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EPORT CO.,LTD

Yongin-si,  Gyeonggi 
Korea (South)
http://www.e-port.co.kr
  • Booth: S8138

Eport, The Professional Manufacturer of Advanced Materials!

Overview

Since its establishment in 2010, Eport Co., Ltd. has been importing and selling thermally conductive ceramic powders such as spherical alumina and spherical silicon nitride, used as ceramic fillers in TIM (thermal interface materials). Furthermore, in 2018, Eport established its own R&D center and began developing high-purity spherical alumina using proprietary technology and supplying it to the semiconductor industry. This has enabled it to become a leading thermal conductive material company in South Korea.

Leveraging its expertise in ceramic synthesis, spheroidization, grading, surface treatment, and compounding, Eport Co., Ltd. collaborates with customers to review and evaluate the suitability of thermal conductive materials, thereby providing innovative heat dissipation solutions. Eport also continues to invest in the development of fillers optimized for cutting-edge semiconductor packaging materials (EMC) such as GDDR7/HBM.

To embrace the upcoming space age, AI (artificial intelligence), and autonomous driving era, Eport is committed to contributing to the advancement of human civilization through the development of sustainable new materials.


  Press Releases

  • Eport, a semiconductor materials company, has successfully secured 12.8 billion won in Series A funding. Eport has proven its competitiveness by securing a large amount of funding in its first institutional round. The company plans to use this funding to build a factory for mass production of its materials.

    According to venture capital (VC) industry sources on the 3rd, Eport secured investment from Kiwoom Investment, Comes Investment, We Ventures, KC Investment Partners, STIC Ventures, and DT& Investment. Kiwoom Investment led the investment, and the full investment has been completed.

    Founded in 2010, Eport manufactures and sells ceramic powders for semiconductor encapsulation materials (EMC and LMC). The company's materials are used as encapsulation materials for the semiconductor industry or as fillers and sealants in various resins. They are characterized by high fill ratios, excellent flowability, and high purity.

    Eport's strength lies in its extensive portfolio of core technologies related to semiconductor materials. These include low-alpha technology that removes radioactive contaminants such as uranium and thorium, ultra-high-purity fine-grained spherical alumina manufacturing technology, and heat-dissipating material technology that contributes to solving heat generation issues in advanced memory semiconductors. The company has also secured numerous related patents.

    This investment marks Eport's first institutional investment, bringing the total investment to approximately KRW 14.4 billion. The company plans to use the funds to build a factory for mass production of its materials. The majority of the investment will be used to purchase mass production equipment for the factory.

    An Eport representative stated, "With this Series A investment, our goal is to establish ourselves as a specialized supplier of advanced memory semiconductor materials, such as HBM. Furthermore, we aim to become the world's leading ceramic powder manufacturer."

    Investors noted that Eport's technological prowess is unique in Korea. They anticipate expanding its client base to include major domestic and international companies. They also highlighted Eport's strong competitiveness in materials compared to global competitors.

    A VC executive who invested in Eport said, "Eport recently completed registration as a major domestic company and is preparing for mass production. The core material, 'low-α spherical alumina,' is currently monopolized by a Japanese company, but Eport's product offers superior safety and cost-effectiveness compared to that."

    Eport plans to successfully localize semiconductor materials, previously dependent on imports, and expand into the global market. A significant number of major corporations in Japan are reportedly showing interest in Eport's materials.

    https://www.thebell.co.kr/free/content/ArticleView.asp?key=202507031027302120106143

  • 半導體材料公司Eport成功完成128億韓元A輪融資。Eport在首輪機構融資中獲得鉅額資金,證明了其競爭力。該公司計劃利用這筆資金建設一座用於量產其材料的工廠。

    據風險投資(VC)行業消息人士3日透露,Eport已獲得Kiwoom Investment、Comes Investment、We Ventures、KC Investment Partners、STIC Ventures和DT& Investment的投資。Kiwoom Investment領投,目前已完成全部投資。

    Eport成立於2010年,生產和銷售用於半導體封裝材料(EMC和LMC)的陶瓷粉末。該公司的材料可用作半導體行業的封裝材料,或用作各種樹脂的填料和密封劑。這些材料具有填充率高、流動性好、純度高的特點。

    Eport的優勢在於其豐富的半導體材料核心技術組合。這些技術包括去除鈾和釷等放射性污染物的低α技術、超高純度細顆粒球形氧化鋁製造技術,以及有助於解決先進存儲半導體發熱問題的散熱材料技術。該公司還獲得了多項相關專利。

    本次投資是Eport的首筆機構投資,使總投資額達到約144億韓元。該公司計劃利用這筆資金建設一座用於量產其材料的工廠。大部分投資將用於購置工廠的量產設備。

    Eport的一位代表表示:“通過此次A輪融資,我們的目標是成爲HBM等先進存儲半導體材料的專業供應商。此外,我們還致力於成爲全球領先的陶瓷粉末製造商。”

    投資者指出,Eport的技術實力在韓國獨樹一幟。他們期待Eport的客戶羣能夠進一步擴大,涵蓋國內外大型企業。他們還強調了Eport在材料領域與全球競爭對手相比的強大競爭力。

    一位投資Eport的風險投資高管表示:“Eport最近完成了國內大型企業的註冊,並正在準備量產。其核心材料‘低α球形氧化鋁’目前被一家日本公司壟斷,但Eport的產品相比後者,安全性和成本效益更高。”

    Eport計劃成功實現此前依賴進口的半導體材料的國產化,並進軍全球市場。據報道,日本多家大型企業對Eport的材料表現出濃厚興趣。

    https://www.thebell.co.kr/free/content/ArticleView.asp?key=202507031027302120106143

  • (Aug 12, 2025)

  Products

  • Low Alpha Spherical Alumina低α球形氧化鋁
    [Characteristics]
    -Specific synthetic technology
    -Excellent spheroidization technology & manufacturing
    -Spherical alumina mixture for EMC
    -Low Alpha content:U,Th content

    [Application]
    Epoxy molding compound (EMC)
    Die attach paste/film...

