As advanced semiconductor processes, artificial intelligence (AI), and high-performance computing (HPC) continue to evolve, thermal management has become increasingly critical to equipment stability and process consistency. Temperature control is no longer simply about cooling—it requires higher precision, greater stability, and more efficient thermal management.
WEXTEN Precise Industries Co., Ltd. will participate in SEMICON Taiwan 2026, showcasing its latest thermal management technologies for semiconductor manufacturing equipment, wafer measurement systems, and high-heat-density AI applications.
Under the theme “HIGH-PRECISION THERMAL CONTROL SOLUTION,” WEXTEN will demonstrate its capabilities in precision temperature control and liquid cooling, helping equipment manufacturers minimize temperature fluctuations and improve overall process stability.
±0.1°C Precision Thermal Control Minimizes Temperature Drift
During continuous semiconductor equipment operation, process chambers, measurement modules, and other heat-generating components can be affected by accumulated heat and changes in ambient temperature. Even minor temperature fluctuations may influence measurement accuracy, process stability, and production consistency.
To meet the demanding thermal requirements of precision equipment, WEXTEN utilizes PID precision temperature control technology with temperature stability of up to ±0.1°C, helping minimize temperature drift and thermal deformation while enhancing process stability and consistency.
At SEMICON Taiwan 2026, WEXTEN will showcase its 200W Wafer Measurement Chiller, developed specifically for wafer measurement and other precision thermal control applications. The system demonstrates WEXTEN’s expertise in compact, high-precision cooling solutions for semiconductor equipment.
From Semiconductor Precision Cooling to AI Liquid Cooling
In addition to semiconductor manufacturing, the rapid expansion of AI computing is driving significantly higher heat densities in servers and data centers. As conventional air-cooling architectures face increasing thermal limitations, liquid cooling is becoming a key thermal management technology for next-generation high-performance computing infrastructure.
In response to this trend, WEXTEN continues to develop CDU (Coolant Distribution Unit) and liquid cooling technologies, extending its expertise in industrial cooling, fluid control, and precision temperature management to AI, HPC, and other high-heat-density applications.
At SEMICON Taiwan 2026, WEXTEN will also present a CDU online simulation, providing visitors with an intuitive view of liquid cooling system operation and its potential applications in advanced thermal management.
Taiwan-Based R&D and Manufacturing for Flexible Customization
Thermal management for semiconductor equipment involves much more than cooling capacity. System design must take multiple factors into consideration, including temperature accuracy, flow rate, pressure, heat load, ambient conditions, installation space, and communication requirements.
With R&D, engineering, manufacturing, and after-sales support based in Taiwan, WEXTEN can provide customized thermal management solutions according to specific equipment requirements. This local capability enables more efficient technical communication, flexible design modifications, and responsive on-site support.
As semiconductor technology and AI computing continue to drive new thermal challenges, WEXTEN will further advance its expertise in precision temperature control, energy-efficient cooling, and liquid cooling technologies, evolving from a cooling equipment manufacturer into a provider of integrated thermal management solutions.