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EPORT CO.,LTD

  • Booth: S8138

Eport, The Professional Manufacturer of Advanced Materials!

Overview

Since its establishment in 2010, Eport Co., Ltd. has been importing and selling thermally conductive ceramic powders such as spherical alumina and spherical silicon nitride, used as ceramic fillers in TIM (thermal interface materials). Furthermore, in 2018, Eport established its own R&D center and began developing high-purity spherical alumina using proprietary technology and supplying it to the semiconductor industry. This has enabled it to become a leading thermal conductive material company in South Korea.

Leveraging its expertise in ceramic synthesis, spheroidization, grading, surface treatment, and compounding, Eport Co., Ltd. collaborates with customers to review and evaluate the suitability of thermal conductive materials, thereby providing innovative heat dissipation solutions. Eport also continues to invest in the development of fillers optimized for cutting-edge semiconductor packaging materials (EMC) such as GDDR7/HBM.

To embrace the upcoming space age, AI (artificial intelligence), and autonomous driving era, Eport is committed to contributing to the advancement of human civilization through the development of sustainable new materials.


  Press Releases

  • (Aug 12, 2025)
  • (Aug 12, 2025)
  • 半導體材料專門企業Eport在系列A輪中成功吸引了128億韓元規模的投資。 Eport在首次機構投資中籌集了大規模資金,證明了其競爭力。 計劃利用此次投資資金,正式建立批量生產材料的工廠。

    3日,據風險投資(VC)業界透露,Eport從Kiwoom Investment、Commes Investment、We Ventures、KC投資夥伴、Stick Ventures、DT&Investment等企業引進了投資。 投資由Kiwoom Investment主導,投資金繳納也全部結束。

    2010年成立的Eport是製造和銷售半導體封裝材料(EMC•LMC)用陶瓷粉末的企業。 公司生產的材料被用作半導體產業用袋裝材料或用作各種樹脂的填充劑、密封劑等。 其特點是,在擁有高填充率的同時,流動性好,純度高。

    Eport的優點是擁有大量半導體材料相關的核心技術。 △去除鈾、釷等放射性異物的低α技術△超高純度微粒球狀氧化鋁製造技術△爲解決尖端存儲器半導體發熱問題做出貢獻的散熱材料技術等就是代表性的例子。 與此相關的專利也獲得了很多。

    此次投資是Eport引進的第一個機構。 累計投資額爲144億韓元。 計劃將投資資金投入到批量生產材料的工廠建設中。 另外,計劃將大部分投資資金用於購買工廠的量產設備。

    e-port相關人士表示:"我們的目標是,以投資系列A爲契機,成爲HBM等尖端存儲半導體材料的專門供應企業,進而成長爲世界最好的陶瓷粉末製造企業"

    投資公司注意到,Eport擁有的技術能力在國內是獨一無二的。 期待通過這一措施,將顧客公司擴大到國內外大企業。 特別是與全球競爭企業相比,材料競爭力非常明顯。

    投資Eport的一位VC高管表示:"Eport最近完成了國內大企業企業的註冊,正在準備批量生產。核心材料'Low-α球狀氧化鋁'目前被日本企業壟斷,Eport的產品與此相比,安全性和經濟性更加優秀。"

    Eport計劃成功實現依賴外產的半導體材料的國產化,並進軍全球市場。 據悉,特別是在日本,對Eport材料表現出興趣的大企業非常多。

    https://www.thebell.co.kr/free/content/ArticleView.asp?key=202507031027302120106143


  Products

  • Low Alpha Spherical Alumina低α球形氧化鋁
    [Characteristics]
    -Specific synthetic technology
    -Excellent spheroidization technology & manufacturing
    -Spherical alumina mixture for EMC
    -Low Alpha content:U,Th content

    [Application]
    Epoxy molding compound (EMC)
    Die attach paste/film...

  • [Features and Benefits]

    1.High Chemical Stability and Corrosion Resistance

    Ultra-high purity reduces the risk of leaching of impurity ions (such as Fe⁺ and Na⁺), ensuring stability in strong acid, alkali, or high-temperature environments, making it suitable for harsh environments such as semiconductor etching and chemical catalysis.

    2. Low Radioactivity Safety

    Strict control of radionuclides prevents radiation accumulation over long-term use (for example, alpha particle radiation from electronic devices can cause integrated circuit failure), meeting the needs of radiation-sensitive fields such as medicine and aerospace.

