Maxwell Technologies focuses on semiconductor universal cutting and 2.5D/3D advanced packaging, providing integrated solutions for packaging processes. The Company has not only taken the lead in realizing the localization of equipment such as semiconductor wafer laser grooving, laser stealth cutting, blade wheel cutting, and grinding, successfully developed a variety of wafer bonding equipment, but also independently developed core components such as spindles and ultra-precision lifting tables, as well as main consumables such as grinding wheels and blade wheels, thus 2 consolidating the safety and stability of the industrial chain.