Welcome to SBT ULTRASONIC
Overview
SBT Ultrasonic Technology Co.,Ltd. (SBT ULTRASONIC), founded in 2007 in Shanghai, offers a range of advanced ultrasonic solutions for semiconductor packaging. We have over 18 years experience in ultrasonic bonding and scanning.
OUR PRODUCTS
- Wafer Level Scanning Acoustic Microscope(SAT)
- Ultrasonic Wire Bonder
- Ultrasonic Die Bonder
- Scanning Acoustic Microscope(SAT/C-SAM）
- IGBT terminal Ultrasonic Welder
- Pin Ultrasonic Welder
- Ultrasonic Dry Cleaning Systems(USC)
- Laser Welding Process Monitoring Systems
- Laser Welding Depth Measurement System
SBT ULTRASONIC has local sales and support offices in China, Southeast Asia and Europe. Other areas are covered by a network of local representatives.
SEMICON Taiwan 2024 Booth Number: #R8205
Mobile: (86) 15901603231
E-mail: [email protected]
Website: www.sbt-ultrasonic.com
Products