Singapore — Mindox Techno, a global provider of custom-engineered semiconductor manufacturing solutions, continues to strengthen its international presence while advancing next-generation technologies focused on automation, efficiency, and sustainable manufacturing.
Headquartered in Singapore, Mindox Techno operates across key semiconductor markets in Asia, including Sri Lanka, Malaysia, Taiwan, and the Philippines, as well as North America. The company delivers integrated platform systems and advanced process equipment that support both front-end and back-end semiconductor manufacturing operations worldwide.
As part of its commitment to Industry 4.0 innovation, Mindox Techno integrates Artificial Intelligence (AI) and Machine Learning technologies into its manufacturing solutions to enhance predictive process control, yield optimization, and productivity improvements.
Advanced Packaging Equipment Solutions
Mindox Techno’s advanced packaging equipment portfolio includes the Newtrox 3C, a fully automated single and batch coating, curing, and cleaning system equipped with SECS/GEM connectivity. Designed to support wafers, frames, and panels, the Newtrox 3C delivers high productivity and throughput while maintaining a compact footprint. The system also helps manufacturers reduce operational costs and energy consumption, making it well-suited for modern semiconductor manufacturing environments.
Complementing this solution is Eco-Mask, an advanced coating mask technology engineered for a wide range of semiconductor applications. Eco-Mask offers excellent plasma and thermal resistance, with thickness capabilities ranging from micron to millimeter levels. The solution can be fully customized to accommodate different viscosity requirements and provides excellent adhesion across various material surfaces. In addition, Eco-Mask is water-soluble and can be easily removed using a DI water rinse, supporting both spray and spin coating processes.
Mindox Techno also offers ShieldOx, a copper passivation coating solution developed to protect against copper corrosion while enhancing durability in harsh operating environments. The inhibitor coating improves copper reliability, structural integrity, and bonding performance in advanced semiconductor devices. Through automated coating capabilities and precise passivation control, ShieldOx helps extend the lifespan of wire-bonded devices and supports long-term device reliability.
Another key solution in the company’s portfolio is Luminox, a vertical vacuum reflow oven featuring a fully automated and integrated module capable of achieving vibration-free and void-free solder reflow processing within a single chamber. The system supports low-temperature reflow processing under both vacuum and atmospheric conditions while maintaining a compact, space-saving design. Its flexible architecture also allows seamless integration into a variety of production modules and manufacturing lines.
Platform Solutions
Mindox Techno’s platform solutions are designed to enhance manufacturing efficiency while reducing energy consumption, enabling semiconductor manufacturers to scale operations sustainably without compromising performance. The company’s wafer, frame, and panel load port systems support substrates ranging from 100 mm to 300 mm wafers and provide a single adaptable platform capable of handling multiple applications. By reducing the need for multiple setups, the system helps streamline operations and improve overall manufacturing efficiency.
Designed for high throughput and low particle generation, the SEMI-compliant standardized platform offers a low cost of ownership while enabling seamless integration into existing manufacturing lines. Advanced wafer mapping capabilities ensure precise substrate handling throughout complex production processes, and customizable configurations allow the platform to adapt to specific operational requirements.
Mindox Techno’s standard and customized EFEM (Equipment Front End Module) solutions are engineered to optimize substrate handling and process flow, helping manufacturers improve throughput and reduce operational complexity. The modular platform supports flexible configurations tailored to various production environments while complying with cleanroom ISO standards. It provides reliable wafer handling for substrates ranging from 100 mm to 300 mm, as well as panel handling capabilities from 300 x 300 mm to 600 x 600 mm. Integrated software solutions support GEM300 and the latest factory automation standards while maintaining cost-efficient implementation options.
The company also offers advanced Vacuum Transfer Modules (VTM), which play a critical role in semiconductor manufacturing and scientific applications that require controlled vacuum environments. These systems enable secure and contamination-free material
Driving Smarter and More Sustainable Manufacturing
From concept to execution, Mindox Techno focuses on building systems that work faster, smarter, and cleaner. The company continues to invest in advanced automation, intelligent process control, and sustainable engineering solutions that help semiconductor manufacturers meet the growing demands of the global electronics industry.
About Mindox Techno
Mindox Techno is a global supplier of custom-engineered semiconductor manufacturing solutions serving both front-end and back-end semiconductor processes. The company provides integrated automation platforms, advanced process equipment, AI-driven predictive control technologies, and scalable manufacturing systems designed to improve productivity, precision, and sustainability across semiconductor operations worldwide.
For more information, visit www.mindoxtechno.com.