stripper : PR Stripper, Polymer Removal (EKC, IPA, NMP, SPM, DMSO, Non-DMSO,..)

    Wet Bench批次式濕製程設備 ( WSE Series):

    • Applications :
    • Semiconductor FEOL & BEOL,
    • 2.5D/3D IC, Advanced packaging, Bumping, Si Photonics, CoWoS, SoIC, Heterogeneous Integration
    • Compound SEMI : SiC / GaN / GaAs / InP / ...
    • MEMS
    • LED / mini LED / micro LED
    • Process :
    • Etch : UBM, Solder, Metal, Oxide, Nitride Removal, Polymer Removal, Immersion & Spin Etch
    • Clean : Pre-Clean, Post-Clean, Middle-Clean, Scrubber, Flux Clean, Frame Clean, Mask Clean, Ozone Clean.
    • Stripper : PR Stripper, Polymer Removal (EKC, IPA, NMP, SPM, DMSO, Non-DMSO,..)
    • Clean: Pre-clean, Post clean, Flux clean
    • Plating: Electro-less plate (Zn/Ni/Au), Electric plating (Cu/Ni/SnAg)

    辛耘公司的特色：

    客製化軟硬體設計服務

    專業與快速的售後服務

    安全設計兼具簡易操作

    主動協助客戶快速量產

  • 12” Wafer Reclaim & 12” Test Wafer
    Scientech is a leading supplier of 300mm wafer reclaim service and 300 mm test wafer. Our output capacity is 160k/M for completely separated Cu and Non-Cu wafer reclaim process. For more detail, please refer to https://www.scientech.com.tw/...

    • Scientech provides 12” wafer reclaim service and 12” test wafer.  Our team is formed by professional reclaim technique, new equipment/ utility and advanced process technology for 5nm IC design rules and beyond.  Our customers are covered in major Logic, DRAM Fab, equipment, and research lab worldwide. 

    Our Mission：

    •  Minimum Removal Rate
    •  Maximum Return Rate
    •  Minimum Return Time
    •  Robust Quality System
    •  Accurate Tracing System
     Quick Respond System
  • Soaking & Spray Equipment - Sirius
    “Sirius” equipment is latest developed soak and spray technology by using single wafer process platform. Please refer to http://www.scientech.com.tw for the products we represent and we design/manufacture....

    • 辛耘企業於2002年開始投入批次式及單晶片式濕式製程設備研發製造，已經獲得國內外客戶採用與肯定。目前辛耘擁有 5,000 m2生產製造廠房，同時擁有 Class 10 等級無塵室服務客戶製程需求驗證平台。產品包含手動 / 半自動 / 全自動的批次式及單晶片製程設備提供客戶2”~ 12”製程應用需求。特有的 cassette type / boat type / cassette-less type 技術提供半導體晶圓、藍寶石、玻璃、LED、太陽能晶圓、薄化晶圓等應用。另外，辛耘企業擁有的專利產品”Advantech Dry”提供客戶各種關鍵旋乾的製程應用。

    辛耘新開發Sirius系列設備，結合批次式及單晶片式濕製程優點並擁有特殊垂直高壓噴洗技術提供製程彈性。應用領域含括:

    Sirius Series濕製程設備:

    • Applications :
    • Semiconductor FEOL & BEOL
    • 2.5D/3D IC, Advanced packaging, Bumping, Si Photonics
    • Compound SEMI : SiC / GaN / GaAs / InP / ...
    • MEMS
    • LED / mini LED / micro LED
    • Panel, Carrier, Substrate
    • Process:
    • Stripper : Dry-Film / Thick Film Removal
    • Metal Lift-Off

    辛耘公司的特色：

    客製化軟硬體設計服務

    專業與快速的售後服務

    安全設計兼具簡易操作

    主動協助客戶快速量產

  • Temporary Bonding De-bonding System
    Scientech is a leading supplier for Temporary Bonding System which include Temporary Bonding, De-bonding, Release Layer Formation and Carrier Recycling.
    Please refer to http://www.scientech.com.tw for the products we represent and we design/manufacture.
    ...

    • 辛耘企業於2015年開始投入暫時性貼合設備研發製造，已經獲得國內外重要客戶採用與肯定。目前辛耘擁有 5,000 m2生產製造廠房，同時擁有 Class 10 等級無塵室服務客戶製程驗證平台。產品包含手動/半自動/全自動的暫時性貼合、剝離、解離層成型及載具清洗回收系統，提供客戶6”~12”製程應用需求。

    TBDB暫時性貼合/剝離設備 (Pyxis series):

    • Applications :
    • Wafer Thinning Process for IGBT & Power Device
    • 2.5D/3D IC, Advanced packaging, Bumping, Si Photonics
    • mini LED / micro LED
    • Process:
    • Temporary Bond : UV Curing, Thermal Bond
    • Temporary Debond : Frame De-bond ,Taiko De-bond, All De-bond applications
    • Release Layer Formation System
    • Carrier (Glass) Recycling System

        辛耘公司的特色：

    ​客製化軟硬體設計服務

    專業與快速的售後服務

    安全設計兼具簡易操作

    主動協助客戶快速量產

  • Representative Business of Scientech Corporation
    Representative Business of Scientech covers the following industries: Semiconductor, Compound Semiconductor, LED, Flat Panel Display, Solar Cell, Battery, Biotech, Chemistry Analysis and Scientific Instrument....

