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Knowledge Development for POF

Madrid,  Spain
https://kd.tech/
  • Booth: X0004

KD provides semiconductors for high-speed optical networking

Overview

KD is a Spanish semiconductor company leading the market for high-speed data transmission through optical fiber in challenging environments. For 15 years, the company has been reinventing the way optical communications are made to make them robust and affordable enough for the automotive, consumer and industrial markets.


  Press Releases

  • Demo of First Optical Multigigabit Transceiver for Automotive Ethernet, compliant with IEEE Std 802.3cz, at Semicon Taiwan 2025

    Madrid, Spain. July 15, 2025: KD, a semiconductor company, will present the new optical transceiver KD7251 at Semicon Taiwan 2025. The KD7251 is the first transceiver that is compliant with the IEEE Std 802.3cz standard specification for multigigabit glass optical fiber (GOF) automotive Ethernet. It implements the nGBASE-AU physical layers in a single-chip solution, supporting 10, 5, 2.5 Gb/s. In addition, it includes bridging functionalities to enable the connectivity of sensors, displays, and processors in the vehicle.

    The KD7251 is qualified for automotive standards at AEC-Q100 grade-2 environment. As native automotive part, it supports MACsec, ASIL-B FuSa, TSN, Wake-up & Sleep, OAM, and dependability functions. Thus, the transceiver enables a broad range of use cases with optical technology, such as multigigabit Ethernet backbone, zonal gateway connectivity, smart antenna link, and connectivity for radars, cameras, lidar, displays, and high-performance computing units. Carlos Pardo, CEO and Co-founder of KD, stated:

    “We’re excited to provide the first implementation of the IEEE Std 802.3cz (nGBASE-AU) in our new KD7251 transceiver. It’s the first chip to integrate electronics, photonics, and optics in a single IC component. Additionally, we’re proud to report about the first implementation in mainstream automotive networking by ZF Group choosing our KD7251 for their ProAI high-performance computer. This further proves our vision and path of applying fiber optics communications to solve connectivity challenges in harsh environments.”

    Multigigabit Data Transmission in Vehicles

    KD’s new KD7251 ASIC is a single-chip solution with on-chip optical interface. The transceiver includes bridging functionalities to enable the connectivity of MIPI sensors, as cameras and radar (CSI-2®), displays (DSI-2℠), or AI processors (PCIe®) in the vehicle. The KD7251 reaches 40 meters with 4 inline connectors over standard duplex OM3 multi-mode glass optical fiber (MM-GOF) at 10 Gb/s in the whole temperature range. The same cables and connectors will be reused for higher bitrates (25, 50 Gb/s and higher in the future).

    With its integrated EMC shielding, the KD7251 transceiver guarantees the highest component-level EMC compliance without the need for any external additions. This translates into a port with a small PCB area and a reduced Bill of Materials (BOM), with no need for ESD protections, common mode chokes, EMI filters or DC blocks.

    About KD

    Semiconductor supplier, KD provides innovative high-speed optical networking solutions for harsh environments. Founded in 2010 in Madrid, Spain, KD offers its cost-effective technology as fully qualified automotive-grade ASSP, integrating electronics, photonics, and optics in a single IC. KD’s technology makes use of information theory, innovative digital adaptive algorithms, and analog mixed-signal design to maximize the receiver’s sensitivity. KD innovates in optical coupling and packaging design, which enables integration of optical communications ports in electronic control units using standard printed circuit assembly processes. Together, these offerings allow KD to support high-yield and reliable optoelectronics production in low-cost automotive-grade bulk CMOS deep submicron nodes, and to deliver products to carmakers with low risk, low cost, and short time-to-market products. KD made gigabit communications for step-index plastic optical fiber (SI-POF) a reality for automotive and is now developing its multi-gigabit optimized solution for use with Glass Optical Fiber (GOF) as well. More information is available at www.kd.tech      


  Products

  • KD1053
    The KD1053 is a 65nm CMOS ASIC that implements the Physical-Coding Sublayer (PCS) and Physical Medium Attachment (PMA) sublayer of a 1000BASE-RHx PHY....

  • The KD1053 is a 65nm CMOS ASIC that implements the Physical-Coding Sublayer (PCS) and Physical Medium Attachment (PMA) sublayer of a 1000BASE-RHx PHY, compliant with the specifications of IEEE Std 802.3bvTM -2017 standard for gigabit optical communications over plastic optical fiber (POF). The KD1053 must be connected to a compatible Fiber Optics Transceiver (FOT), which implements a Physical Medium Dependent (PMD) sublayer and a Medium Dependent Interface (MDI), to form a complete automotive 1000BASE-RHC physical layer. The KD1053 implements the following optional features of IEEE Std 802.3bvTM - 2017: 1000BASE-H Operations Administration Maintenance (OAM) channel, support for Energy Efficient Ethernet (EEE) mode, exposed Management Data Input/Output (MDIO) and motor vehicle environmental requirements.

