德律科技股份有限公司

http://www.tri.com.tw

Booth: K3070

Your Test and Inspection Partner. Visit us at booth #K3070.

Overview

Test Research, Inc. (TRI) offers a One Stop Test and Inspection Solution. TRI provides high-precision and high-resolution inspection solutions for the electronics manufacturing industry, including 3D Solder Paste Inspection (3D SPI), 3D Automated Optical Inspection (3D AOI), 3D Automated X-ray Inspection (3D AXI, upgradable to Computed Tomography), Manufacturing Defect Analyzers (MDAs), and In-Circuit Test equipment (ICT).

TRI's Inspection and Metrology Applications include: Chiplet & Chip-on-Wafer (CoW), System-in-Package (SiP), Advanced WLP, TSV Metrology, μBump, Cu Pillar, Surface Topology, Profiling, Thin Film Thickness, Patterned Wafer, Inner Crack / Chipping, After Sawing Defects, Die Underfill, Glue, Epoxy & Flux, Wafer Bumping and Die / Wire Bonding.


Patterned Wafer	TSV Metrology	Wafer Frame	Wafer Bumping	Wire/Die

SWIR+AI	Chiplet Metrology	Wafer AVI	Cu Pillar	TGV X-ray Inspection

TRI will showcase the Wafer Inspection and metrology Platform, TR7950Q SII, capable of wafer macroscopic 3D inspection and micro measurement metrology. The TR7950Q SII has applications in Advanced WLP, Wafer Frame, Patterned Wafer, Wafer Bumping, WLCSP, Through Silicon Via (TSV), thin film, and more.

For more information about TRI's Inspection capabilities for the Semiconductor and Advanced Packaging Industry, please visit the link below,

https://www.tri.com.tw/en/about/about-68-2-2.html

Visit booth #3070 to discuss TRI's Semiconductor and Advanced Packaging Industry Inspection Solutions with our staff.

Press Releases

(Sep 01, 2025)

Products

Wafer Inspection and Metrology - TR7950Q SII

The TR7950Q SII is TRI's Wafer Inspection and Metrology Platform, capable of wafer AVI and micro measurement metrology. The TR7950Q SII has applications in Advanced WLP, Patterned Wafer, Wafer Bumping, WLCSP, TSV, thin film thickness, and more.... More Info Less Info