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SE Technologies Corp.

Hsin-Chu,  Taiwan
http://www.se-group.com
  • Booth: K2043

Welcome to Hall 1 , 1 F, K2043 SE TECHNOLOGIES CORP.

Overview

Advanced equipment, Timely Support

Originated from engineers, seeing test requirements from an engineer's perspective~~

SE strives to provide customers with more complete advanced equipment and professional services .

About SE 

Founded on Jan. 1st, 1993, SE originated from engineers and understands the needs of engineers.

From RF/Microwave, Semiconductors, High Precision Electronics, and Opto-Electronics torecent MEMS and Nano Technologies, SE introduces the world's leading solutions to the Greater China area engineers.Finding the best tools to help engineers become successful has been SE's mission and honor for 30 years. SE Technologies isthe world's leading solution provider in the fields of RF/Microwave, Semiconductors, Optoelectronics and Electronics. 

SE Provision

■  Wafer-level high-precision probe station and related peripheral devices

■  Micro-nano pitch probe, probe card, locator (probe holder)

■  PCB signal integrity test and high-frequency probe

■  ESD electrostatic discharge test equipment

■   Advanced channel simulator (simulator)

■  Ground and satellite wireless system RF link analogy

■  RF/microwave test fixture, PCB test fixture

HsinChu

   TEL：+886-3-579-9029               FAX：+886-3-579-9030

   Mail：[email protected]

  Press Releases

  • Semiconductor Test probe station

    Manual & Semi-automatic, 4/6/8/12 inch Precision DC/RF Probe Station

    Application
    ■ Wafer & chip level probing with precision positioning
    ■ Power and wide-bandgap device probing
    ■ Optoelectronic & optical communication chips / RF & millimeter-wave devices
    ■ Chip / Package / Module measurement
    Test Project
    ■ DC parameters, high-frequency parameters
    ■ High voltage & high current test, IV / CV measurement
    ■ Load pull, noise parameter testing
    ■ Failure analysis, reliability testing
    Features
    ■ Temperature Range: -65℃ ~ 600℃
    ■ Low leakage: fA level
    ■ Frequency Range: DC ~ Terahertz
    ■ Nano-resolution probe mount

    Professional probe station equipment supplier

    Contact SE TECHNOLOGIES CORP.     Mail：[email protected]

  • Four-Point Probe Resistivity Measurement System

    Measuring Items:

    ■ Sheet Resistance

    ■ Film Thickness

    ■ Resistivity

    ■ Temperature Coefficient of Resistance (TCR)

    ■ Van der Pauw Four-Point Measurement

    System Features

    ■ Manual, semi-automatic and automatic positioning measurement
    ■ Optional measurement range: 1μΩ ~ 10GΩ
    ■ Optional temperature range: Room temperature ~ 600℃
    ■ Display of 2D and 3D resistance distribution maps
    ■ Standard TCR test with Kelvin probes or probe cards
    ■ Optional with various types of four-point probe heads
    More Product Information
    Welcome to contact us by phone or email for further inquiries.
    Email: [email protected]

  • Rapidly measure transistor behavior of 2D materials  without device fabrication

    Purpose:
    No device fabrication required; enables rapid characterization of transistor properties for 2D materials.
    With Xallent’s 10 µm pitch four-point probe contacting the thin film, it measures I-V characteristics, Kelvin resistance, sheet resistance, and field-effect transistor (FET) characteristics.
    It completely bypasses the traditional sample preparation process.
    Reduce R&D costs while accelerating time-to-market of new advanced materials and devices
    Combining with the Xallent SAKYIWA NanoProbe,
    Four probes can perform rapid electrical testing at the micrometer and nanometer levels on thin, patterned, and unpatterned wafers

    Product Details ~ Welcome to inquire by phone or email.

    Product Details ~ Welcome to inquire by phone or email.