  • [Features and Benefits]

    1.High Chemical Stability and Corrosion Resistance

    Ultra-high purity reduces the risk of leaching of impurity ions (such as Fe⁺ and Na⁺), ensuring stability in strong acid, alkali, or high-temperature environments, making it suitable for harsh environments such as semiconductor etching and chemical catalysis.

    2. Low Radioactivity Safety

    Strict control of radionuclides prevents radiation accumulation over long-term use (for example, alpha particle radiation from electronic devices can cause integrated circuit failure), meeting the needs of radiation-sensitive fields such as medicine and aerospace.

    3. Excellent Physical Properties

    High Sphericity: Flowability approaches that of spherical silica, resulting in high packing density, making it suitable for precision injection molding and electronic packaging.

    Low Impurity Interference: Minimizes the impact on the electrical properties of semiconductor devices (such as reduced leakage current and improved insulation).

    High Thermal Stability: α-Al₂O₃ has a high phase transition temperature (approximately 1200°C), making it suitable for high-temperature applications.

    [Application Field] :

    High-purity, low-radiation spherical alumina, with its extreme purity and safety, is irreplaceable in the following high-end fields:
    (1)Semiconductor Industry

    Semiconductor Equipment Components: Coating materials for components such as etching chambers and plasma nozzles to prevent metal impurities from contaminating wafers.

    Electronic Packaging Fillers: Highly thermally conductive insulating fillers (such as epoxy resin composites) for chip packaging or substrate filling, reducing thermal resistance while preventing circuit failure caused by ion migration.

    Photoresist Carriers: Ultra-high purity ensures no impurities interfere with resolution during the photolithography process.

    (2) Electronic packaging and ceramic materials
    Electronic substrates and MLCC:
    The low-temperature sintering characteristics can reduce the sintering temperature of ceramic substrates or capacitors (e.g., from 1600°C to 1200°C), reduce energy consumption and avoid high-temperature oxidation of metal electrodes (e.g., silver, copper).

    (3)Thermal conductive fillers:
    The high filling capacity of spherical particles and the activity of low α phase enable them to simultaneously improve thermal conductivity and processing fluidity in polymer-based composites (e.g., epoxy resin).

    (4)Bioceramics:
    Low-temperature sintering properties can reduce thermal stress during the preparation of bioceramics (such as dental implants and bone repair materials), thereby improving yield.

    (5)Specialty ceramic injection molding:
    The high fluidity of spherical particles facilitates the injection molding of complex-shaped ceramic components (such as electronic ceramic devices).

    (6)Aerospace and Nuclear Industry
    -Spacecraft Thermal Insulation Materials: Low-emission properties reduce cosmic ray background interference and are used as thermal shielding for detectors or satellites.

    -Nuclear Reactor Structural Components: High purity prevents radioactive activation (such as secondary radiation produced by neutron irradiation) and are used for core insulation or shielding.

    (7). Medical Equipment

    Radiotherapy Equipment Components: Low background radiation prevents additional radiation exposure to patients or operators.

    Implant-Grade Ceramic Materials: Ultra-high purity reduces biotoxicity (such as inflammatory reactions caused by Fe³⁺) and are used in dental implants or orthopedic restorations. 4. Scientific Research and High-End Instruments

    Synchronous Radiation Facility: Used as a coating material for vacuum chambers or optical components to prevent impurity scattering that affects X-ray performance.

    High-Precision Sensors: Used as a substrate for sensitive elements in pressure and temperature sensors to ensure signals are free of impurity interference.

    .

  • Spherical Boron Nitride (BN) 球形氮化硼
    Spherical Boron Nitride (BN)...

  • Characteristics
    High sphericity, High thermal conductivity
    Thermal interface materials
    Excellent compatibility with organic systems
    Stable Physico - chemical properties, low dielectric
    Low Mohs hardness (<2)
    Application
    Thermal interface materials
    Thermal conductivity Alumina - based CCL
    Thermal engineering plastic
    High frequency power devices
    Specifications
  • Spherical Alumina 球形氧化鋁
    High thermal conductivity
    Thermal interface material : gap filler / pad, thermal grease
    High degree of sphericity
    Thermal Engineering plastics : LED lamp cover, electronic product shell
    High load ability...

  • 【Characteristics】
    High thermal conductivity
    High degree of sphericity
    High load ability
    High abrasion

    【Application】
    Thermal interface material : gap filler / pad, thermal grease
    Thermal Engineering plastics : LED lamp cover, electronic product shell
    Al based CCL : power circuit board, LED circuit board 
    Alumina ceramic filter
    Thermal spray coating

    【Specifications】

  • Low Ionic Impurity Spherical Alumina低離子雜質球形氧化鋁
    Low impurity
    (Na⁺< 5ppm, Cl⁻< 2ppm)
    Epoxy molding compound (EMC)
    Low EC : <10μs /cm...

  • Application 
    Epoxy molding compound(EMC)
    Low EC : <10μs /cm
    Die attach paste/film
    Thermal interface material
    Lithium- ion battery cathode material