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Heidelberg Instruments Mikrotechnik GmbH

Heidelberg,  Germany
https://heidelberg-instruments.com
  • Booth: I3210

The power of direct writing

Overview

With over 40 years of experience and more than 1,500 systems installed worldwide, Heidelberg Instruments is a global leader in the design, development, and production of high-precision laser lithography systems, maskless aligners, and nanofabrication tools.

Our portfolio ranges from compact tabletop solutions—ideal for prototyping and R&D or small series production—to advanced photomask manufacturing equipment tailored for high-volume industrial use. This broad offering enables support for a wide spectrum of micro- and nanoscale surface structuring techniques, including precise 2D patterning and the creation of 2.5D features through grayscale lithography.

Thanks to their versatility, Heidelberg Instruments systems are trusted by leading universities and research institutes around the world, as well as by industrial production facilities. Typical application areas include micro-optics and photonics, electronics, sensor technology, semiconductors and advanced packaging, next-generation display manufacturing, quantum devices, MEMS, microfluidics, 2D materials, photomask production, and many more.

  Press Releases

  • Heidelberg, Germany—Heidelberg Instruments, a world-leading provider of advanced laser lithography systems, is pleased to announce a continued stream of orders for the ULTRA Semiconductor Mask Writer from photomask production groups across the US and Asia. This sustained demand highlights the company's commitment to delivering high-quality, reliable technology that meets evolving customer needs.

    Since launching its first ULTRA system six years ago, the company has consistently refined and advanced its technology to meet the increasing demands of semiconductor manufacturers worldwide. The ULTRA Semiconductor Mask Writer is specifically designed to create photomasks essential for fabricating a wide range of electronic devices, including microcontrollers, power management systems, LEDs, Internet of Things (IoT) devices, MEMS, and cutting-edge Artificial Intelligence (AI) applications.

    Key advantages of the ULTRA include:

    • Cost-Effective Solution with High Precision and Accuracy: The ULTRA can produce structure sizes as small as 500 nm while maintaining excellent critical dimension uniformity and superior image quality.
    • Efficient Production: With write speeds of up to 580 mm² per minute, the ULTRA ensures efficient and reliable mask production.
    • Seamless Integration: Its compact design allows easy integration into existing mask shop infrastructures, making it an ideal choice for semiconductor manufacturers looking to expand or upgrade their capabilities.
    • Advanced Features: The standard configuration includes fully automatic mask handling, a Zerodur® stage, low distortion optics, and high-precision position control, ensuring top-level performance and reliability.

    Looking ahead, the future of semiconductor photomask production is set for significant growth, driven by expanding applications in industries ranging from consumer electronics to automotive and industrial sectors. Heidelberg Instruments remains committed to leading the way with innovative solutions like the ULTRA, helping customers navigate the challenges and opportunities in this dynamic industry.

    For more information about the ULTRA Semiconductor Mask Writer, please visit https://heidelberg-instruments.com/product/ultra-semiconductor-mask-writer/

    About Heidelberg Instruments

    Established in 1984, trusted in more than 50 countries with over 1,400 systems installed worldwide, Heidelberg Instruments is a global leader in the design, development, and production of high-precision laser lithography systems, maskless aligners, and nanofabrication systems, offering solutions from tabletop tools to high-end photomask manufacturing equipment. Our versatile systems enable micro- and nanoscale surface structuring, including 2D-patterning, 2.5D features via Grayscale lithography, and 3D structuring through Two-Photon Polymerization. Renowned universities, R&D institutes, and industry production facilities worldwide rely on our systems for applications in micro-optics, photonics, electronics, semiconductors, quantum devices, MEMS, microfluidics, 2D materials, and more.

    Contact:

    Heidelberg Instruments Mikrotechnik GmbH

    https://heidelberg-instruments.com/

    press(at)heidelberg-instruments.com

    This press release is intended for informational purposes only. Heidelberg Instruments reserves the right to change product specifications without notice.

  • Heidelberg, Germany – Heidelberg Instruments has made significant performance upgrades to its renowned DWL 66+ direct-write lithography system, solidifying its position as the ultimate research tool for microfabrication. The system now delivers a market-leading minimum feature size of 200 nm and advanced grayscale capabilities with 65,536 levels, empowering researchers to push the boundaries of innovation in different dimensions.

    The new High-Resolution Mode, Write Mode XR, achieves an unsurpassed combination of resolution, quality, and speed. Its 200 nm minimum feature capability allows for the fabrication of highly complex micro- and nanostructures, enabling applications in quantum devices, optics, and photonics that previously required more time-consuming e-beam lithography. This advancement accelerates development cycles and frees up cost-intensive e-beam systems for their most demanding tasks.

    Complementing the high resolution is the system's professional-grade grayscale lithography. With an unprecedented 65,536 intensity levels, the DWL 66+ can create intricate 2.5D microstructures, such as micro-lenses and other micro-optical devices, with outstanding surface smoothness in photoresists up to 150 µm thick.

