X-eye NF120 – Auto X-ray Inspection System
■ Key Features
- 100% defect detection, under 2% underkill & overkill
- High-speed 2D In-line X-ray inspection for Wafer
- EFEM-equipped full auto inspection
- Oblique CT inspection capability
■ Inspection Items
- TSV, Micro Bump, Solder Bump: Void, Short, Bridge, Big ball, Missing - Bump Via: Via Distance, Extra Via
- WLP (Fan-In / Fan-Out), Cu Pillar Bump (Non-wet)
■ Specifications
- X-Ray Tube: Open Tube, Max 120kV / 200uA / 24W
- Focal Spot Size: Min. 200nm
- Detector: 12" FPXD, 9M resolution, 14bit grayscale
- Table Size: 300×300mm / T-axis: 70° / R-axis: 360°
- Max Sample Weight: 5kg
- Footprint: 2,380×1,910×2,580mm
■ Service & Support
- Minimize downtime with core parts (Tube, Detector) in stock
- 40 global partners worldwide
- Reduced maintenance cost via proprietary X-ray Tube technology