    3. Excellent Physical Properties

    High Sphericity: Flowability approaches that of spherical silica, resulting in high packing density, making it suitable for precision injection molding and electronic packaging.

    Low Impurity Interference: Minimizes the impact on the electrical properties of semiconductor devices (such as reduced leakage current and improved insulation).

    High Thermal Stability: α-Al₂O₃ has a high phase transition temperature (approximately 1200°C), making it suitable for high-temperature applications.

    [Application Field] :

    High-purity, low-radiation spherical alumina, with its extreme purity and safety, is irreplaceable in the following high-end fields:
    (1)Semiconductor Industry

    Semiconductor Equipment Components: Coating materials for components such as etching chambers and plasma nozzles to prevent metal impurities from contaminating wafers.

    Electronic Packaging Fillers: Highly thermally conductive insulating fillers (such as epoxy resin composites) for chip packaging or substrate filling, reducing thermal resistance while preventing circuit failure caused by ion migration.

    Photoresist Carriers: Ultra-high purity ensures no impurities interfere with resolution during the photolithography process.

    (2) Electronic packaging and ceramic materials
    Electronic substrates and MLCC:
    The low-temperature sintering characteristics can reduce the sintering temperature of ceramic substrates or capacitors (e.g., from 1600°C to 1200°C), reduce energy consumption and avoid high-temperature oxidation of metal electrodes (e.g., silver, copper).

    (3)Thermal conductive fillers:
    The high filling capacity of spherical particles and the activity of low α phase enable them to simultaneously improve thermal conductivity and processing fluidity in polymer-based composites (e.g., epoxy resin).

    (4)Bioceramics:
    Low-temperature sintering properties can reduce thermal stress during the preparation of bioceramics (such as dental implants and bone repair materials), thereby improving yield.

    (5)Specialty ceramic injection molding:
    The high fluidity of spherical particles facilitates the injection molding of complex-shaped ceramic components (such as electronic ceramic devices).

    (6)Aerospace and Nuclear Industry
    -Spacecraft Thermal Insulation Materials: Low-emission properties reduce cosmic ray background interference and are used as thermal shielding for detectors or satellites.

    -Nuclear Reactor Structural Components: High purity prevents radioactive activation (such as secondary radiation produced by neutron irradiation) and are used for core insulation or shielding.

    (7). Medical Equipment

    Radiotherapy Equipment Components: Low background radiation prevents additional radiation exposure to patients or operators.

    Implant-Grade Ceramic Materials: Ultra-high purity reduces biotoxicity (such as inflammatory reactions caused by Fe³⁺) and are used in dental implants or orthopedic restorations. 4. Scientific Research and High-End Instruments

    Synchronous Radiation Facility: Used as a coating material for vacuum chambers or optical components to prevent impurity scattering that affects X-ray performance.

    High-Precision Sensors: Used as a substrate for sensitive elements in pressure and temperature sensors to ensure signals are free of impurity interference.

    .

  • Spherical Boron Nitride (BN) 球形氮化硼
    Spherical Boron Nitride (BN)...

  • Characteristics
    High sphericity, High thermal conductivity
    Thermal interface materials
    Excellent compatibility with organic systems
    Stable Physico - chemical properties, low dielectric
    Low Mohs hardness (<2)
    Application
    Thermal interface materials
    Thermal conductivity Alumina - based CCL
    Thermal engineering plastic
    High frequency power devices
    Specifications
  • Spherical Alumina 球形氧化鋁
    High thermal conductivity
    Thermal interface material : gap filler / pad, thermal grease
    High degree of sphericity
    Thermal Engineering plastics : LED lamp cover, electronic product shell
    High load ability...

  • 【Characteristics】
    High thermal conductivity
    High degree of sphericity
    High load ability
    High abrasion

    【Application】
    Thermal interface material : gap filler / pad, thermal grease
    Thermal Engineering plastics : LED lamp cover, electronic product shell
    Al based CCL : power circuit board, LED circuit board 
    Alumina ceramic filter
    Thermal spray coating

    【Specifications】

  • Low Ionic Impurity Spherical Alumina低離子雜質球形氧化鋁
    Low impurity
    (Na⁺< 5ppm, Cl⁻< 2ppm)
    Epoxy molding compound (EMC)
    Low EC : <10μs /cm...

  • Application 
    Epoxy molding compound(EMC)
    Low EC : <10μs /cm
    Die attach paste/film
    Thermal interface material
    Lithium- ion battery cathode material