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Changzhou Mingseal Robot Technology Co., Ltd

Changzhou City,  Jiangsu Province 
China
https://www.mingseal.com/
  • Booth: P5719

Overview

Established in 2008, Changzhou Mingseal Robot Technology Co., Ltd. (hereinafter referred to as “Mingseal Technology”) is a technology-driven high-end equipment manufacturing enterprise which is committed to providing connection, assembly & testing equipment, key core components and other technology solutions for industry-leading customers in the field of semiconductor packaging & testing and precision electronic manufacturing so as to jointly promote the industry technique and technology progress. Our products are widely used by top-tier customers of advanced semiconductor packaging, consumer precision electronics and intelligent automotive electronics, etc., and our business and technology support network covers such countries as China, South Korea, Vietnam and Japan.

Mingseal Technology has got a number of qualifications and honors such as National High-Tech Enterprise, National Intellectual Property Demonstration Enterprise and National “Specialized, Fined, Peculiar and Innovative” Small Giant Enterprise. In the era of intelligence and digitalization, Mingseal Technology will continue increasing the investment in technological innovation R&D, adhere to cooperation and sharing values, and work with customers, suppliers, employees and other partners to achieve more high-end intelligent manufacturing.


  Products

  • SS101 Wafer-Level Dispensing Machine
    SS101 Wafer-Level Dispensing Machine
    For Wafer Form Underfill
    ...

  • The SS101 is a kind of high-stability and high-precision dispensing system with automatic wafer loading & unloading function which is developed based on Underfill process requirements of RDL First FoWLP, and is mainly used for advanced processes such as CoWoS and FoPoP. (The SS101 consists of one PC101EFEM handling system and two GS600SW wafer-level dispensing machines).

    Integrating automatic wafer loading & unloading and wafer-level dispensing functions, the system can realize such functions as automatic wafer handling, alignment, preheating, operation heating, dispensing, and heat dissipation. It is compatible with international semiconductor communication protocols, is equipped with an AMHS automatic loading & unloading robot interface to match the information management requirements and unmanned management trends.

  • GS600SU/SUA Underfill Dispensing Machine
    GS600SU/SUA Underfill Dispensing Machine
    For Die Form Underfill
    ...

  • The GS600SU/SUA is a kind of high-speed and high-precision automatic online dispensing equipment which is developed based on Underfill process requirements of FCBGA/FCCSP.

    The equipment strictly controls the product and adhesive temperature, and intelligently sorts the product operation sequence and glue replenishment time, reducing the generation of voids and ensuring the operation yield. Meanwhile, it is compatible with international semiconductor communication protocols, and matches the information management requirements and unmanned management trends.