Test Research, Inc. (TRI)

The TR7950Q SII Series is a highly modular Wafer Inspection and Micro Measurement Metrology platform that utilizes AI-driven algorithms to maximize production yields in advanced semiconductor manufacturing. This highly modular system features an optional SWIR (Short-Wave Infrared) module specifically designed to detect hidden inner cracks and subsurface defects that remain invisible to standard visible light sensors. Inspection & Metrology for: Advanced WLP, Wafer Frame, Patterned Wafer, Wafer Bumping, WLCSP, Wafer Thickness, Topology, Film Thin, through-silicon via (TSV).
 

Features:

• Sub-Micron Resolution Wafer Inspection
• Precise Micro Measurements with Metrology Capabilities
• Ultra-High-Speed TSV & Thin-Film Metrology
• Inner Defect Detection with SWIR (Short-Wave Infrared) Module*
• 0.5/1 μm Resolution Available through DFF (Depth From Focus) Module*
• Cleanroom: Class 10 - ISO 4 Clean Room
• TSV measurement capabilities: Sensing TSV depth, Trench depth
• Thin Film measurement capabilities: Oxide, Nitride, PR, PI film thickness

*Optional

Designed for the SEMI Back-end, Mini-LED, C4 Bumps ( ~ 100 μm Ø) and 008004 paste inspection applications, the TR7007Q SII-S is a 3.5 μm high-resolution 25 MP imaging technology platform. Experience improved accuracy and stability, allowing for precise solder measurements and minimizing false calls. The TR7007Q SII-S is equipped with a wide spectrum light system and coaxial lighting to increase the defect detection rate for multiple industry applications. The 3D SEMI SPI supports current Smart Factory Standards, including IPC-CFX and The Hermes Standard (IPC-HERMES-9852).

Applications: Bumps, Flux, Glue, Mini-LED Solder, Solder Paste, Surface

Features:

• 3.5 μm High-Resolution 3D SEMI Back-end, Mini-LED and 008004 solder inspection
• Advanced Wide Spectrum Light for Enhanced Contrast and Detection Rate
• Improved Accuracy and Stability for Precise Solder Measurements
• High Precision Inspection for Multiple Applications
• Industry 4.0 Ready Platform
• Ensures clean operation with HEPA Filter*

*Optional

The TR7900Q SII-P is built on a 1.2 μm high-resolution platform with 65 MP imaging technology for the Semiconductor & Advanced Packaging Industry. AI-powered algorithms and metrology capabilities enhance the Smart 3D AOI solution's effectiveness. The 3D SEMI AOI fully integrates with the loader/unloader module to ease the handling of strips and magazines. The Stop-and-Go 3D AOI can inspect die bonding, ball bonding, ribbon bond, wedge bond, SiP, underfill, SMD, bumps, and solder joints. The Smart Factory AOI solution can inspect up to 15 μm (0.6 mil) wire diameters.

Features:

• Advanced Package Defect Detection for Wire Bonding and Die Bonding
• 1.2 μm High-Resolution 3D AOI with Metrology-grade* measurements capabilities
• Built-in Loader and Unloader for Magazine handling
• Powered by AI Algorithms for Wire Detection*
• Inspection of Au, Al, Ag, and Cu Wires down to 15 μm dimensions
• Bond Inspection: ball bond, wedge bond, and ribbon bond
• Shortwave Infrared (SWIR) Lighting to detect inner cracks and chipping*.
• Clean Room Class 10 - ISO Class 4 (ISO 14644-1)

*Optional Modules