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Advanced Packaging Interlink Holding Pte Ltd

Singapore,  Singapore 
Singapore
http://www.sgapi.com
  • Booth: L1216

We cordially invite you to visit API's booth L1216！

Overview

       API is a global manufacturer of high-technology equipment, specializing in precision pick-and-place systems and advanced packaging solutions for semiconductor backend processes and micro-component assembly. Our service network spans Singapore, the United States, Japan, China, and other countries, providing comprehensive technical support and consultancy worldwide.
       At API, our core team consists of top experts from renowned semiconductor giants such as YAMAHA, HITACHI, ASMPT,BESI, K&S, TDK, Goertek, and Keyence. Additionally, we have elite engineers from leading R&D institutions, including the National Energy Laboratory of the United States and the Hong Kong University of Science and Technology  Innovation Center.
      Since our establishment, API has consistently invested in core technologies such as motion control, precision
machinery, thermal flow simulation, optical imaging, micro-nano manufacturing, and industrial software. We
conduct cutting-edge research and have developed a series of proprietary core technologies, including ultra-thin-die stacking bonders, smart inline solutions for CIS-COB processes, and advanced bonders for multi-chip packaging. This  commitment has earned us recognition as a trustworthy and reliable partner for semiconductor OSATs and IDMs.
      With a mission to drive the upgrade of the global precision intelligent manufacturing industry, API aims to become  the global leader in precision pick-and-place technology. We remain customer-focused and strive to deliver innovative micro-nano high-tech equipment for advanced semiconductor packaging.

  Products

  • Wafer-Level Thermo-Compression Bonder
    With high precision,high speed and high flexibility,Wafer-Level Thermo-Compression Bonder has a wide range of applications, particularly suitable for ultra - fine pitch memory and logic integrated circuits (such as HBM/xPU)....

    •    This wafer - level thermo - compression bonder has a wide range of applications, particularly suitable for ultra - fine pitch memory and logic integrated circuits (such as HBM/xPU). It can handle die sizes up to 26 x 33 mm, with a die thickness of ≥ 25 μm. The bonding force ranges from 0.3 to 50 N and supports die stacking operations.
        The equipment covers various processes including flip - chip (FC), flux/fluxless thermo - compression (TC), and formic acid reflow. In terms of throughput, a single thermo - compression bonder (TCB) can process at least 1500 units per hour, and two TCBs can process at least 3000 units per hour.
       For material handling, it is compatible with 12 - inch wafers and 300 x 300 mm panels. It is equipped with a multi - zone ejector system and supports a manufacturing execution system (MES) compliant with the SECS/GEM standard, offering full traceability. The calibration operation can be completed automatically with one click, and it can automatically change different types of nozzles such as FH/PH/TH/BH. The device also comes with a pre - bond inspection (PBI) and automated optical inspection (AOI) system. The footprint (length x width x height) of a single thermo - compression bonder is 3100 x 4150 x 2400 mm.

Categories

200 Equipment, Assembly
  • Die Bonding; Attach Equipment
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