    • Mask / Reticle

    Mask Dry Etcher, CD / Overlay Metrology, Defect Inspection, E-beam Writer, Reticle Cassette

    Lithography Process

    Stepper, Coater / Developer, Mercury Lamp

    Etch Process

    Dry Etcher, Plasma Cleaning / Descum, End Point Detection

    Thin Film & Plating Process

    Electro-Plating System, PECVD, PVD, CVD, IBD, CMP, Pulsed Laser Deposition

    Diffusion & Thermal Process

    High Pressure Annealing Systems, RTP

    Metrology & Inspection

    Optical / Stylus Profiler, Standards, 3D X-Ray Microscopy, Isolation Systems, Stress Meter, CD / Overlay Metrology, Defect inspection, 2D/3D AOI

    Back-end Process

    Ball Mounter, Reflow, EMI Tape, SMT Scope, Paste & Sheet, 2D/3D AOI, Baking Oven, Plasma Clean & Descum ESD Solution, Solution for Silicon Photonic

    Sub-Systems & Others

    Laser Marker, Power Supply, RF Generator, Robot, EFEM, Pressure Sensor, Valves, Metal Cassette, Magazine, KVM, ESD Solution, Optical Filter, O2 Analyzer, Power Conditioner, Motor, Linear Rail System, Encoder

    Flat Panel Display

    Dry Etch, PECVD, Annealing Furnace, PI Curing Furnace, PVD, Mask / Cassette Cleaner, Optical / Stylus Profiler, AP Plasma Clean, PVD Sputter, Dry Etcher, PI curing

    Panel Level Package

    Dry Etcher, Plasma Cleaning / Descum , Dip Coater ,Laminator , Oven , PVD Sputter , PI curing, Pressure Sensors, X-ray inspection

    Analytical Inst.

    Particle Sizer, Pre-Treatment, Element Analyzer

Categories

200 Equipment, Assembly
  • Ball Placement; Attach Systems
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Cut & Down Set; Trim; Form Equipment
  • Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
  • Solder Reflow; Soldering & Brazing Equipment
    • 201 Equipment, Flat Panel Display
  • Anodic Oxidation Equipment
  • Laser Treatment; Cutting Systems for Panels & Photocells
    • 202 Equipment, General Use
  • Lamination; Sheet Laminating Equipment
    • 203 Equipment, Inspection & Measurement
  • Defect; Particle; Bump; Contamination Detection, Review or Inspection
  • X-ray; XRF; 3-D X-Ray; LEXES Systems
    • 204 Equipment, Mems
  • Deep RIE etching; Dry Etching
    • 205 Equipment, Nanotechnology
  • Equipment, Nanotechnology Tools
    • 207 Equipment, Process
  • Chemical Mechanical Polishing (CMP); Electro Polishing, Mechanical Polishing Equipment
  • Cleaning; Washing; Drying Equipment for Substrate, Fab Processing
  • Coat; Develop; Resist Processing; Track Equipment
  • Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment
  • Etching; Stripping; Ashing - Dry and Wet Equipment
  • Lithography; Exposure; Aligners; Direct Write Systems; Steppers; Scanners; Nanoimprint
  • Thermal Processing - Diffusion; Oxidation; Annealing; RTA; RTP Equipment
    • 304 Materials, Mask Making
  • Pellicles; Mounting Fixtures
    • 401 Sub-systems
  • Power Supplies; RF Generators; Converters; Electrical Conditioning
    • 502 Material Handling Systems
  • Robotics; Transfer Systems
    • 700 Manufacturing Services
  • Reclaim Services (Evaporation; sputtering source material; Precious metal reclaim; Scrap; Vacuum pum
  • Repair; Rebuild; Install Equipment; Maintenance Services; Spare Parts
    • 701 Manufacturing Services or Consulting
  • Static; ESD Testing & Control Services
    • 804 Professional Services
  • Marketing or Sales Consultants
  • Sales; Manufacturers Representation or Distributors
    • Loading ...

    :
    :


    Legend
    Available Timeslot
    Scheduled Appointment
    Personal Appointments
    Appointment Request
    Blocked Timeslot
    Restricted Timeslot
    Cancelled
    Declined