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中勤實業股份有限公司

龜山區,  桃園市 
Taiwan
http://www.ckplas.com
  • Booth: I2726

中勤實業 將參加 SEMICON Taiwan（展位 I2726）。

Overview

CKplas 是全球唯一跨越四大主要產業提供自動化運輸搬運設備的供應商：半導體、LED、TFT-LCD 及太陽能。憑藉在為高科技產品（如貴金屬、光罩、掩模、晶圓及玻璃）提供最佳儲存、保護及運輸方案方面的豐富經驗，CKplas 能夠充分滿足全球 AI 浪潮及半導體製程進步所帶來的不斷變化的需求。該公司在提供先進封裝解決方案方面引領業界，包括 2.5D、3D、CoWoS 及 FOPLP 自動運輸搬運設備及裝備。CKplas 能迅速適應市場變化，提供頂尖的產品設計與開發能力。此外，公司致力於整合更廣泛的半導體供應鏈，提供自動化設備整合、Class 1 晶圓清洗服務、微污染防護及離子污染檢測等服務。

  Press Releases

  • (Aug 25, 2026)
  • (Aug 25, 2026)

  Products

  • Wafer Cassette 200mm(8 inch)
    晶圓盒 200mm（8 吋）...

    • Products Specifications

    ● Product name：8" PEEK Cassette
    ● Part number：PK-C200
    ● Dimension：233.2(L) x 201.5(W) x 221.4(H)mm
    ● Weight：910g
    ● Capacity：25 PCS
    ● Apply for round wafer：8 inch (Ø200mm)
    ● Material：PEEK ESD
    ● Slot pitch：6.35mm

    Products Description

    ● High hardness, not easy to distort, high temperature resistant
    ● Use to transfer inside factory
    ● Able to go with airtight Storage Box to protect wafer
    ● Able to do laser engraving、Able to install RFID. Keep the track of carrier and material.

    Also available in a wide range of materials, including PP, PC, PEI, PFA, and metal options, to meet diverse semiconductor process requirements.

    產品規格

    • 產品名稱：8吋 PEEK  Cassette
    • 零件編號：PK-C200
    • 尺寸：233.2（長）x 201.5（寬）x 221.4（高）毫米
    • 重量：910克
    • 容量：25 PCS
    • 圓形晶圓：8英吋（Ø200mm）
    • 材質：PEEK ESD
    • 槽距：6.35mm

    產品說明

    • 高硬度、不易變形、耐高溫
    • 用於工廠 內部轉移
    • 可搭配密封儲存盒保護晶圓
    • 能進行雷射雕刻、能安裝RFID。追蹤載體與材料。

    同時提供多種材料，包括 PP、PC、PEI、PFA 及金屬選項，以滿足多元半導體製程需求。

  • Wafer Shipping Box 200mm(8 inch)
    晶圓運送盒 200mm（8 吋）...

    • Products Specifications

    ● Product name：8" Wafer Shipping Box
    ● Part number：SH-B200
    ● Dimension：258.6(L) x 263.8(W) x 263.5(H)mm
    ● Weight：1600g
    ● Capacity：25 PCS
    ● Apply for round wafer：8 inch (Ø200mm)
    ● Material：PP
    ● Slot pitch：6.35mm

    Products Description

    Wafer Shipping Box has and bottomupper lid lid, use to deliver blank wafer from ingot to wafer factory, avoid wafer collision and contamination, not able to enter process. Stackable, dispatch after cleanliness.

    產品規格

    ● 產品名稱：8吋晶圓運送箱
    ● 零件編號：SH-B200
    ● 尺寸：258.6（長）x 263.8（寬）x 263.5（高）毫米
    ● 重量：1600克
    ● 容量：25 PCS
    ● 適用於圓形晶圓：8英吋（Ø200mm）
    ● 材料：PP
    +縫隙間距：6.35mm

    產品說明

    晶圓運輸箱設有下蓋，用於將空白晶圓從錠片運送至晶圓工廠，避免晶圓碰撞與污染，無法進入製程。可堆疊，清潔後發貨。

  • Film Frame FOUP (Dicing) / Tape Frame FOUP Plus
    底片框架FOUP（切割）/磁帶框架FOUP Plus...

