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Manz

Chungli District,  Taoyuan City 
Taiwan
https://www.manz.com.tw/en/
  • Booth: M1248

Overview

About Manz Asia

Manz Asia delivers semiconductor equipment and solutions built on core technologies in wet chemistry, plating, inkjet printing, automation, and software integration. Our expertise covers advanced packaging (High-Density PLP / FOPLP) and IC substrate processing (glass and organic core), supporting customers from R&D to high-volume manufacturing. Through system solutions, contract manufacturing, and sales representation, we help customers accelerate time-to-market, boost yield, and stay competitive in the fast-evolving semiconductor industry.

  Press Releases

  • (Jun 28, 2026)
  • (Jun 28, 2026)

  Products

  • World’s First 310mm × 310mm Panel-Level Packaging
    The ECD system seamlessly integrates a full suite of wet chemical process modules, including cleaning, developing, etching, and stripping, and supports both spin and spray processing modes....

    • World's first 310mm × 310mm panel-level packaging (PLP) Electrochemical Deposition (ECD) production system delivered to customer line
    • Omni series covering 310mm, 510mm, and 700mm platforms, enabling a broad range of panel-level manufacturing applications.
    • Supports FOPLP, CoPoS, and TGV applications for AI, HPC, and advanced memory markets

Categories

200 Equipment, Assembly
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Plating; Electro Chemical Plating for device assembly
    • 207 Equipment, Process
  • Cleaning; Washing; Drying Equipment for Substrate, Fab Processing
  • Coat; Develop; Resist Processing; Track Equipment
  • Etching; Stripping; Ashing - Dry and Wet Equipment
  • Plating; Electro Chemical Plating; Deposition Systems
    • 301 Materials, Chemicals & Solids
  • Cleaning Chemicals; Solvents; Strippers
  • Photo Resist; Developers & Ancillaries (incl. Adhesion promoter (HMDS); Primer; Anti-Reflective Coat
    • 302 Materials, FPD
  • Glass Plates for FPD
    • 701 Manufacturing Services or Consulting
  • Package Materials; Interconnect; Subcomponent; Subassembly Design Services
    • 900 Support Products
  • Device; Wafer; Display Panel Handling Products

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