Crystal Growth & Wafer Inspection: Securing Quality from the Start

To download the e-book, click here Rigaku Metrology Across the Semiconductor Value Chain

The journey to a reliable semiconductor device begins with the crystal. Rigaku’s FSAS II and FSAS III systems ensure accurate crystal orientation and detect impurities or structural defects in 150 mm ingots—safeguarding quality before slicing. Once cut into wafers, Rigaku’s XRTmicron Lab and XRTmicron Near Fab deliver advanced X-ray topography for wafers up to 300 mm, identifying dislocations, stacking faults, and impurities that threaten yield.

By combining early-stage ingot verification with high-resolution wafer inspection, Rigaku helps manufacturers protect yield, prevent costly downstream failures, and build confidence in every device from the very first step.

Flawless crystals and defect-free wafers—because precision starts at the source.

Crystal Growth – Ingot Orientation

Accurate crystal orientation is the first step toward high-performance semiconductor devices. Rigaku’s FSAS II and FSAS III provide reliable, high-throughput analysis of 150 mm ingots, ensuring structural integrity, purity, and alignment from the very start of manufacturing. By detecting defects early, these tools prevent downstream yield loss and support consistent device performance.
Every perfect device starts with a perfect crystal.

Crystal Growth – Wafer Inspection

As crystal ingots are sliced into wafers, invisible imperfections can become costly threats to yield. Rigaku’s XRTmicron Lab and XRTmicron Near Fab systems use advanced X-ray topography to detect structural defects and impurities in wafers up to 300 mm. Whether for R&D or inline quality control, these tools provide high-resolution imaging to ensure only defect-free wafers move forward.
Catch defects early. Preserve yield. Optimize performance.

Photomask: Protecting Pattern Fidelity at the Source

Materials and multilayer characterization and surface contamination

To download the e-book, click here Rigaku Metrology Across the Semiconductor Value Chain

In photolithography, even microscopic imperfections in the photomask can compromise every device on the
wafer. Rigaku’s XTRAIA XD-2000R, XTRAIA XD-3000R, and TXRF 310Fab-R deliver precision materials and
multilayer characterization alongside ultra-sensitive surface contamination analysis for 300 mm masks.
With unmatched accuracy and repeatability, these tools safeguard pattern fidelity, reduce defect propagation,
and help fabs maintain the highest standards in advanced semiconductor manufacturing.
Catch defects early. Preserve yield. Optimize performance right from the wafer’s first step.

Lithography: Precision in Every Pattern

Pattern fidelity and strain, advanced CD metrology

In advanced semiconductor manufacturing, lithography defines the smallest features—and the tightest
tolerances. Rigaku’s XTRAIA CD-3010G and XTRAIA CD-3200T provide high-resolution critical dimension (CD)
metrology and strain analysis for 300 mm wafers, ensuring pattern fidelity at the nanometer scale.
By detecting deviations early, these systems help maintain process control, reduce rework, and support next-generation
device performance across logic, memory, and advanced packaging applications.
Exacting precision for the patterns that power the future.

Wafer Preparation: Precision Before Processing

Detect impurities and structural defects, measure surface contamination

To download the e-book, click here Rigaku Metrology Across the Semiconductor Value Chain

Before devices are built, the wafer must be pure. Rigaku’s metrology tools for 3760, XHEMIS TX-3000V, and
XRTmicron Fab, manufacturers can inspect wafers up to 300 mm in diameter, including those in cleanroom Class 6 environments.
Whether you need trace elemental analysis or defect detection, Rigaku provides the insights to ensure wafers
meet the strictest quality standards every time.
Cleaner wafers. Better yield. Total confidence.

Etch Critical Dimensions with Complete Confidence

CD and advanced shape metrology, residual stress

To download the e-book, click here Rigaku Metrology Across the Semiconductor Value Chain

In etch processes, every nanometer matters. Rigaku’s XTRAIA CD-3200T and XTRAIA XD Series
deliver high-precision critical dimension and advanced shape metrology, along with residual stress
analysis for 300 mm wafers. These capabilities help identify subtle variations that can impact device
performance, ensuring structures are formed exactly as designed.
By providing accurate, repeatable measurements, Rigaku empowers fabs to maintain tight control,
optimize process parameters, and achieve the highest possible yields.

Epi: Thickness, Composition, Stress/Strain, Defect Density

In epitaxial growth, even the smallest variations in thickness, composition, stress/strain, or defect
density can affect device efficiency and reliability. Rigaku’s WaferX 310, XTRAIA MF-2000, XTRAIA
MF-3000, XTRAIA XD-3200, and XTRAIA XD-3300 provide advanced X-ray metrology for wafers up
to 300 mm, delivering the accuracy needed for compound semiconductors, high-speed devices, and
power electronics.
By ensuring every layer meets exact specifications, these tools help fabs achieve superior
performance, yield, and long-term reliability.
Where flawless layers build flawless devices.

Precision insight for the most demanding etch steps.

Materials & Layer Metrology suite spans thin film characterization, lattice strain, and packaging bump analysis—ensuring precise layer control, interconnect reliability, and superior yield from deposition to final device assembly.

To download the e-book, click here Rigaku Metrology Across the Semiconductor Value Chain

Thin films: Measuring the Layers That Matter Most

Film thickness and composition, gate stack characterization

Thin film integrity is critical to device performance, especially in gate stack structures. Rigaku’s
XTRAIA TF-2000, WaferX 310, XTRAIA MF-2000, and XTRAIA MF-3000 deliver high-precision
measurements of film thickness, composition, and uniformity for wafers up to 300 mm.
From R&D to high-volume manufacturing, these tools provide the insight needed to optimize
deposition processes, ensure material consistency, and maintain the tightest tolerances in advanced
semiconductor devices.
Accurate layer control for maximum device reliability.

Labs and Manufacturing Support Flexible Analysis for Every Stage

Lattice strain, film thickness analysis

In etch processes, every nanometer matters. Rigaku’s XTRAIA CD-3200T and XTRAIA XD Series
deliver high-precision critical dimension and advanced shape metrology, along with residual stress
analysis for 300 mm wafers. These capabilities help identify subtle variations that can impact device
performance, ensuring structures are formed exactly as designed.
By providing accurate, repeatable measurements, Rigaku empowers fabs to maintain tight control,
optimize process parameters, and achieve the highest possible yields.
Precision insight for the most demanding etch steps.

Packaging Ensuring Interconnect Reliability

Bump composition and thickness UBM metal layers

In advanced packaging, the integrity of bumps and under-bump metallization (UBM) layers directly
impacts device performance and lifespan. Rigaku’s ONYX 3000 and ONYX 3200 provide precise
measurement of bump composition, thickness, and UBM metal layers for 300 mm wafers.
With high sensitivity and repeatability, these systems help manufacturers verify interconnect quality,
reduce failures, and maintain the rigorous standards demanded by next-generation semiconductor
devices.
Strong connections start with precise metrology.