Loading...

北京华林嘉业科技有限公司

http://www.cgbtek.com
  • Booth: R7522

Welcome to CGB booth( Wet Cleaning Equipment Supplier）

Overview

Beijing CGB Technology Co., Ltd., was established in 2008, mainly specializes in R&D, production, sales and service of professional equipment used in semiconductors, pan-semiconductors and new materials. The company’s headquarter is located in Yizhuang Economic and Technological Development Zone, Beijing. The production base is in Langfang, Hebei Province, and the eastern service center is in Wuxi. It also set a R&D center in Japan, focusing on product R&D and overseas market service.

The application areas of the product include: integrated circuit manufacturing(IC),micro-electro-mechanical systems (MEMS), Silicon (Si)material, compound semiconductors, Optical Communication Devices, Power Devices, LED, Advanced Packaging,Photovoltaic, flat panel displays, scientific research equipment, etc.

As a domestic manufacturer with long-term experience in semiconductor wet process equipment, automatic wafer chamfering machines, brushing machines, dryers, chemical supply systems, CGB has always conducted all-round and full-process quality control in strict accordance with international quality management system standards, while focusing on continuous improvement and innovation.

In the future, we will continue to improve our independent innovation capabilities and core competitiveness, and provide customers with more perfect technical services and professional customized solutions.

北京華林嘉業科技有限公司（CGB)成立於2008年，主要從事半導體、泛半導體、新材料等領域專業設備的研發、生產、銷售及服務。公司總部位於北京亦莊經濟技術開發區，擁有河北廊坊北方生產基地和無錫華東區域服務中心。同時在日本設有研發中心，專注於產品研發和海外市場服務。

產品應用領域包含：積體電路（IC）、微機電系統（MEMS)、矽材料（Si)、化合物半導體（Compound Semiconductor）、光通信器件（Optical Communication Devices）、功率器件(Power Devices)、半導體照明（LED)、先進封裝（Advanced Packaging）、光伏電池（Photovoltaic)、平板顯示（FPD)和科研（R&D)等。

作為國內深耕半導體濕法制程設備、全自動晶圓倒角機、全自動刷片機、乾燥機、化學品供給系統等設備製造商，CGB始終嚴格按照國際品質管制體系標準進行全方位和全過程的品質控制，同時注重持續改進及創新。

未來，我們將不斷提升自主創新能力和核心競爭力，為客戶提供更加優化完善的技術服務和專業定制化解決方案。

  Press Releases

  • (Jul 31, 2025)

  Products

  • 槽式濕法制程設備 Wet Bench
    The fully-auto wet cleaning equipment owns multiple independent intellectual property rights and can be applied to RCA cleaning process, wet etching process, metal layer wet etching process, furnace tube pre-cleaning process, etc....

    • Advantages & Features

    優點&特點 

    • Equipped with real-time monitoring of drug concentration and efficient recovery system, improving the utilization rate of drug solution.
    • It can be equipped with ultrasonic, mega wave and tank flow field control technology to optimize cleaning capability.
    • Flexible design, automatic scheduling of the system, Ulti-station concurrent processing , achieving efficient operation.
    • Software and hardware interlock safety device, automatic temperature calibration and over temperature protection to ensure the safety of personnel and machine .
    • It can be paired with functions such as one click acid change and Auto Pm to improve machine maintenance efficiency.
    • Multiple sets of robotic arm systems are transmitted to support the demand for "dry in, dry out" and improve cleanliness requirements.
    • 搭載藥液濃度即時監控及高效回收系統,提高藥液使用率。
    • 可搭載超聲波、兆生波及槽體流場控制技術,最佳化清洗能力。
    • 柔性化設計,系統自動排程,多工位併發處理,實現高效率運行。
    • 軟硬體互鎖安全裝置,溫度自動校準及過溫保護,確保人員及機台安全。
    • 可搭配一鍵換酸、Auto Pm等功能,提升機台維護效率。多組機械手系統傳遞,支援“干進幹出”需求,提高潔淨度要求
  • Single Wafer Cleaner 單片濕法制程設備
    It adopts a multi-layer cavity structure, with a rotating brush head, two fluids, Mega sound and chemical liquids and is mainly used for the cleaning of post-CMP, pre-diffusion , post-etching , standard RCA, PR removal, pre-and post-coating, etc....

    • Advantages & Features

    優點&特點

    • Compatible with a wide range of wafer specs
    • Self-cleaning brush head
    • Achievable 4 cavity layers and the recovery of 3 kinds of chemical solutions
    • Independent flipping module, automatic flipping and cleaning of both sides of the wafer
    • On-line liquid dispensing function
    • Flexible chambers( 2/4/6/8 ) configuring
    • Excellent cleaning results
    • A variety of safety tests(avoiding Debris producing)
    • 可相容多種規格晶圓
    • 具備刷頭自清潔功能
    • 腔體分層可做到4層，可實現3種藥液的回收
    • 獨立翻轉模組，可實現晶圓正反面自動翻轉並清洗
    • 線上式藥液配比功能
    • 腔室数量2/4/6/8可灵活配置
    • 优秀的清洗效果
    • 多种安全检测，不易产生碎片
  • Marangoni Dryer 馬蘭戈尼乾燥機
    The Marangoni dryer is suitable for drying wafers made of materials such as Silicon (Si), Silicon Carbide (SiC), Gallium Nitride (GaN), and Indium Phosphide (InP)....

