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Grintimate Precision Industry Co., Ltd.

Xitun Dist.,  Taichung City 
Taiwan
https://www.grintimate.com/
  • Booth: J2938

Overview

Mastering Key Technologies of Grinders. 

Closing to customer needs with total solutions.

GRINTIMATE PRECISION INDUSTRY CO., LTD, - a professional manufacturer of high-precision hydrostatic grinding machines, with exclusive hydrostatic bearing technology, including advanced hydrostatic bearing spindles, hydrostatic rotary worktables and hydrostatic guideway modules.  Full series are equipped with a hydrostatic bearing system, providing high-precision, high-quality, low-wear and environmentally friendly precision processing machines to our customers.

The hydrostatic bearing system features high rigidity, vibration resistance, non-contact between metals, high loading capacity and long service life, well regarded in high-tech industries, electric vehicle industries, aerospace, medical, metal processing industries, perfect for the grinding of a wide range of materials such as aluminum alloy, stainless steel, tungsten steel, ceramics, wafer, SiC, optical glass, etc.  Not only greatly improve the grinding efficiency but also maintain a stable and high precision accuracy during grinding.

Our main products include hydrostatic cylindrical plunge grinding machines-special purpose (CTS-100), hydrostatic cylindrical plunge grinding machines (CDC-series), hydrostatic cylindrical angular grinding machines (CAC-series) and horizontal hydrostatic rotary surface grinder (GRC-series).  Our Wafer Grinder GTR-1215 will be presented at SEMICON TAIWAN 2023 in this September.  Let’s expect it!!

  Products

  • GTR-1215
    Semiconductor Dedicated of Hydrostatic Wafer Grinder...

    • Won the 2023 Taiwan Excellence Award.
    • Online Monitor of Grinding status, prevent the wafer from being deformed and damaged.
    • Real-time monitoring of wafer thickness and automatic correction to ensure the accuracy of wafer thickness.
    • Chuck table could be customized according to the needs of different sizes wafers.
    • Achieve 300mm Si wafer thinning thickness <100µm, TTV <2µm, Ra 0.01µm
    • Especially designed for widely used in high hardness plane materials, rapid thinning, and achieve the effect of flattening.
    • Optional granite base.
  • GTR-1215A
    Wafer Grinder with EFEM...

    • Compatible with 4-12inch wafer grinding. Our system monitors grinding loads while grinding.
    • This prevents workpiece deformation and damage caused by excessive pressure during the process.
    • The size of the chuck can be customized according to customer needs, meeting the grinding and thinning process requirements of different sizes of semiconductor materials.
    • Real-time monitoring and automatic correction to ensure the accuracy of wafer thickness.
    • Automatic wafer loading and unloading. Other devices such as Loadport, Wafer Robot, Aligner and cleaning system can all be customized according to the customer's requirements.
    • Adding Adaptive Control system to the controller's upgraded software, providing stable grinding pressure and enhancing surface precision.
    • We also develop equipment software, with a visual interface, various applications and support for SECS/GEM.
  • GTR-2386
    Dual Spindles with Ultrasonic Hydrostatic System wafer Grinder...

    • Dual hydrostatic built-in spindles are equipped with 3 rotary worktables, These 3 worktables can simultaneously perform wafer thinning processing, thereby improving production efficiency.
    • The multi-worktable design also allows the user to process various materials, thicknesses or different processes of rough and fine grinding at the same time. This enhances the flexibility of the application.
    • This machine is equipped with a self-developed software application, which can provide users friendly and convenience in operations. The software application, presented through an intuitive interface, enables the operator to easily control the processing parameters, monitor the progress, and adjust the parameters in real time to ensure the best results. It also supports SECS/GEM. .
    • The machine is equipped with a high-pressure cleaning mechanism, which can automatically perform high-pressure cleaning during the thinning process. It’s able to completely remove the cutting chips and residues generated which remained on the G.W. during the grinding process.
    • It comes with automatic thickness measurement device, high-pressure cleaning chip removal system, self-developed equipment software and visual operation interface and the ability for multiple applications.
    • Built-in ultrasonic spindle system for option. This technology can achieve high-frequency ultrasonic vibration, making the wafer thinning process more stable and high efficient.
    • Ultrasonic vibration can effectively reduce the energy requirements for material grinding.
    • It can also shorten the processing time, decrease the stress and thermal damage of the wafer, and reduce the wear on the grinding wheel.

Categories

200 Equipment, Assembly
  • Backgrind; Slicing; Lapping; Polishing Equipment
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