SBT Ultrasonic Technology Co., Ltd.

Uitrasonic Die Bonder

Applications：Pre-sintering (or pre-bonding) of silver sinter, DTS, Clip

Characteristics:

1、Pre-sintering (or pre-bonding) of silver sinter.
2、Supports precise pick-and-place and pre-sintering attachment for SiC (Silicon Carbide) wafers.
3、Achieves a UPH (Units Per Hour) increase of over 50% com pared to standard pre-attachment processes.
4、Self-supplied core ultrasonic components, including the transducer.

Automatic Wedge Bonder

Applications:GBT or SiC power module, photovoltaic, energystorage inverters,lasers,automotive electronics, etc.

Characteristics:

1、Y-axis: Gantry dual-drive system forsuperior synchronization；

2、ALC system provides process quality check during production；

3、Magnetic spring compensation enables smoother Z-axis motion and enhances component durability；

4、The cylindrical linear motor achieves ZR decoupling, reducing the Z-axis load and minimizing pre-weld impact；

5、The pressure online calibration technology enables rapid adjustment and continuous monitoring；

6、New Graphical Bond head Set-up aid option (GBS) reduces consumable replacement time and ensures a repeatable set-up；

7、An independent motor powers the PR system, compatible with various heights, enhancing adaptability；

8、Integrated material handling system is linked to production line。

Dual-head Aluminum wire Bonder

Applications：For aluminum wires or ribbons bonding of lGBT Module,automotive electronics, high power photoelectric sensorpower battery.

Characteristics：

1、0.5 um resolution linear motor
2、GBS helps shorten the replacement time of cutting tools and other consumables, ensuring consistency
3、ALC function
4、Aluminum strip bond head is optional
5、Online non-destructive testing Pull Tester is optional

Fully Automatic Wafer Level SAT/G-SAM

Applications：Designed for the inspection ofwafers or bonded wafersto detect cavities,inclusions, or delamination in bonded layers.

Characteristics：

1、Loadport can interface with standard Cassette and other methods；

2、The wafer-specific Robot implements sampling, barcode reading, and sample placement；

3、Four-probe collaborative wafer rapid scanning detection；

4、Aligner wafer calibration and edge detection；

5、Blow-dry the wafer and put it back into the original sample slot；

6、Automatic merging of scanning results, image processing, defect display, and data recording；

7、Equipped with fab standard communication software, it can coordinate with other production equipment。

Scanning Acoustic Microscope (semi-automatic)

Characteristics：

1、Customizable Jig: The jig can be tailored to specific requirements；

2、Quick Changeover: A quick disassembly method allows for rapidsample replacement；

3、Automated Feeding: Both sides of the jig can be loaded into the watertank manuallyor automatically；

4、Hands-Free Dipping: The automatic lifterimmerses objects in water,eliminating the need for manual submersion and keeping hands dry；

5、Bubble-Free Scanning: Thejig employs a tilted water inlet design toprevent water bubbles from interfering with the scanning process；

6、High-speed inspection system featuring synchronous scanning withtwo transducers, displaying real-time scan images；

7、The transmission module can be replaced to achieve synchronousimaging of C-scan and T-Scan。