JC's Chunson Limited

Vision 200/300-M
Manual Wafer Loading

• FULL FIELD ONE SHOT MEASUREMENT
• SEMI Compliant wafer metrology
• Measurement Bow, Warpage, TTV, LTV,…
• Measure down to nanometer level
• Top and Bottom surface Nano-topography
• Manual Wafer Loading (200,300mm)
 

WAFER Metrology - High Resolution Deflectometry

Vision solutions are intended to provide wafer manufacturers with advanced solutions to measure SEMI-compliant geometry parameters and critical surface Nano-topography with noncontact technology.

The equipment is designed for manual loading, metrology and inspection. It measures bow, warp, TTV, LTV and qualifies surface roughness, nano-topography down to nm level in one single-shot measurement.

Its full field of view, leading-edge throughput and small footprint bring the best TCO adapted to volume wafer fabs.

MPS RC ^Plus

High Precision Grinding Machine

Precision surface grinding machine especially for hard, brittle and difficult to process materials such as SiC, GaN, SiN, A2O3 etc.

• Process parameters individually programmable

• Graphical representation for monitoring the automatic process flow

• Automatic compensation of grinding wheel wear

• High precision automatic fine feed

• High plan accuracy

• In-process measurement (optional)

• Low maintenance requirements

RC^plus represents the logical evolution of G&N’s proven MPS RC platform, setting new standards in precision, quality, and efficiency when machining hard-to-process materials, such as SiC, Si, Si₃N₄, Al₂O₃, and GaN. With a high technical standard and innovative design, RC^plus is ideal for labs, small to mid-scale production, or as a backup system for large manufacturing facilities — perfectly aligned with the needs of the modern semiconductor industry.  

Features

• PLC SIEMENS SIMATIC S7-1200

• 12“ HMI Touch panel

• Recipe management (up to 100 recipes)

• Vacuum base plate

• Automatic fine infeed

• Rotary table

• Coolant supply

• Spray hood

• Hand shower

E+H Metrology MX608

Contactless Wafer Gauge for Resistivity, Thickness, and P/N


MX608 is designed to characterize silicon wafers. It combines contactless thickness, resistivity and P/N dotation sensors. Automatic move-in and turn of the wafer allows up to 18 scans of each wafer. To be connected to a PC via serial interface comes with our powerful MX-NT operating software. Integration into automatic robotic sorter systems is possible.

Features

• Simultaneously measures thickness, resistivity, and TTV of 150mm and 200mm silicon wafers

• Utilizes advanced thickness sensors, resistivity sensors, and P/N dopant detection to protect wafer surfaces

• Wafer is automatically loaded and scanned along its centerline, with lateral resolution up to 1 mm

• Automatic wafer rotation for up to 18 scans ensures complete coverage and accurate measurement results

• Works with MX-NT operating software for efficient data analysis and control

• Connects to PC via serial interface and supports integration into automated robotic sorter systems

• Small footprint and easy operation for use in laboratories, R&D, and production lines

Hologenix Magic Mirror™ Defect Detection System

Defect Detection on Ultra-Flat Wafers (Magic Mirror™) Full Wafer Submicron Defect Detection Systems. The concept is a powerful topographic tool for the characterization of the morphology of glass and mirror-like surfaces, such as semiconductor wafers. The sensitivity of the method is a 0.4 μm height difference over a 10 mm distance and 50 nm over a 0.5 mm distance. Makyoh topography has proven its power, for example in detecting flaws induced by wafer slicing, polishing, lapping, and defects in directly bonded Si wafers.

New Capabilities

。High Resolution Camera and Optical Components – 5 MegaPixel Camera

。IR (Infrared) Camera and Optics

。Long Focal Length Version – Greater Detection Capability for Shallow Defects

。Computer Controlled Optical Settings

。Latest Automation Capabilities – Edge handling, Wafer Sorting

Optical Technique

。Halogen Lamp with Band-Pass Filter

。Series of Lenses Create Broad Beam Collimated Light Column

。Parallel Rays of Light Reflect Perpendicular to the Polished Surface – Min. 3% reflectivity required

。Reflected Rays Projected onto De-focused CCD Detector.

Software and Computer Control of Optics

Optics are controlled via a Software Interface:

。Brightness

。Sensitivity

Settings can be stored in a recipe and easily recalled

No operator involvement needed.

EIGEMBox – Plug & Play SECS/GEM Solutions for Old & Legacy Equipment

EIGEMBox is the ultimate Plug & Play SECS/GEM solution for semiconductor fabs with old or legacy tools. In just minutes—without modifying your tool’s hardware or software—you can connect directly to fab automation systems.

Core Advantages

。Rapid Deployment: Simply connect the video output and keyboard/mouse ports, and your tool is live.

。Full Standards Support: SECS/GEM, GEM300, and E84/E87 ready.

。Cost-Effective: No changes to your existing setup. Avoid costly retrofits or new equipment purchases. 

EIGEMBox – Your Bridge to Smart Manufacturing