    With 30 years of continuous development and over 400 units installed, the DWL 66+ is a proven, robust, and extremely flexible platform for R&D and rapid prototyping. These latest enhancements reinforce its value, offering users a powerful combination of extreme resolution and operational flexibility.

    For more information on the DWL 66+ lithography system, please visit: https://heidelberg-instruments.com/product/dwl-66-laser-lithography-system/

    Contact:

    Sonja Pfeuffer, Head of Marketing & Communications

    [email protected]

    Further information
    https://heidelberg-instruments.com/
     

    About Heidelberg Instruments Mikrotechnik GmbH:

    With over 40 years of experience and well over 1,500 systems installed in more than 50 countries, Heidelberg Instruments is a global leader in design, development and production of high-precision laser lithography systems, maskless aligners, and nanofabrication systems offering solutions from tabletop tools to high-end photomask manufacturing equipment. The versatile systems enable a broad spectrum of surface structuring on the micro- and nanoscale, including 2D-patterning and the creation of 2.5D features by Grayscale lithography. Due to their flexibility, the systems are valuable assets to leading universities and R&D institutes around the world, as well as to industrial production facilities. Typical fields of application include micro-optics and photonics, electronics and sensors, semiconductors and advanced packaging, next-generation display manufacturing, quantum devices, MEMS, microfluidics, 2D materials, photomask production, and many others.

  Products

  • VPG 300 DI | MASKLESS STEPPER
    Stepper-level performance with unmatched speed and flexibility for R&D, prototyping, and microfabrication: The VPG 300 DI is a high-performance direct-write lithography system for patterning high-resolution microstructures on wafers up to 300 mm.

    ...

    • VPG 300 DI Maskless Stepper | Heidelberg Instruments

    VPG 300 DI – The Power of a Stepper, The Freedom of Direct Write

    The VPG 300 DI bridges the gap between R&D and production, offering sub-micron resolution and tight overlay accuracy comparable to traditional i-line steppers—without the cost and delays of mask procurement. Ideal for rapid prototyping, process development, and applications requiring frequent design iterations. From CAD to exposure in minutes, the system enables fast design transfer and daily iteration cycles, dramatically accelerating development timelines.

    Key Benefits

    • High-Speed Exposure: Custom SLM and optimized data path enable 100×100 mm² writing in just 9 minutes
    • Stitching-Free Large Areas: Create large dies or devices without stitching errors
    • Instant Design Changes: Modify CAD files and expose immediately—no mask handling required
  • ULTRA | SEMICONDUCTOR LASER MASK WRITER
    The ULTRA delivers high-throughput, high-precision photomask writing for mature semiconductor nodes. A cost-effective solution for producing photomasks for microcontrollers, PMICs, LEDs, IoT, photonics, and MEMS—maximizing yield, speed, and reliability....

    • ULTRA Semiconductor Mask Writer | Heidelberg Instruments

    The ULTRA integrates state-of-the-art technology to address the primary concerns of modern mask shops: speed, accuracy, and return on investment.

    The system’s advanced exposure engine and optimized write modes dramatically reduce mask writing times, enabling you to produce a standard 6” photomask in less than 45 minutes.

    • Fast SLM-based Exposure Engine: Delivers write speeds up to 580 mm²/minute without compromising quality.
    • Full Automatic Mask Handling: Reduces operator overhead with a simple, easy-to-use mask loading interface and ensures consistent, repeatable loading and unloading for continuous operation.
    • Optimized Write Modes: Provides the flexibility to prioritize speed or resolution to match your specific job requirements.

  • MLA 300 | MASKLESS ALIGNER FOR VOLUME PRODUCTION
    The MLA 300 is designed for high-volume production, offering unmatched flexibility and precision in industrial lithography. It supports wafers up to 300×300 mm and adapts to surface variations, eliminating costly, time-consuming mask production....

    • MLA 300 Industrial Maskless Aligner ǀ Heidelberg Instruments

    The MLA 300 Maskless Aligner enables innovative solutions for complex lithography challenges, including advanced packaging, sensor calibration, and MEMS fabrication. With high throughput, 1.5 μm resolution, a simplified workflow, and seamless MES integration, it is the ideal choice for a wide range of industrial applications. 

    Application areas include semiconductors and advanced packaging, sensor and sensor ICs, MEMS and microfluidics, discrete components, integrated circuits and ASICs, probe cards, power electronics, and OLED displays.

    Key Features

    • High-Throughput Production: Optimized for industrial-scale production with a minimum feature size of 1.5 µm. For higher volume requirements, we also offer a high-throughput write mode with 3 µm minimum feature size.
    • Advanced Precision: This system offers the highest optical quality, ensuring precise and accurate patterning across a wide range of challenging substrates.
    • Full Automation: The MLA 300 features full automation, including customizable loading options, advanced software designed for production environments, and integration with MES systems.
    • Patented Substrate Tracking Technology: Real-time autofocus compensates for substrate warp or corrugations, guaranteeing flawless patterning and uniformity on all surfaces.
  • MLA 150 | ADVANCED MASKLESS ALIGNER
    The MLA 150 Maskless Aligner accelerates innovation with sub-micron lithography down to 0.45 μm, eliminating photomasks and long lead times. From design to substrate in minutes—fast, flexible, and easy to use. Ideal for R&D and industrial prototyping....

