Overview
Solid State UV Laser de-bonder is designed to eliminate heat impact and laser damage during the de-bonding process of RDL, Fan-out, CoWoS. Advantages : lower CoO, high WPH, deeper DOF good for covering war-page handling for thin wafers or substrates. Physical Vacuum Deposition Solutions: KYO is an expert in PVD process, and having solutions for Ti/Cu seed layer deposition of RDL, Fan-out and TGV, leveraging patented innovations and self-developed key components to deliver superior performance.
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