    SE Technologies,  See Your Needs！

     [email protected]

  • Signal Integrity/ Power Integrity

    Large, medium, and small test boards,Measurement on testing fixtures, connectors, and device packaging

    ■ High speed connectors, transmission lines
    ■ Various types of circuit boards
         -Flat, upright, motherboard, daughter board, mother and child board
         - 2D, 3D board, orthogonal board
    ■ Chip Packaging - Inverted Chip, BGA Packaging
    ■ Multi sided and three-dimensional detection, measuring 180 degree rotation from top to bottom
    Welcome to inquire by mail /phone
     [email protected]        +886-3-579-9029

  Products

  • Semiconductor Probe Station
    Superior Analytical Probe Stations For On-Wafer Probing, Increasing Process Performance While Reducing Cost.
    Millimeter Wave On-Wafer RF Probing...

    • Semiconductor Probe Station
    Chip/Packaging/Module Measurement/Millimeter Wave Detection
    Manual, semi-automatic, 4-inch, 6-inch, 8-inch, 12 inch
    Precision DC/RF probe station
    ■ Chip/Packaging/Module Measurement
    ■ HF & RF Microwave Probing
    ■ DC To THz Probe Head Selection
    ■ CV/IV Measurements & Failure Analysis
    ■ High Power Characterization
    ■ Temperature Range: -65℃~600℃
    ■ Nano Resolution Probe Holder
  • Resistivity Measurement System
    Block resistance/film thickness/resistivity/
    ■ Van Der Pauw 4-Point Measurements
    ■ Manual /Semi-Automatic Resistivity Testing
    ■ Thermal Coefficient of Resistance (TCR) Testing
    ■ Resistor Testing With 2-Point Kelvin Probes...

    • Four point probe resistivity measurement system

    ■ Manual, semi-automatic, automatic positioning and measurement
    ■ Optional measurement range: 1 μ Ω~10G Ω
    ■ Optional temperature range: normal temperature~600 ℃
    ■ Can display 2D and 3D resistance distribution maps
    ■ Kelvin probe or probe card for standard TCR testing

    Contact SE

    HsinChu

       TEL：+886-3-579-9029

       FAX：+886-3-579-9030

       Mail：[email protected]

  • Micro and Nanoscale Probing & Measurements
    The next frontier in semiconductor, thin-film, LED, and photonics testing has arrived.
    The SAKYIWA NanoProber series delivers high-speed extraction of sheet resistance, 4-wire Kelvin resistance, and FET properties at the micro and nanoscale...

    • Micro and Nanoscale Probing Measurements

    High-Resolution Characterization. Minimal Footprint.

    The next frontier in semiconductor, thin-film, LED, and photonics testing has arrived.

    The SAKYIWA NanoProber series delivers high-speed extraction of sheet resistance, 4-wire Kelvin resistance, and FET properties at the micro and nanoscale—all at a fraction of the cost and footprint of conventional equipment.

    The SAKYIWA NanoProber is engineered for surgical accuracy, featuring a computer-controlled piezoelectric Z-stage and dual manual XY stages.

    This high-precision assembly, integrated with a high-resolution vision system, allows for real-time viewing of the probe tips and the Material-Under-Test (MUT).

    Contact SE

    HsinChu

       TEL：+886-3-579-9029

       FAX：+886-3-579-9030

       Mail：[email protected]

  • Reliability ESD Testing
    PurePulse ESD division will continue to be the leader in 2-pin testing of 300mm wafers.
    High Voltage Supply Voltage rang of 50 V to 8kV, (250 V to 16kV optional)
    ■ Chip/Packaging Testing
    ■ Positive/Negative Pulses
    ■ HBM/TLP/UF-TLP/VF-TLP/HMM/MM...

