UNLIMITED PART SIZE: Access to remote bond targets on large
packages or modules with WEST·BOND’s throat-less chassis and
micromanipulator design. All machines components are arrayed above the
horizontal bond plane, eliminating any restriction to package size or shape.
With the EX version of this system, the bonder can be suspended over very
large parts. This manual model can be configured to bond all types of
applications from ● Microwave ● Semiconductor to ● RF and ● Hybrid
production.
CONVERTABILITY: WEST·BOND introduced the first triple convertible wire
bonder back in November of 1969, today WEST·BOND introduces a new tool head
that can bond it all: 45º wedge, 90º feed for wire and ribbon as well as ball bonding. A
simple exchange of clamp assemblies, bond tool, and wire path provided with the
software mode will allow conventional 45º wire feed, deep access wire or ribbon, ball
bonding, insulated wire and single point tab / lead bonding. All programmed bond
variables as well as machine settings for each bond mode are retained in the machines
memory.