Hypersonic, Inc.

This system enables multi-substrate stencil printing with precise fiducial mark alignment. It features automated motorized squeegee printing, stencil and strip auto-cleaning, and fully automated strip loading/unloading. Designed for high efficiency and consistent quality, the system delivers robust printing performance and high throughput.

本系統支援多基板鋼網印刷，具備精準基準點對位、自動馬達刮刀印刷、鋼網與基板自動清潔及自動上下料功能，實現高效率、高品質與穩定產出。

The high-speed driver IC sorter is an advanced system designed to meet the growing demands of efficient and precise semiconductor component sorting. Equipped with six waffle-tray bins, it supports multi-bin sorting operations, making it ideal for high-throughput environments. The system offers an optional backside inspection function, enabling users to detect surface defects or packaging issues without manual intervention.

The sorter operates based on mapping data, identifying the position and classification of each IC. It then proceeds to sort and place the ICs into the designated trays or bins with high positional accuracy. This not only ensures product traceability but also enhances the overall quality and consistency of the sorting process. With user-friendly controls and robust automation capabilities, the system is well-suited for integration into advanced semiconductor backend processes, helping manufacturers improve productivity, reduce labor reliance, and ensure product quality.

本高速驅動IC分類機專為半導體封測產線的高效與精密分類需求所設計。系統配備六個waffle tray分類料盒，能支援多通道分類作業，特別適用於大量處理需求的製造環境。其可選配的晶片背面檢查功能，能協助自動化檢測表面缺陷與封裝異常，大幅減少人工作業錯誤與成本。

分類機依據預先建立的mapping資料進行定位與判別，準確將每一顆IC依其分類結果對應至指定的料盒或托盤中，並進行位置校準，確保高度一致性與可追溯性。透過人性化介面設計與強大的自動化整合能力，該系統可順利導入至先進封裝測試流程中，有效提升整體產能表現、降低人力依賴，同時強化產品品質穩定性。

A fully automatic contact angle measuring system designed for high-precision surface analysis. It features automatic loading/unloading, droplet control, dispensing, and real-time contact angle measurement. The droplet dispensing position is fully programmable for various sample types and sizes. This system ensures consistent, repeatable measurements in a high-throughput environment. For flexible needs, HPC also offers semi-automatic and manual models.

本系統為一款全自動接觸角量測設備，專為高精度表面張力與潤濕性分析設計。具備自動上下料、自動液滴控制、滴液與即時接觸角量測功能，適用於多樣化樣品。滴液位置可依需求進行程式化設定，確保在高速測試流程中維持高度一致與重現性。針對不同產線需求，HPC亦提供半自動與手動版本，滿足研發與量產等不同應用情境。

The system scans skeleton wafer or die images and compares them with the original map file. It analyzes post-die-bond conditions to verify whether any good dies are missing or fail dies remain on the substrate. This helps identify errors such as misplacement or die loss after the die-bonding process. The solution enhances accuracy in die traceability and is essential for post-bond inspection and quality verification.

本系統可掃描晶圓或裸晶（Skeleton Wafer/Die）影像，並與原始對位圖（Map File）進行比對與分析。可於Die Bond後檢查是否有良品遺失或不良品殘留於基板上，藉此判別貼片過程中是否發生錯誤（如位置偏移、裸晶遺失等）。本解決方案有助於提升裸晶追溯準確性，是貼片後檢查與品質驗證的重要工具。

The Lid Attaching Machine is a high-precision system developed for advanced semiconductor packaging, particularly for FCBGA and CoWoS applications. It is designed to accurately and securely attach lids or heatsinks to the packaged units, ensuring optimal mechanical protection, effective heat dissipation, and enhanced long-term product reliability. The system is suitable for integration into high-volume production lines and meets the demanding standards of advanced packaging processes.

本導蓋貼附機專為先進半導體封裝製程開發，特別適用於FCBGA與CoWoS等高階封裝應用。設備可精準貼附導蓋或散熱片，確保封裝產品具備優異的結構保護、熱傳導效率與長期穩定性。其高精度、高一致性的設計可滿足大量生產需求，並符合先進封裝產線的嚴格規範。

This system is designed to measure wafer thickness and surface roughness in semiconductor manufacturing, especially after grinding or thinning processes. Utilizing dual-laser interferometry, it delivers high-precision, non-contact measurements of wafer thickness, while simultaneously evaluating surface roughness. The system supports multiple wafer sizes, including 6", 8", and 12", making it suitable for diverse production lines. With integrated data logging and process tracking capabilities, it provides manufacturers with essential insights for quality assurance, process optimization, and yield improvement.

本系統專為半導體製程中的晶圓厚度與表面粗糙度量測而設計，特別適用於研磨或減薄後的檢測需求。採用雙雷射干涉技術，能夠進行高精度、非接觸式的厚度量測，同時檢查表面粗糙度，確保產品品質一致性。系統支援6吋、8吋及12吋晶圓，適用於多種產線需求。內建數據記錄與製程追蹤功能，有助於製造端進行製程優化、良率提升與品質控管。