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Micron Star Technology Limited

Taipei City,  Xinyi Dist. 
Taiwan
http://www.keybond.com.tw/
  • Booth: J2238

歡迎來到新磊精密有限公司的攤位-J2238

Overview

Guided by the principles of Integrity, Innovation, and Efficiency, we have become a leading professional distributor of digital research instruments and systems in Taiwan, Hong Kong, and China. We will continue to uphold our commitment to integrity and a passion for excellence, bringing you higher quality, more accessible, and a wider range of professional products and services.


Our Products and Solutions

A. AFM Atomic Force Microscopes and Probes (Olympus-Pyramid, Adama, Rockymountain, Appnano, Mikromash, SCDprobes)

  • Surface topography/roughness/step height analysis

  • Electrical analysis

  • Magnetic analysis

  • Force spectroscopy

  • Intermolecular force analysis

B. Imaging System Solutions

  • Zeiss Microscopes

    • Zeiss Stemi 305/508 Stereo Microscopes

      • PCB Inspection System: This system uses a Zeiss Stemi series stereo microscope, a Pentagon IV 4K camera, and specialized measurement software to inspect electronic components like PCBs and probe cards.

    • Zeiss Axioscope Metallurgical Microscopes

      • Wafer Inspection System: This system pairs a Zeiss Axioscope series metallurgical microscope with a Hamamatsu InGaAs near-infrared camera. It leverages the property of silicon to be completely transparent in the short-wavelength infrared band to inspect the internal circuitry of wafers.

      • Failure Analysis: The Photon etc. high-end deep-cooling infrared camera, with its high sensitivity and low noise, can be used to detect and identify circuit abnormalities or failure points on electronic components.

  • High-Speed Imaging Solutions

    • Wire bonding process photography

    • Welding process photography

    • Surface plasma process photography

  • Non-Contact Strain Measurement System/Drop Testing

    • Impact testing

    • Drop testing

    • Vibration testing

C. Warpage and CTE Test system

  • Turn-Key Solution: Warpage/CTE/Strain Measurement
  • Temperature Range: 25 ~ 300 degrees Celsius
  • Temperature Ramp rate: 3 degrees Celsius / sec
  • Specimen size: 10mm ~400mm
  • Meet JEDEC Standard JESD22-B112

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