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Omron Corporation

  • Booth: Q5630

OMRON contributes to good quality product manufacturing.

Overview

As we enter the era of heterogeneous computing, various 3D-ICs are being put into practical use. OMRON offers various inspection equipment compatible with the mounting technology required for 2.5/3D mounting.

We would like to introduce our CT scan type 3DX ray automatic inspection equipment and optical automatic appearance inspection equipment.

 Additionally, OMRON will contribute to improving the quality of power semiconductors, which are increasing as the EV industry market expands.

 We support efficient "good quality product manufacturing " by automating inspections and inline inspections (dimensional inspections and CT scan type 3D X) in our customers' manufacturing processes.


  Press Releases

  • VT-X850 realizes both productivity and qualities of increasingly integrated and complex xEV.

    The high power of the X-ray source makes it possible to inspect materials that are difficult for X-rays to penetrate or large, thick objects.

  • With the practical application of heterogeneous computing, chiplet technology is evolving year by year. OMRON's AXI VT-X950 series is used for quality control of the solder mounting process of C4Bump and μBump, which are indispensable for 3D mounting (3D-IC), and for yield improvement by feeding back measurement data.*Heterogeneous computing: Computation on a computer system built with a combination of different types of processors.
  • The technological evolution of EV, 5G has resulted in an increasing number of electronic circuit boards becoming smaller and denser (double-sided) and BGA, LGA mounting, and the required level of inspection difficulties is rapidly increasing.

    In addition, the quality requirements of the market continue to grow, as process assurance and check of sampling by X-ray analyzers require exhaustive X-ray inspection.

    VT-X750 supports its long-term response to market demands through high-quality CT inline testing.