    The KD1053 can operate at 1 Gbps and at 100 Mbps. It is optimized for EMC compatibility, low power, reduced BOM and a small footprint. It is targeted for automotive applications using optical Ethernet over POF for the communications inside the vehicle. Infotainment and Advance Driver Assistance Systems (ADAS) are two of the key applications for future on board POF networking development. Examples of products able to incorporate optical Ethernet ports based on the KD1053 ASIC include ECUs, cameras and infotainment nodes.

    Its built-in analog interface simplifies connectivity to the Physical Medium Dependent (PMD) sublayer. It supports different parallel and serial MAC interfaces for connecting a MAC station, an MCU or a switch. The KD1053 transceiver provides a Serial Management Interface (SMI), also called MDC/MDIO interface, and master SPI/I2C port to access an external EEPROM memory for configuration.

    The transceivers’ parallel MAC interface pins are 1.8V, 2.5V and 3.3V LVTTL compliant; and serial MAC interfaces are 2.5V LVDS.

    FEATURES

    • In 1 Gbps operation mode, 1000BASE-H Physical Coding Sub-layer (PCS) and the Physical Medium Attachment (PMA) sublayers according to the IEEE Std 802.3bvTM - 2017
    • 100 Mbps operation mode supported for applications requesting low data rates and high optical link margin
    • Specified for multimode plastic optical fiber with the channel characteristics specified by IEEE Std 802.3bvTM - 2017 Clause 115. Designed to operate:
      • at 1 Gbps with the fiber optic channel type II and type III according to Clause 115 of IEEE Std 802.3bvTM -2017;
      • at 100 Mbps with 120 m of SI-POF without in-line connectors, or with 40 m with up to 10 in-line connectors
    • Support RGMII v2.0, RMII, MII, SGMII, 1000BASE-X and 100BASE-X standards in the MAC interface
    • Support 1.8V 2.5V and 3.3V LVTTL digital I/O standard for parallel MAC interface; and 2.5V LVDS for serial MAC interface 
    • SMI (MDC/MDIO) interface for configuration and monitoring supporting Clauses 22 and 45, which can be configured as an I2C bus
    • SPI/I2C master interface for reading external boot and configuration EEPROM memory
    • Support for EEE, OAM, Wake-up & Sleep, interruption generation
    • Support for jumbo packets up to 10 KB
    • PTP and Sync-E supported
    • Different loopback modes and PMD test-modes for diagnostics
    • Link/activity monitoring and speed LED outputs
    • Support for high-level ASIL systems
    • Fully integrated digital adaptive non-linear equalizers
    • BER < 10-12 for 1 Gbps and 100 Mbps operation modes
    • 6.2 us latency for 1 Gbps operation and 1.4 us for 100 Mbps (local RGMII to remote RGMII); 5 ns RMS jitter for 1 Gbps operation and 9 ns for 100 Mbps
    • 55 ms of link time for 1 Gbps operation
    • Internal dependability functions: power supply, process and temperature sensors; and FOT received power monitoring
    • Advanced power management with integrated linear voltage regulators for 2.5V: it can be supplied with only external 1.2V and 3.3V power voltages
    • Low power, 460 mW at 1 Gbps
    • Low-cost bill of materials (BOM)
    • Designed to be EMC compliant with CISPR25 Class-5 at component level
    • 65 nm CMOS process
    • Automotive AEC-Q100 grade 2 
    • -40 to +105ºC ambient temperature range
    • 56-pin QFN (7 x 7 mm) ROHS package

    More info: https://kd.tech/product/kd1053/ 

  • KD9351
    The KD9351 is a Fiber Optic Transceiver that implements the Physical Medium Dependent Sublayer (PMD) of a 1000BASE-RHC PHY, compliant with the specifications of IEEE Std 802.3bvTM-2017 standard for gigabit optical communicationsover POF....

  • The KD9351 is a Fiber Optic Transceiver that implements the Physical Medium Dependent Sublayer (PMD) of a 1000BASE-RHC PHY, compliant with the specifications of IEEE Std 802.3bvTM-2017 standard for gigabit optical communications over POF. The KD9351 connects with the KDPOF KD1053 transceiver, which implements a Physical-Coding Sublayer (PCS) and a Physical Medium Attachment (PMA) sublayer, to form a complete automotive 1000BASE-RHC physical layer. With its integrated EMC shielding, the KD9351 transceiver guarantees the highest component-level EMC compliance without the need for any external additions. It can operate either at 1 Gb/s or 100 Mb/s. 

