COHO Advanced Materials Tech. Co., Ltd.

ZTA (Zirconia Toughened Alumina)

Is a versatile composite ceramic composed of alumina ceramic reinforced with zirconia particles. This unique combination enhances the inherent qualities of pure alumina, resulting in significant improvements. The fusion of these materials imparts higher fracture toughness, flexural strength, and dielectric strength to the substrate, providing exceptional durability under mechanical stress. Notably, the thermal conductivity of ZTA exceeds 27 W/mK, and its flexural strength reaches 700 MPa. Its excellent thermal conductivity, high-temperature resistance, and insulating properties make it an ideal choice for applications in passive components and chip resistors.

AlN Thermal pad is a thermally conductive compound with AlN (Aluminum Nitride) as the primary filler material. Due to the high thermal conductivity and electrical insulation properties of aluminum nitride, AlN thermal silicone becomes an ideal thermal management material in applications requiring efficient heat dissipation and electrical insulation. This silicone is typically used in heat dissipation for electronic components, chip packaging, and power modules, providing an effective solution for improving device performance and extending its lifespan.

AlO (Al₂O₃) substrates are widely used in the electronics and industrial sectors due to their excellent mechanical strength, thermal stability, and insulation properties. Alumina substrates are often employed in electronic component packaging, heat dissipation, and insulation solutions in high-temperature and harsh environments. Additionally, the material’s relatively low cost offers great cost-effectiveness.

AlSiC Heat sinks

MMC (Metal Matrix Composite) products, such as AlSiC (Aluminum Silicon Carbide), are widely used in high-speed rail, subways, aerospace, new energy vehicles, wind power generation, and consumer electronics. Existing IGBT packages typically use copper or aluminum as the backplate, whereas IGBT packages with AlSiC backplates offer significant advantages over commonly used backplate materials. These advantages greatly enhance the reliability of power devices and ensure better thermal expansion matching, as the thermal expansion coefficient closely matches that of semiconductor wafers and ceramic substrates.

AlN Thermal pad is a thermally conductive compound with AlN (Aluminum Nitride) as the primary filler material. Due to the high thermal conductivity and electrical insulation properties of aluminum nitride, AlN thermal silicone becomes an ideal thermal management material in applications requiring efficient heat dissipation and electrical insulation. This silicone is typically used in heat dissipation for electronic components, chip packaging, and power modules, providing an effective solution for improving device performance and extending its lifespan.