    •  It supports wafer sizes of 4/6/8/12 inches with optional thicknesses ranging from 350μm to 1400μm, catering to diverse application scenarios. Based on the Marangoni effect, the system utilizes nitrogen to carry IPA, creating a surface tension gradient for efficient drying. It supports three drying modes: wafer lifting, slow drainage, and oscillation. The equipment is equipped with top and bottom transfer mechanisms, enabling a cassetteless process to prevent inadequate drying at the contact points between the wafer and the cassette, thereby improving drying uniformity. Safety Certification is SEMI S2, the main body material is single mirror panel SUS304, tank material is PVDF、Quartz, the chemical circulation is with pneumatic pneumatic bellows pump, electromagnetic type drainage, integrated PFA liquid filter, integrated SUS gas filter,N2 heater with independent temperature controller, liquid level detection with N2 micro-pressure level, temperature sensor of platinum RTD.

    馬蘭戈尼乾燥機支援4/6/8/12英寸晶圓，厚度可選（350μm-1400μm），適應多樣化應用場景。基於馬蘭戈尼效應，通過氮氣攜帶IPA形成表面張力梯度，實現高效乾燥，支持晶圓提拉、緩慢排水、擺動三種乾燥方式。設備配備上下搬送機構，實現cassetteless工藝，防止片盒與晶圓接觸部位乾燥不良，提升乾燥均勻性。SEMI S2安全认证，單鏡面板材主體材質，PVDF、Quartz槽體材質，氣動風囊式藥液迴圈，一體式液體篩檢程式，一體氣體篩檢程式式，配備獨立溫控器的N2加熱器，N2微壓液位檢測，鉑電阻式溫度感測器。

  • Auto Wafer Chamfering Machine 全自動晶圓倒角機
    It is mainly used for the outer chamfering of SiC compound semiconductor and Si wafers, and it uses a precision grinding wheel to grind and shape wafers, the size of which are 4″6″8″12″....

    • Product Standard

    • Auto：Cassette to Cassette，can fit 4 cassettes.
    • Object：SiC compound semiconductor wafer ,Si wafer,etc.

                                It can machine the circumference, position edge and notch.

    • Wafer size：4″/6″,6″/8″,12″.
    • Wafer thickness：0.25mm～2.0mm.
    • Axis：2（independent control）.
    • Grinding Wheel Type：T、R、T&T、T&R.
    • Grinding Wheel Size：thickness 20mm, ODφ202mm，inner diameter φ30mm、（Grinding wheel for Notch processing：ODφ3mm）.
    • Grinding Wheel Rew：periphery 1,000m～5,000m/min（frequency converting control）.
    • Cutting speed：circumference 1mm～50mm/sec Guide edge 1mm～20mm/sec.

    Product Usage

    It is mainly used for the outer chamfering of SiC compound semiconductor and Si wafers, and it uses a precision grinding wheel to grind and shape wafers, the size of which are 4″6″8″12″.

    Capacity（Reference）

    It has 2 processing axis, which can be controlled independently, and 1 axis can also be processed separately. Compared with single-axis equipment, two-axis equipment can increase processing efficiency by 70%.

    Obtainment of Technology 技术来源

    Advanced technology has been imported from Japan.

    產品規格

    • 自動款：Cassette to Cassette，可放入4個cassette。
    • 加工對象：SiC等化合物半導體晶圓片、Si晶圓片等，可加工圓周、定位邊及notch。
    • 晶圓片尺寸 ：4″/6″,6″/8″,12″。
    • 晶圓片尺寸 ：4″/6″,6″/8″,12″。
    • 晶圓片厚度：0.25mm～2.0mm。
    • 加工軸數：2個（獨立控制）。
    • 砂輪種類：T型、R型、T&T型、T&R型。
    • 砂輪尺寸：厚20mm，外徑φ202mm，內徑φ30mm、（加工Notch用的砂輪：外徑 3mm）。
    • 砂輪轉速：外周 1,000m～5,000m/min（變頻控制）。
    • 砂輪轉速：外周 1,000m～5,000m/min（變頻控制）。

    產品用途

    主要用於SiC等化合物半導體晶圓片、Si晶圓片等的外圓倒角，利用精密砂輪對晶圓片進行研磨整形加工。用於4″6″8″12″晶圓片。

    產能（僅供參考）

    具備2個加工軸，可獨立控制，也可單軸單獨加工。與單軸設備相比，雙軸設備可將加工效率提高70%。

    技術來源

    引進日本先進技術

產品種類

200 Equipment, Assembly
  • Cleaning; Washing Equipment for Assembly & Packaging
    • 207 Equipment, Process
  • Cleaning; Washing; Drying Equipment for Substrate, Fab Processing
    • Loading ...

    :
    :


    Legend
    Available Timeslot
    Scheduled Appointment
    Personal Appointments
    Appointment Request
    Blocked Timeslot
    Restricted Timeslot
    Cancelled
    Declined