Tesec Corporation

471-TT is a DC tester with a new concept that realizes the simultaneous measurement of multiple chips in the wafer process. Inheriting TESEC's strength in high-voltage and high-current measurement technology, the tester has significantly increased the productivity compared to the conventional testers by measuring multiple chips simultaneously.

One-Pass test of Avalanche measurement is supported to meet the demand of today's market. Dedicated measurement unit, which is only for 8 parallel model, is required. Also, it may not be applicable depending on the test condition and measurement environment.

【Feature】

• Improved cost performance through simultaneous measurement of multiple chips (8 / 16 parallel)
• DC measurement and Avalanche measurement in 1 test system
• Significantly shortened the data transmission time by LAN connection
• Faster relay switching shortened the measurement time
• Parallel measurement is stabilized by our accumulated measurement technology (Max 2 kV / 20 A)
• Voltage and Current Limitation settings reduce the load on the probe pin
• Automatically calculate the number of chips to be measured simultaneously so that total required current of the chips to be lower than the predetermined maximum applicable current value (current capacity of the prober chuck)

This test system is designed to measure the static characteristics of discrete semiconductor devices.

1.2 kV / 65 A (130 A for C-E) measurement is available as a standard and that can be expanded to 2.2 kV / 65 A (200 A for C-E). With an optional unit, at a maximum of 5 kV / 2000 A measurement is available.

With its high versatility, the tester can be used in various applications such as the wafer test when a prober is connected and the final test when a handler is connected.

【Feature】

• VI Source Measure Modules Structure
• 1.2 kV / 130 A (up to 2.2 kV / 200 A ) measurement capability
• High Speed Measurement
• Multi-device test (Simultaneous measurement of 2-in-1 device such as Dual Gate FET2)
• Wafer parallel test (2-chip simultaneous measurement)
• On-Screen Waveform Monitor
• Conventional High Current Unit and High Voltage Unit of TESEC are applicable.

IPD/IPM Test System 530-IT is designed with a new concept that incorporates the idea of IC tester into the DNA of power devices measurement technology TESEC has accumulated over many years.
It provides the optimized testing solutions for IPD/IPM, which is a combination of Logic ICs and Power Devices, and various other devices.

【Feature】

• Utilized the measurement technology of testers for power discrete device.
• Maximum 2.2kV/67A (max 200A) measurement capability. Expandable by adding external units.
• Supports two device parallel measurements.
• Easy language-less test program creation (fill-in-the-blank method)
• High-speed leakage current measurement
• Various bias application waveforms and timing

3430-SW is designed to measure the dynamic characteristics of IGBT/MOSFET devices at high speed. Parallel measurement is available at up to 4 test stations by connecting the 3430-SW and respective test stations provided for test items. (Standard: 2 test stations)
Whole system can be controlled by on computer.

【Feature】

• Low inductance structure reproduces ideal waveforms
• High speed waveform analysis shortened the test time drastically from the conventional model

The 5880-IH is the latest strip handler optimized for parallel testing of devices on leadframe strips without singulation.

It integrates advanced alignment algorithms and refined Z-axis correction mechanisms inherited from previous models, coupled with a high-load-capacity, high-precision XY stage to achieve stable multi-site contact with minimal stroke deviation.

Temperature testing capability is also incorporated, enabling high-reliability evaluations under controlled thermal conditions. These features collectively maximize test cell efficiency and significantly improve overall throughput.

【Features】

• High throughput by simultaneous measurement of multiple units
• JAM free stable operation
• High load capacity, high precision table
• High resolution color camera
• Optional AGV Loader & Unloader
• Lot management by barcode / 2D code reader
• Chamber-free configuration
• Auto Socket Alignment function Equipped
• Auto Cleaning Mechanism Equipped
• SEMI S2/S8 compliant
• SECS/GEM compliant
• Temperature Testing Environment (Option: Ambient/Dual-temp/Tri-temp)

5170-IH is the handler to test the leadless devices such as QFN,BGA and WLCSP diced on the wafer ring. It is capable of hot and cold temperature test. The stable testing and high speed indexing of the devices on the ring are supported by precise device positioning information and optimized probe-pin contact pressure that are ensured by the positioning (x, y, z, θ) compensation before testing with visual inspection system.

【Feature】

• High throughput 
• High withstand load and high thrust table 
• Maximum Strip Attachment Area: 300 mm(L) × 300 mm(W) [⌀300 mm for WLCSP]
• LOT control with barcode/2D code reader 
• Easy device type conversion — test socket replacement and display screen setting
• Auto-cleaning function of socket with programmable timing
• 6/8/12 inches ring conversion 
• SEMI S2/S8 compliant
• SEMI G85 compliant
• SECS/GEM compliant
• Highest test temperature: 155℃
• Lowest test temperature: −45℃
• Upgrade from the ambient temperature system to the temperature control system is available at the installed location