Shenzhen SinceVision Technology.co., Ltd.

Product Overview

SinceVision 3D Laser Profile is a high-precision non-contact 3D measurement sensor developed based on the laser triangulation principle. By projecting a laser line onto the surface of the target object, the sensor captures three-dimensional coordinate information of the surface and generates 3D point cloud data, enabling precise measurement of features such as height, profile, flatness, step height, and surface defects.

Compared with traditional contact measurement methods, the 3D Laser Profile offers advantages including non-contact measurement, high accuracy, high speed, and excellent stability, meeting the requirements of semiconductor manufacturing and packaging processes for micron-level dimensional inspection and quality control.

Key Advantages

SinceVision 3D Laser Profile provides up to 6400-pixel resolution, enabling accurate detection of microscopic structural variations. With a maximum 67 kHz sampling rate, it meets the requirements of high-speed inline inspection on production lines.

The sensor features an IP67 protection rating, making it suitable for demanding industrial environments. Its high-flex cable supports up to 30 million bending cycles, ensuring long-term operational reliability.

The product supports multiple communication interfaces, reduces installation space by 50%, and enables easy integration into semiconductor equipment and automated inspection systems.

Semiconductor Applications

● BGA Package Measurement：Measures solder ball height, coplanarity, and flatness to ensure soldering reliability.

● LGA Package Measurement：Enables precise measurement of lead height and coplanarity to prevent poor electrical contact.

● Chip Flatness Measurement：Analyzes surface height variations of chips to improve packaging assembly accuracy.

● Wafer Warpage Measurement：Captures 3D wafer topography and analyzes deformation caused by manufacturing processes.

● Chip Appearance Defect Detection：Identifies surface dents, foreign particles, and structural defects.

Typical Application Case : BGA Solder Ball Height and Coplanarity Measurement

Customer Requirements：With the continuous miniaturization of semiconductor packages, requirements for BGA solder ball height consistency and coplanarity have become increasingly strict. Traditional inspection methods are unable to meet the demand for high-precision measurement.

Solution：By adopting SinceVision 3D Laser Profile Sensor, high-speed acquisition of BGA package 3D profile data is achieved. Through plane fitting algorithms, the system analyzes substrate flatness, solder ball height, and solder ball top coplanarity.

Inspection Performance：

• Dynamic repeatability: ≤0.020 mm

• Z-axis repeatability: 0.2 μm

• Maximum scanning rate: 67 kHz

Application Benefits：Enhances semiconductor packaging quality control capability, improves production stability, and increases product yield.

Product Overview

SinceVision Laser Displacement Sensor is a non-contact measurement product developed based on the laser triangulation principle. Based on laser triangulation reflection technology, it can accurately measure geometric parameters such as displacement, thickness, and vibration without physical contact.

As a universal measurement tool for industrial applications, it helps ensure product quality control and maintains stable operation even in complex environments. It is specifically designed for industrial inspection and automation control, enabling micron-level precision distance measurement, deformation analysis, and positioning.

Key Advantages

The Laser Displacement Sensor features 2 μm ultra-high accuracy, ±0.1% F.S. linearity accuracy, and IP67 protection rating. Equipped with standard glass lenses across the entire series, rich communication options, and a high-flex shielded cable, it supports high-precision displacement measurement and reliable operation in humid, dusty environments with drag chain installation capability.

Applications

● Robot Displacement Deviation Measurement：Analyzes robot movement position deviation and positioning errors to ensure equipment accuracy and production stability.

● Exposure Machine Lens Height Guidance：Precisely measures lens height variations to achieve equipment position calibration and process accuracy control.

Typical Application Case : Robot Displacement Deviation Analysis

Customer Requirements：In semiconductor equipment, robots are required to perform high-precision handling and positioning within limited spaces. Even minor position deviations may affect wafer and chip handling accuracy as well as equipment operational stability.

Traditional inspection methods are difficult to achieve real-time and high-precision position monitoring, making them unable to meet the requirements of precision control in automated equipment.

Solution：By adopting SinceVision Laser Displacement Sensor, real-time acquisition of XYZ three-axis position data of the robot is achieved. The system analyzes displacement deviation and positioning errors during movement, enabling inline monitoring of robot motion accuracy.

Inspection Performance：

• Displacement measurement error: ≤0.01 mm

• Real-time acquisition of robot XYZ position data

• Compact design with minimum dimensions of 44 × 20 × 25 mm

Application Benefits：Enables high-precision robot positioning monitoring, improves semiconductor equipment stability, reduces process risks caused by positioning deviations, and enhances the reliability of automated production lines.