    • Products Specifications
    ● Product name：Frame FOUP Plus
    ● Part number：CKF300 Plus
    ● Dimension：387.0(L) x 392.0(W) x 196(H)mm
    ● Capacity：13 PCS
    ● Apply for round wafer：12 inch (Ø300mm) Wafer
    ● Material：PC ESD

    Products Description
    Film Frame FOUP (Dicing) / Tape Frame FOUP Plus in semi-conductor assembling process, it's used to load and fix metal frame with wafer. Anti-static material, lightweight, airtight design are to isolate and protect wafer, which is used to transfer, store and protect assembling wafer for each process.

    ● Airtight, Anti-static, Light weighted.
    ● Original equipment applicable, and AMHS applicable. E-rack automated storage.
    ● Top Flange high-strength materials, and anti-shock and wear resistance.

    產品規格
    ● 產品名稱：Frame FOUP Plus
    ● 零件編號：CKF300 Plus
    ● 尺寸：387.0（長）x 392.0（寬）x 196（H）毫米
    ● 容量：13 PCS
    ● 適用於圓形晶圓：12英吋（Ø300mm）晶圓
    ● 材料：PC ESD

    產品說明
    薄膜框架FOUP（切割）/膠帶框架FOUP Plus在半導體組裝過程中，用於裝載及固定金屬框架與晶圓。防靜電材料、輕量且氣密的設計用於隔離與保護晶圓，用於轉移、儲存及保護各製程組裝晶圓。

    ● 密封、防靜電、輕量化。
    ● 原廠設備適用，AMHS 適用。E-rack 自動儲存。
    ● 頂層法蘭高強度材料，抗震與耐磨。

  • FOUP CK300 25slot / 13slot (300mm / 12 inch)
    FOUP CK300 25插槽 / 13插槽（300mm / 12 吋）...

    • Products Specifications

    ● Product name：CK300 FOUP
    ● Dimension：415(L) x 335(W) x 337(H)mm
    ● Capacity：25 PCS / 13PCS
    ● Apply for round wafer：300mm(12 inch)Wafer
    ● Material：Customized
    ● Slot pitch：10 mm / 20mm

    Products Description

    300mm FOUP, Able to protect, deliver and store 300mm wafer, provide safe protection during delivery and storage. Reduce particle contamination of wafer, protect wafer from static electricity damage and then increase yield rate. 25 slots type uses for general wafer. 13 slots type can store glass carrier and Thin wafer.

    CKplas FOUP series of product line fully align with SEMI standard of automation interface, compatible with AMHS. Not only design for standard silicon wafer, but also for special thin wafer application, CK300 FOUP create mini-environment to protect valuable wafer for transfer and storage purpose.

    產品規格

    ● 產品名稱：CK300 FOUP
    ● 尺寸：415（長）x 335（寬）x 337（高）毫米
    ● 容量：25 PCS / 13 PCS
    ● 適用於圓形晶圓：300mm（12英吋）晶圓
    ● 材料：客製化
    ● 槽間距：10 mm / 20mm

    產品說明

    300mm FOUP，能保護、運送及儲存300mm晶圓，提供運送與儲存期間的安全防護。減少晶圓顆粒污染，保護晶圓免受靜電損害，並提升產率。25槽型用於一般晶圓。13槽型可儲存玻璃載體及薄晶圓。

    CKplas FOUP 系列產品線完全符合 SEMI 自動化介面標準，並兼容 AMHS。CK300 FOUP 不僅設計標準矽晶圓，也適用於特殊薄晶圓應用，打造迷你環境以保護珍貴晶圓以供轉移與儲存。

  • FoPLP FOUP / 面板 FOUP / FOUP 510x515
    FoPLP FOUP / Panel FOUP / Panel Level Packaging Panel FOUP 510x515
    ...

    • Products Specifications

    ● Product name：Panel FOUP / FoPLP FOUP 510x515
    ● Part number：GL-PF512
    ● Dimension：600(L) x 620(W) x 438(H)mm
    ● Weight：≒25000g
    ● Capacity：12 PCS
    ● Glass size：510 x 515mm，Thickness 0.4-3.2mm (Glass Panel or PCB)
    ● Material：Customized
    ● Slot pitch：25mm

    Products Description

    Panel FOUP can carry square glass , Glass Panel and PCB carrier board. Panel FOUP for FoPLP (Fan-out Panel Level Process) is used in panel- level fan-out packaging . Panel FOUP carries large-area and ultra-thin carriers. The large-size, multi-layer one-piece customized design significantly reduces process costs. Panel FOUP supports automated transmission (AMHS), import, mechanical opening, assisting the customized needs of emerging technologies and special processes, providing the best automation assistance for heterogeneous integration.

