JIANGSU XINTIANYU TECHNOLOGY CO.,LTD.

Dummy Wafer is blank polished silicon wafer matching the size and thermal expansion of production wafers. Widely used for chamber conditioning, equipment calibration and production wafer protection in etching, deposition & oxidation processes. Available in 6/8/12 inch with ultra-low TTV/BOW warpage ≤25μm. Custom surface treatment and packaging supported for fabs, labs and semiconductor equipment manufacturers. 中文：工艺挡片是经过抛光的空白硅晶圆，尺寸与热膨胀系数均和量产晶圆完全匹配，广泛应用于刻蚀、薄膜沉积、氧化工艺流程中，用于腔体环境预处理、设备校准以及保护量产晶圆。产品覆盖 6/8/12 英寸规格，总厚度偏差、弯曲度、翘曲度均控制在 25 微米以内，可定制表面处理工艺与包装方案，适用于晶圆工厂、实验室及半导体设备厂商。

Oxide Wafer consists of silicon substrate with thermally grown uniform SiO₂ layer. Custom oxide thickness from 1000Å to 1.5μm available for MEMS, CMOS, thin film & lithography R&D. Ultra-flat silicon base with warpage ≤25μm ensures stable insulation and high-precision process performance. Widely adopted as substrate and test wafer for semiconductor fabs and research institutes.
中文：氧化硅片以硅片为基底，表面生长均匀致密的二氧化硅氧化层，氧化层厚度可在 1000 埃至 1.5 微米区间按需定制，适用于微机电系统、CMOS 芯片、薄膜工艺与光刻研发场景。基底硅片平整度极高，翘曲度控制在 25 微米以内，保障稳定绝缘性能与高精度工艺表现，大量应用于半导体工厂及科研机构，既可作为生产基底，也可充当工艺测试晶圆。