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JAINNHER MACHINE CO., LTD.

Xitun Dist.,,  Taichung City 
Taiwan
https://www.jainnher.com/
  • Booth: P5412

Overview

JAINNHER MACHINE, founded in 1982 in Taiwan, has been bringing its own brand “JAINNHER” to customers around the world. For over 43 years, we've been dedicated to grinding machine technology, developing more than 22 machine series. With customers in over 40 countries across Asia, the Americas and Europe, JAINNHER is known as a reliable manufacturer of precision grinding machines.

JAINNHER’s machine series includes: internal grinding machines for advanced wafer material processing ; center hole grinding machines ideal for enhancing OD grinding accuracy; double spindle grinding machines capable of grinding ID, OD and end face in a single setup ; vertical grinding machines for large size workpieces; and thread grinding machines designed for high-precision screw thread applications.

JAINNHER delivers high precision grinding solutions with complete technical support, committed to being our customers' most reliable partner.

  Products

  • JHV-1006CNC
    Vertical Grinding Machine...

    • Due to the large size and material characteristics of carriers and consumables in semiconductor manufacturing, a machine capable of grinding large ID, OD, face and end-face is essential. Jainnher’s JHV-1006/1008CNC vertical grinding machines are designed to meet these complex grinding requirements. The ID range is Ø50–800mm, and the maximum OD grinding capacity is up to Ø1000mm. The grinding wheel head spindle can rotate ±30 degrees to accommodate taper grinding. Equipped with ATC and a 6-position tool magazine, making it easy to perform both ID and OD grinding for different workpieces.
  • JHD-3205IO
    Double Spindle Grinding Machine...

    • Due to the characteristics of materials used in semiconductor process carriers and consumables, grinding these hard and brittle materials requires both precision and efficiency. Jainnher offers the JHD-3205 double spindle grinding machine series to fulfill this demand. The JHD-3205 double spindle grinding machine is capable of performing OD, ID, end-face, thread, and various angular grinding for materials with multiple characteristics, thereby reducing time lost in process transitions.
  • JHC-2416T
    Centerless Grinding Machine...

    • Designed to meet the processing demands of wafer materials, Jainnher’s centerless grinding machine performs ultra-efficient performance for grinding the outer diameter of wafers. What used to take several hours can now be completed in just minutes—helping our customers achieve the required dimensions and surface finish for wafer production faster and more efficiently.

    The JHC-24T series can process diameters up to 12-inch wafer sizes.
  • JHU Series & JHP Series
    Cylindrical Grinding Machine...

    • After the wafers have been cut into slices, Jainnher’s JHU and JHP cylindrical grinding machine series provide precise grinding solutions for both the appearance and outer diameter of wafer materials. These machine series support a wide range of materials including silicon carbide, silicon wafers, ceramics, and other related materials.

    Designed to process wafer diameters up to 12 inches, the JHU and JHP series offer grinding capabilities for outer diameters up to Ø400 mm and lengths up to 1500 mm. With excellent versatility, they are well-suited for various types of wafer materials and help ensure consistent quality and processing efficiency

Categories

200 Equipment, Assembly
  • Backgrind; Slicing; Lapping; Polishing Equipment
  • Device Handling; Feeding Systems
    • 701 Manufacturing Services or Consulting
  • Equipment; Hardware; Product Design, Integration and Manufacturing
  • Manufacturing Process Support and Development
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