    • MLA 150 Advanced Maskless Aligner ǀ Heidelberg Instruments

    Key Benefits

    • No Photomasks Required: Pattern directly from digital designs using a dynamic mirror device (DMD).
    • Fast Turnaround: Expose a full 150 mm wafer in under 16 minutes.
    • Sub-Micron Precision: Achieve feature sizes down to 0.45 μm.
    • User-Friendly Interface: Train new users in under an hour—ideal for shared lab environments.

    Designed for R&D and Small Series Production, the MLA 150 is built for flexibility, making it the perfect tool for:

    • Academic Research Labs
    • Industrial Prototyping
    • Small Batch Manufacturing

    Applications include quantum devices, MEMS, micro-optics, and life sciences.

    Advanced Capabilities

    • Dual-Wavelength Exposure: Supports 375 nm and 405 nm lasers for compatibility with g-, h-, and i-line photoresists.
    • Versatile Substrate Handling: Easily process small pieces (down to 3×3 mm²), thin foils, and warped wafers.
    • Grayscale & High-Aspect-Ratio Modes: Create complex 2.5D structures and steep sidewalls for MEMS and microfluidics.
    • Interactive “Draw Mode”: Directly draw and expose patterns on live camera images—ideal for quick prototyping and precise electrode placement.

    Precision & Stability

    • Automated Alignment: Achieve 250 nm accuracy with digital compensation for offset, rotation, and scaling.
    • Dynamic Autofocus: Ensures sharp, uniform features across varied substrates.
    • Environmental Control: Integrated chamber with temperature-controlled laminar airflow (±0.1°C) for consistent, repeatable results.
  • DWL 66+ | LASER LITHOGRAPHY SYSTEM
    The ultimate lithography research tool: The DWL 66+ offers unmatched versatility, 200 nm resolution, and professional-grade grayscale with 65,536 levels. Ideal for R&D and prototyping. Fully customizable and proven in over 400 installations....

    • DWL 66⁺ Ultimate Lithography System ǀ Heidelberg Instruments

    The DWL 66+ is a high-performance direct-write laser lithography system engineered for R&D and rapid prototyping across a wide range of microstructure applications, including MEMS, microfluidics, optics, photonics, and quantum devices.

    It delivers the highest resolution on the market (down to 200 nm), professional-grade grayscale capabilities with 65,536 levels, and unmatched versatility through a fully customizable system configuration. With over 400 systems installed worldwide, it’s a proven solution for advanced research environments.

    Key Features

    • Write Mode XR: Achieve 200 nm minimum feature size with exceptional speed and quality.
    • Grayscale Lithography: Outstanding surface quality in thick resists up to 150 µm.
    • Flexible Substrate Handling: Compatible with diverse materials, shapes, and sizes—including curved surfaces.
    • Real-Time Autofocus: Dual autofocus system ensures precision even on transparent or low-reflectivity substrates.
    • Interferometric Position Control: Guarantees high pattern fidelity and placement accuracy.
  • VPG+ 1400 FPD | VOLUME PATTERN GENERATOR
    Designed for high-throughput photomask production on large substrates (1.4 m), the VPG+ 1400 FPD is optimized for Flat Panel Display applications. It’s the ideal solution for manufacturers working with large-format substrates in the display industry....

    • VPG+ 1400 FPD Volume Pattern Generator | Heidelberg Instruments

    The VPG+ 1400 FPD is the largest Volume Pattern Generator in our portfolio, engineered for high-throughput photomask production on large-format substrates (up to 1.4 m) in Flat Panel Display (FPD) applications. Trusted by leading photomask manufacturers worldwide, it combines breakthrough efficiency with superior exposure quality.

    Key Benefits

    • Optimized for FPD Manufacturing: Tailored for TFT arrays, color filters, and ITO electrodes.
    • Exceptional Throughput: Accelerates mask production for high-volume display lines.
    • Reliable 24/7 Operation: Ensures consistent performance and predictable delivery.

    Essential Features

    • 1.2 nm Alignment Precision: Differential interferometer for ultra-accurate patterning.
    • Mura Optimization: Delivers excellent CD uniformity and resolution.
    • Closed-Loop Environmental Chamber: Maintains thermal and particle stability.
    • Advanced Metrology: Enables precise second-layer alignment and greytone mask production.

Categories

200 Equipment, Assembly
  • Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
    • 204 Equipment, Mems
  • Double sided mask aligner
    • 205 Equipment, Nanotechnology
  • Equipment, Nanotechnology Tools
    • 207 Equipment, Process
  • Lithography; Exposure; Aligners; Direct Write Systems; Steppers; Scanners; Nanoimprint
    • 700 Manufacturing Services
  • Lithography; Patterning service
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