    • Reliability ESD Testing

    Automated 2-Pin ESD & TLP 

    High Voltage Supply  Voltage rang of 50 V to 8kV, (250 V to 16kV optional)

    ■  Chip/Packaging Testing
    ■  Positive/Negative Pulses
    ■  HBM/TLP/UF-TLP/VF-TLP/HMM/MM
    ■  Automated to test thousands of pins
    ■  Programmable Testing Point

    Contact SE

    HsinChu

       TEL：+886-3-579-9029

       FAX：+886-3-579-9030

       Mail：[email protected]

  • Signal/Power Integrity Probing
    Signal/Power Integrity Probing
    ■ PCB/Various Circuit Boards
    ■ Chip, Packaging
    ■ High Speed Connector
    ■ GS/SG/GSG/GSSG/....
    ■ 16GHz/18GHz/20GHz/30GHz/40GHz/65GHz/.......THz
    ■ Single Ended Probe, Dual Probe, Differential Probe...

    • The Industry's leading Signal Integrity Company.
    Serving the Electronics Industry with Engineering Excellence.
    Signal/Power Integrity Probing

    Large, medium, and small test boards,
    Measurement on testing fixtures, connectors, and device packaging

    --------------------------------------------------------------------------------------

    ■ High speed connectors, transmission lines
    ■ Various types of circuit boards
         -Flat, upright, motherboard, daughter board, mother and child board
         - 2D, 3D, 3D board, orthogonal board
    ■ Chip Packaging - Inverted Chip, BGA Packaging
    ■ Multi sided and three-dimensional detection,
    ■ measuring 180 degree rotation from top to bottom

    Contact SE

    HsinChu

       TEL：+886-3-579-9029

       FAX：+886-3-579-9030

       Mail：[email protected]

  • Test Socket/Test Fixture Solution
    Wafer Level Chip Packaging Testing
    For BGA, PGA, LGA, QFN, LCC, QFP, TSSOP,PQFP, Flat Pack, and WLCSP
    ■ Ultra-fine Pitch: as low as 0.3mm
    ■ Temperature Range: -45°C ~ +140°C,
    ■ Device Pin Count: over 3700 pins
    ■ Universal Array IC Test Fixture...

    • Wafer Level Chip Packaging Testing
    For BGA, PGA, LGA, QFN, LCC, QFP, TSSOP,PQFP, Flat Pack, and WLCSP     

    ■ Ultra-fine Pitch: as low as 0.3mm

    ■ Temperature Range: -45°C ~ +140°C

    ■ Device Pin Count: over 3700 pins

    ■ Universal Array IC Test Fixture

    ■ Applicable for: Bare Die, Flip Chip, Lead Frame, Multi-Chip Module (MCM), MEMS Devices...

    Whether you require standard models or fully customized solutions, please feel free to contact us for inquiries via phone or mail.

    Contact SE

    HsinChu

       TEL：+886-3-579-9029

       FAX：+886-3-579-9030

       Mail：[email protected]

Categories

200 Equipment, Assembly
  • Package Handling; Conveying Equipment
  • Package Simulation; Characterization Equipment
    • 203 Equipment, Inspection & Measurement
  • CV (capacitance-to-voltage) Probe systems
  • Instruments; Bench Top Test
  • Microscopes: Optical Microscopes
  • Resistivity Measurement; 4 point probe; Sheet resistance
    • 207 Equipment, Process
  • Wafer Identification; Marking Equipment
    • 208 Equipment, Test
  • Burn-In Systems
  • ESD; EMS and Latch-up Systems
  • Failure Analysis Systems
  • Functional Test Systems
  • Handlers; Positioner Systems
  • Logic Test Systems
  • Parametric Test Systems
  • Probing Equipment incl. Analytical; Circuit; Manual; E-Beam; Optical; Wafer Probers
  • Test Contactor Cleaning; Conditioning Systems
    • 309 Materials, Test
  • Probe Cards; DUT boards and other probing accessories (incl Ceramic and Special Purpose Probe Cards)
    • 402 PV Systems
  • Measurement and Control Technology
    • 601 Design Software
  • EDA - Electronic Design Automation; Circuit Design
    • 603 Simulation, Analysis; Modeling Software
  • Simulation; Characterization; Verification Software

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