Product Introduction

SinceVision Spectral Confocal Displacement Sensor adopts non-contact measurement and achieves sub-micron to micron-level accuracy through spectral confocal technology. It is compatible with complex materials such as transparent, highly reflective, and rough surfaces, and is widely used in industrial automation and precision manufacturing applications. Its performance is comparable to high-end international equipment.

Key Advantages

The Spectral Confocal Displacement Sensor features a maximum 33 kHz sampling rate, ±60° maximum return light angle, ±0.2 μm linearity accuracy, and 5.8 μm minimum spot diameter. Equipped with three encoder channels and a high-flex armored cable, it enables high-precision non-contact displacement measurement and improves inspection capability for complex curved surfaces, transparent materials, and micro-structured components.

Applications

● Wafer Flatness Measurement：Accurately acquires 3D surface profile data of wafers, analyzes flatness and warpage variations, and improves wafer process stability.

● Wafer Thickness Measurement：Precisely measures wafer thickness and thickness variations to achieve process quality monitoring and improve product consistency.

● Package Dispensing / Ultra-micro Solder Dispensing Guidance：Measures dispensing height and position deviation in real time, providing precise process guidance to improve packaging yield and production stability.

Typical Application: Wafer Thickness Inspection

Customer Requirements：As the fundamental substrate of semiconductor chips, wafer thickness control directly affects chip performance, reliability, and final product yield. Accurate wafer thickness measurement ensures process stability and consistency during chip manufacturing, thereby improving overall product quality.

Solution：A SinceVision Spectral Confocal Displacement Sensor with an upper and lower dual-head measurement configuration is adopted. Two points on the wafer surface are selected for measurement, and wafer thickness is calculated accordingly. The non-contact measurement method avoids product damage and is suitable for inline inspection during wafer manufacturing processes.

Inspection Performance：

• Thickness measurement accuracy up to 1 μm, enabling high-precision measurement

• Temperature drift <0.015% F.S./℃, improving measurement stability

• Sensor heads generate no heat, and opposite-side measurement achieves zero deviation

Application Benefits：Improves automation level and production efficiency in semiconductor manufacturing, while reducing production costs and material waste.

Product Overview

SinceVision Through-Beam Edge Measurement Sensor is a fully featured sensor developed for industrial automation applications. Adopting a through-beam structure, it can rapidly capture subtle changes in object edges and width, enabling stable measurement of complex materials such as transparent and highly reflective materials.

The product features high-speed response and strong anti-interference capability, enabling real-time detection of material edge position changes. Supporting multiple industrial communication protocols, it can be seamlessly integrated into automated production lines to ensure production accuracy and quality.

Key Advantages

SE1 High-Precision Series

The SE1 high-precision series features a 10 mm measurement range, 5 μm repeatability, ±0.4% (±40 μm) linearity, and a maximum 4 kHz sampling rate.

With a 300 mm working distance and IP67 protection rating, it maintains stable measurement performance in complex environments such as humidity and dust, meeting high-precision displacement inspection requirements.

SE2 Large Measurement Range Series

The SE2 large measurement range series supports a 24 mm measurement range, 50 μm repeatability, ±0.4% (±40 μm) linearity, and a maximum 2 kHz sampling rate.

Featuring a 200 mm working distance, Class A EMC anti-interference capability, and IP67 protection rating, it provides a stable and reliable solution for large-range displacement measurement.

Applications

● Wafer Center Concentricity and Notch Positioning：Precisely detects wafer edge position and offset to achieve high-precision positioning for wafer handling and process equipment.

● Extrusion Material Outer Diameter Inspection：Measures material outer diameter and shape variations at high speed to ensure extrusion process stability and product consistency.

● Workpiece Position Detection：Obtains workpiece position information in real time to achieve precise equipment positioning and automated process control.

Typical Application: Wafer Center Concentricity and Notch Positioning

Customer Requirements：In semiconductor manufacturing processes, high-precision wafer edge alignment is critical. Wafer alignment calibration involves measurement of concentricity, angular deviation, and notch position. Even minor deviations in these parameters may significantly affect subsequent processes such as lithography and etching, thereby impacting chip performance and reliability.

Solution：The SinceVision SE1 series through-beam edge measurement sensor is adopted to acquire wafer edge position information in real time through optical inspection technology.

Inspection Performance：

• Center deviation: ≤ ±0.05 mm

• Angular deviation: ≤ ±0.1°

• Supports stable detection of semi-transparent materials

Application Benefits：Improves wafer positioning accuracy, ensures process stability in subsequent manufacturing steps, and enhances the reliability of automated semiconductor equipment operation.