The intelligent production lines for ultra-thin wafer dicing blades at Nantong Weiteng Semiconductor Technology Co., Ltd. have reached full-capacity operation, fully releasing the production capacity of high-end precision dicing blades. The company’s annual output is expected to exceed 1 million pieces. It can steadily supply high-precision and ultra-thin wafer cutting consumables in bulk, fully meeting the rapidly growing market demand of domestic advanced packaging industry, and helping downstream chip production improve quality, boost efficiency and cut costs.
Driven by the rapid development of end industries including 5G, new energy vehicles, artificial intelligence and the Internet of Things, the global advanced semiconductor packaging market keeps expanding. Market demand for ultra-thin chips and miniature semiconductor devices is on a steady rise. The industry has raised higher requirements for the quality, production capacity and delivery efficiency of high-precision ultra-thin wafer dicing blades, urging upstream precision consumable manufacturers to accelerate technological iteration and capacity expansion.
Leveraging independently developed core technologies and intelligent manufacturing systems, the company has comprehensively upgraded its production lines for ultra-thin wafer dicing blades. The entire process, from precision proportioning of raw materials, ultra-precision forming and high-temperature curing to precision inspection, is fully automated. The production lines can mass-produce high-end dicing blades dedicated to ultra-thin wafers with an ultra-narrow dicing street of 28μm. The products have passed rigorous tests on thickness uniformity, cutting flatness and wear resistance. They are well suited for high-end scenarios such as 12-inch wafer mass production, precision cutting of ultra-thin chips and cutting of special silicon carbide materials, effectively reducing chipping, cracking and material loss during wafer dicing, and helping downstream customers raise product yield and lower production costs.
Compared with traditional production modes, the new intelligent lines greatly enhance product consistency and delivery efficiency. They support standardized bulk supply and flexible production of customized products, enabling quick responses to personalized cutting demands from diverse customers, processes and application scenarios. Thanks to reliable product performance and high-quality delivery services, the company’s ultra-thin wafer dicing blades are now adopted by numerous semiconductor packaging and chip manufacturers, and widely used in consumer electronics, new energy, industrial control, automotive electronics and other fields, earning an increasingly solid market reputation.
Going forward, Nantong Weiteng Semiconductor Technology Co., Ltd. will further expand production capacity, optimize manufacturing processes and elevate quality control standards. The company will keep refining its high-end ultra-thin wafer dicing blades, and support downstream semiconductor enterprises to expand production and improve efficiency with stable output, premium products and professional technical services, so as to facilitate the large-scale and high-quality development of domestic advanced packaging industry.