    Panel FOUP 510x515 / FoPLP FOUP Features

    ● One-piece molded design, high strength, thin and light, low resonance, achieving superior air-tight effect.
    ● Simplified parts, reduce parts loosening and avoid accumulation of dirt, ensure safe and reliable automatic operation.
    ● Antistatic, low dust generation and wear-resistant. Support is manufactured using a special CFRP construction method and has high load-bearing rigidity.
    ● Comply with SEMI standard (E181, E181.1~E181.4)
     

    產品規格

    ● 產品名稱：Panel FOUP / FoPLP FOUP 510x515
    ● 零件編號：GL-PF512
    ● 尺寸：600（長）x 620（寬）x 438（H）毫米
    ● 重量：≒25000克
    ● 容量：12 PCS
    ● 玻璃尺寸：510 x 515 毫米，厚度 0.4-3.2mm（玻璃面板或印刷板）
    ● 材料：客製化
    ● 槽間距：25mm

    產品說明

    面板FOUP可攜帶方形玻璃、玻璃面板及PCB承載板。FoPLP（扇出面板層級製程）的面板FOUP用於面板級扇出包裝。面板FOUP攜帶大面積及超薄載體。大型多層一體化設計大幅降低製程成本。面板FOUP支援自動傳輸（AMHS）、進口、機械開啟，協助新興技術與特殊製程的客製化需求，提供異質整合的最佳自動化協助。

    面板 FOUP 510x515 / FoPLP FOUP 功能

    ● 一體成型設計，高強度、薄且輕、低共振，實現卓越的氣密效果。
    ● 簡化零件，減少零件鬆動及避免污垢堆積，確保安全可靠的自動運作。
    ● 防靜電、低塵埃產生及耐磨性。支撐採用特殊CFRP結構製造，具備高承重剛性。
    ● 符合SEMI標準（E181， E181.1~E181.4）
     

  • Reticle SMIF Pod(RSP 150)-BKM7
    準星 SMIF 吊艙（RSP 150）-BKM7...

    • Products Specifications

    ● Product name：Reticle SMIF Pod(RSP 150)-BKM7
    ● Part number：RSP-BKM7
    ● Dimension：226.92(L) x 229.8(W) x 91.6(H)mm
    ● Weight：1340g
    ● Capacity：1 PCS
    ● Mask size：6025 Mask(6 inch)
    ● Material：PEEK

    Products Description

    Reticle SMIF Pod(RSP 150)-BKM7, Contamination proof, assure safety of 6” photomask during transfer and storage between station and station.

    準星 SMIF 吊艙（RSP 150）-BKM7

    產品規格

    ● 產品名稱：準星 SMIF Pod（RSP 150）-BKM7
    ● 零件編號：RSP-BKM7
    ● 尺寸：226.92（長）x 229.8（寬）x 91.6（高）毫米
    ● 重量：1340克
    ● 容量：1 PCS
    ● 遮罩尺寸：6025 遮罩（6 吋）
    ● 材質：PEEK

    產品說明

    準星 SMIF Pod（RSP 150）-BKM7，防污染，確保 6 吋光罩在站點間轉移與儲存時的安全。

產品種類

201 Equipment, Flat Panel Display
  • Panel Alignment; Cell Assembly Equipment
    • 206 Equipment, Photovoltaic
  • Cells processing (etching, annealing, sreen printing, groving, sputtering, sintering, sorting…)
  • Module processing (stringing, laminating, curing, inspection, test, …)
  • Thin Film processing (laser scribing, CVD, PVD,…)
  • Wafer processing (casting, wire saws, laser cutting, inspection, cleaning, …)
    • 207 Equipment, Process
  • Cleaning; Washing; Drying Equipment for Substrate, Fab Processing
  • Transfer Systems for Wafer; Reticles or FPD's
    • 501 HVAC, Temperature, Humidity, Contamination Control
  • HVAC; Temperature; Humidity Systems and Control
    • 502 Material Handling Systems
  • Conveying; Material Handling Systems
    • 701 Manufacturing Services or Consulting
  • Wafer Handling
    • 900 Support Products
  • Clean Room Supplies; Cleaning Supplies
  • Device; Wafer; Display Panel Handling Products

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