KYZEN CORPORATION

MICRONOX MX2708 is formulated for the demanding cleaning challenges presented within leadless devices such as low standoff gaps and fine pitches of Cu Pillar flip chips, 2.5D/3D ICs, SiP and AiP. MX2708 completely removes organic acid residue of all kinds at low, safe operating concentrations all while having no effect on exposed metal and intermetallic alloys including Cu, Al, Sn, Pb, Ni, Ag, and Au finishes. MICRONOX MX2708 most effectively cleans organic acid flux residues at lower concentrations in spray-in-air cleaning systems.

• Effectively Cleans Under Highly Dense Die Without Reacting with Exposed Metals
• SAC, Aluminum and Copper Safe
• Low Surface Tension
• Superior Rinsing Ability

MICRONOX MX2060 is a cleaning agent designed for leave-in flux. It effectively removes stubborn flux residues left over from lead-free soldering processes at low usage concentrations. With a perfectly balanced formula that removes flux residue while removing metal oxides, it provides long-lasting metal protection against re-oxidation after cleaning. MX2060 is suitable for in-line spray cleaning systems to clean products after lead-free soldering processes, such as IC carrier boards, electronic assemblies, etc. The flexible process parameter window provides users with a low-cost, efficient cleaning solution.

• Effective on Tough NC Flux Residues
• Superior Cu De-Oxide and Long-Term Protection
• Low Operation Concentration
• Wide Process Window