    The KD9351 integrated Fiber Optic Transceiver (FOT) complements the KD1053 IC, providing competitive pricing for EMC critical or galvanic isolated critical links in automotive networks. Optimized for low power, reduced BOM and a small footprint, the KD1053 and KD9351 devices are targeted for automotive applications that use optical Ethernet over Plastic Optical Fiber (POF) for the communications in vehicle data networks. Interconnection of infotainment and Advanced Driver Assistance Systems (ADAS) ECUs are two of the key applications where POF is the best choice.

    FEATURES

    • 1 Gb/s operation mode, 1000BASE-RHC Physical Medium Dependent (PMD) sublayer according to the IEEE Std 802.3bvTM-2017

    • 100 Mb/s operation for applications requesting low data rates and high optical link margin

    • Optimized for multimode plastic optical fiber with the channel characteristics specified by IEEE Std 802.3bvTM-2017 Clause 115

    • Wake-up & Sleep support as per ISO 21111

    • Guaranteed BER < 10-12 for 1 Gb/s and 100 Mb/s operation modes, when operating with KD1053 PCS-PMA transceiver

    • Single 3.3 V supply

    • Low power consumption (see below)

    • Low-cost bill of materials (BOM)

    • Integrated EMC shielding, compliant with CISPR25 Class-5 at component level

    • Automotive AEC-Q100 grade 2

    • -40 to +105 °C operating ambient temperature

    • 36-pin LGA (7 x 8 mm) package TRANSMITTER SIDE

    • High and controlled Extinction-Ratio (ER) for link budget maximization: 15 dB (typ.)

    • Linear pre-emphasis circuitry for LED acceleration

    • Designed to be connected to a differential, current steering DAC, with two interface possibilities (typical values): - DAC full-scale current 6 mA, DAC source single ended termination 50 Ω

    • Current consumption (normal operation mode, typ. value): 74.9 mA RECEIVER SIDE

    • Integrated trans-impedance amplifier(TIA) and differential photo-diode

    • DC restoration

    • Automatic gain control (AGC) to guarantee a constant voltage amplitude regardless of the received photo-current

    • Signal-detection signaling

    • Current consumption (normal operation mode, typ. value): 37.3 mA

    More information: https://kd.tech/product/kd9351/ 

  • KD7251
    The multigigabit solution is single optical chip module KD7251, transmitting over Glass Optical Fiber (GOF) aimed for automotive in-vehicle communications....

  • Automotive Optical 10GBASE-AU Quad-Speed Bridge Transceiver.

    Overview

    The KD7251 is the new KD´s ASIC that implements the BASE-AU physical layers, compliant with the IEEE Std 802.3cz™ specification for automotive multi-gigabit optical communication links over multi-mode glass optical fiber OM3.

    It is a single-chip solution with on-chip optical interface, supporting 2.5, 5, and 10 Gb/s, and includes bridging functionalities to enable the connectivity of MIPI sensors, as cameras and radar (CSI-2®), displays (DSI-2℠), or AI processors (PCIe®) in the vehicle.

    KD7251 enables 40 m with 4 inline connector links over standard duplex OM3 fiber at 10 Gb/s in the whole temperature range. The same cable and connectors may be reused for higher future bitrates (e.g. 25, 50 Gb/s).

    This transceiver guarantees the highest component-level EMC compliance without the need of any external components. This translates into a port with a small PCB area and a reduced bill of materials (BOM), with no need for ESD protections, common mode chokes, EMI filters or DC blocks.

    KD7251 is a native automotive device supporting MACsec, ASIL-B FuSa, TSN support, Wake-Up & Sleep, OAM and dependability functions. This transceiver enables new use cases with optical technology, such as the multi-gigabit Ethernet backbone, zonal gateway connectivity, smart antenna link, and connectivity for radars, cameras, lidar, displays and high-performance computing units.

    Key Features

    • Single-chip solution
    • 2.5/5/10GBASE-AU
    • AEC-Q102-003 grade 2
    • ASIL-B FuSa
    • Reach: 40 meters, 4 inline connectors
    • Latency < 1 us at 10 Gb/s
    • Start time < 100 ms reset to link
    • Wake-up & Sleep
    • Advanced monitoring, dependability functions and OAM
    • 117-pin BGA package
    • Ethernet 5/10GBASE-R, 2.5GBASE-X, USXGMII
    • MIPI D-PHY℠, CSI-2® & DSI-2℠
    • PCIe® Gen 3 8 GT/s
    • IEEE 1722b (MIPI, GPIO, I2C, SPI)
    • PTP, SyncE
    • MACsec
    • Aggregation, disaggregation, and multi-drop functions
    • Asymmetric bit-rate links

    More information: https://kd.tech/product/kd7251/