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Kulicke & Soffa Pte Ltd

Suzhou,  China
http://www.kns.com
  • Booth: L0616

Welcome to visit K&S

Overview

Kulicke and Soffa is a global leader in semiconductor assembly technology, advancing device performance across automotive, compute, industrial, memory and communications markets. Founded on innovation in 1951, K&S is uniquely positioned to overcome increasingly dynamic process challenges – creating and delivering long-term value by aligning technology with opportunity.

  Products

  • ATP MEM PLUS
    Advanced Technology Wafer Level Bonder
    The ATPremierPS PLUS™ is another extension of the successful Power Series platform. The superior wafer level stud bumping and wire bonding of the ATPremier PLUS delivers high productivity with increased efficiency....

    • Key Features
    • Able to Bond up to 300 mm Diameter Wafers, Ceramics or Substrates
    • Bond Placement Accuracy
      - ±3.5µm @3 sigma (200mm Work Piece)
      - ±5.0µm @3 sigma (300mm Work Piece)
    • Power Series Advanced Hardware and Software Controls
    • Best-in-Class Low Temperature Gold Bumping
    • Improved Serviceability with Easy Access to Lower Console
    • Programmable Power Supply System with Back-Up
    • Upgradeable Capabilities
      - Optional Copper or Silver Alloy Capability and Kits
      - Optional Basic Wire Bonding Capability
    • Smallest Footprint in the Market
  • SL Dispensing Equipment
    SL series is specifically designed for semiconductor micro fluid packaging applications for narrow gap filling, fine line dispensing and micro underfill with small machine footprint....

    • Key Features:
    • Versatile Dispensing Applicators 
    • High Precision Applications
    • Advanced Dispensing Vision Software with Motion Control
    • Post Dispensing Automatic Optical Inspection

Categories

200 Equipment, Assembly
  • Die Bonding; Attach Equipment
  • Die Sorter; Pick & Place; Flip Chip Placement Systems
  • Dispensing Systems
  • Wafer Level Bonders
  • Wire Bonding Equipment
    • 300 Materials, Assembly
  • Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools
  • Scribe Tools; Saw or Dicing Blades and Accessories
    • 701 Manufacturing Services or Consulting
  • Assembly
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